EP2S30F672C4N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 500 1369728 33880 672-BBGA |
|---|---|
| Quantity | 1,143 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 500 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1694 | Number of Logic Elements/Cells | 33880 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1369728 |
Overview of EP2S30F672C4N – Stratix® II Field Programmable Gate Array, 672-BBGA
The EP2S30F672C4N is a Stratix® II family FPGA in a 672‑BBGA package that provides a programmable logic platform for designs requiring substantial logic density, embedded memory, and flexible I/O. The device combines the Stratix II architectural elements documented in the device handbook with on‑chip resources suitable for complex digital, signal processing and I/O‑intensive functions.
Key device-level specifications include 33,880 logic elements, approximately 1.37 Mbits of embedded RAM, 500 I/O pins, a 672‑BBGA (27×27) supplier package, a core voltage range of 1.15–1.25 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is provided as a surface‑mount package.
Key Features
- Core Logic 33,880 logic elements provide substantial programmable fabric for complex combinational and sequential logic implementations.
- Embedded Memory Approximately 1.37 Mbits of on‑chip RAM for buffering, FIFOs and on‑chip data storage.
- I/O Density & Package 500 general‑purpose I/O pins in a 672‑BBGA package (supplier package 672‑FBGA, 27×27) supporting high pin‑count system designs.
- Supply & Mounting Core supply voltage between 1.15 V and 1.25 V; surface mount mounting type for standard PCB assembly.
- Commercial Temperature Range Rated for operation from 0 °C to 85 °C for commercial applications.
- Stratix II Architecture The device follows the Stratix II architecture described in the device handbook, including logic array blocks, adaptive logic modules, MultiTrack interconnect and TriMatrix memory organization.
- DSP & Clocking Resources Device family documentation details dedicated DSP blocks, enhanced and fast PLLs, and hierarchical clocking suitable for designs that require internal clock management and signal processing blocks.
- Advanced I/O & External Memory Support The handbook documents high‑speed differential I/O support, programmable drive strength, on‑chip termination and external RAM interfacing features for robust I/O implementations.
- Configuration, Debug & Test Family reference material describes IEEE‑1149.1 JTAG boundary scan, configuration modes, and SignalTap II embedded logic analyzer support for in‑system debug and testing.
- Manufacturing & Compliance RoHS compliant and shipped in a 672‑BBGA surface‑mount package to support standard assembly processes.
Typical Applications
- High‑performance DSP & Signal Processing On‑chip DSP blocks and dedicated clocking resources enable implementation of signal processing kernels and data‑path acceleration.
- Memory Interface & External RAM Controllers TriMatrix memory architecture and documented external RAM interfacing support memory controller and buffering functions.
- High‑speed I/O and Communication Interfaces Support for high‑speed differential I/O and programmable termination makes the device suitable for custom serial and parallel interface designs.
- Prototyping and Custom Logic Integration Dense logic element count and extensive I/O allow integration of glue logic, protocol bridging and prototype systems on a single FPGA.
Unique Advantages
- High Logic Density: 33,880 logic elements allow consolidation of complex logic functions into a single device, reducing BOM and board area.
- Significant On‑Chip Memory: Approximately 1.37 Mbits of embedded RAM supports local buffering and reduces dependence on external memory for mid‑sized data storage needs.
- Extensive I/O Count: 500 I/Os in a 672‑BBGA footprint enable rich peripheral connectivity and high pin‑count interfaces without multiplexing compromises.
- Comprehensive Architecture: Stratix II architectural elements such as DSP blocks, PLLs, MultiTrack interconnect and TriMatrix memory provide architectural building blocks described in the device handbook for system designers.
- Design Visibility & Testability: JTAG boundary‑scan and embedded logic analyzer capabilities described for the family facilitate in‑system debug and production test workflows.
- Regulatory & Assembly Readiness: RoHS compliance and a standard surface‑mount 672‑BBGA package simplify manufacturing and environmental compliance considerations.
Why Choose EP2S30F672C4N?
The EP2S30F672C4N provides a balanced combination of logic capacity, embedded memory and high I/O count within the Stratix II device family documented in the device handbook. Its architecture and documented feature set—DSP blocks, PLLs, advanced I/O and configuration/debug support—make it suitable for designs that require integrated signal processing, sophisticated clocking and dense connectivity in a single commercial‑grade FPGA.
Choose this part when you need a programmable platform that consolidates mid‑to‑high complexity logic, on‑chip RAM, and flexible I/O in a packaged solution that aligns with standard surface‑mount manufacturing and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability information for EP2S30F672C4N. Provide your quantity and required lead times to expedite a response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018