EP2S30F672C4N

IC FPGA 500 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 500 1369728 33880 672-BBGA

Quantity 1,143 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O500Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1694Number of Logic Elements/Cells33880
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1369728

Overview of EP2S30F672C4N – Stratix® II Field Programmable Gate Array, 672-BBGA

The EP2S30F672C4N is a Stratix® II family FPGA in a 672‑BBGA package that provides a programmable logic platform for designs requiring substantial logic density, embedded memory, and flexible I/O. The device combines the Stratix II architectural elements documented in the device handbook with on‑chip resources suitable for complex digital, signal processing and I/O‑intensive functions.

Key device-level specifications include 33,880 logic elements, approximately 1.37 Mbits of embedded RAM, 500 I/O pins, a 672‑BBGA (27×27) supplier package, a core voltage range of 1.15–1.25 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is provided as a surface‑mount package.

Key Features

  • Core Logic 33,880 logic elements provide substantial programmable fabric for complex combinational and sequential logic implementations.
  • Embedded Memory Approximately 1.37 Mbits of on‑chip RAM for buffering, FIFOs and on‑chip data storage.
  • I/O Density & Package 500 general‑purpose I/O pins in a 672‑BBGA package (supplier package 672‑FBGA, 27×27) supporting high pin‑count system designs.
  • Supply & Mounting Core supply voltage between 1.15 V and 1.25 V; surface mount mounting type for standard PCB assembly.
  • Commercial Temperature Range Rated for operation from 0 °C to 85 °C for commercial applications.
  • Stratix II Architecture The device follows the Stratix II architecture described in the device handbook, including logic array blocks, adaptive logic modules, MultiTrack interconnect and TriMatrix memory organization.
  • DSP & Clocking Resources Device family documentation details dedicated DSP blocks, enhanced and fast PLLs, and hierarchical clocking suitable for designs that require internal clock management and signal processing blocks.
  • Advanced I/O & External Memory Support The handbook documents high‑speed differential I/O support, programmable drive strength, on‑chip termination and external RAM interfacing features for robust I/O implementations.
  • Configuration, Debug & Test Family reference material describes IEEE‑1149.1 JTAG boundary scan, configuration modes, and SignalTap II embedded logic analyzer support for in‑system debug and testing.
  • Manufacturing & Compliance RoHS compliant and shipped in a 672‑BBGA surface‑mount package to support standard assembly processes.

Typical Applications

  • High‑performance DSP & Signal Processing On‑chip DSP blocks and dedicated clocking resources enable implementation of signal processing kernels and data‑path acceleration.
  • Memory Interface & External RAM Controllers TriMatrix memory architecture and documented external RAM interfacing support memory controller and buffering functions.
  • High‑speed I/O and Communication Interfaces Support for high‑speed differential I/O and programmable termination makes the device suitable for custom serial and parallel interface designs.
  • Prototyping and Custom Logic Integration Dense logic element count and extensive I/O allow integration of glue logic, protocol bridging and prototype systems on a single FPGA.

Unique Advantages

  • High Logic Density: 33,880 logic elements allow consolidation of complex logic functions into a single device, reducing BOM and board area.
  • Significant On‑Chip Memory: Approximately 1.37 Mbits of embedded RAM supports local buffering and reduces dependence on external memory for mid‑sized data storage needs.
  • Extensive I/O Count: 500 I/Os in a 672‑BBGA footprint enable rich peripheral connectivity and high pin‑count interfaces without multiplexing compromises.
  • Comprehensive Architecture: Stratix II architectural elements such as DSP blocks, PLLs, MultiTrack interconnect and TriMatrix memory provide architectural building blocks described in the device handbook for system designers.
  • Design Visibility & Testability: JTAG boundary‑scan and embedded logic analyzer capabilities described for the family facilitate in‑system debug and production test workflows.
  • Regulatory & Assembly Readiness: RoHS compliance and a standard surface‑mount 672‑BBGA package simplify manufacturing and environmental compliance considerations.

Why Choose EP2S30F672C4N?

The EP2S30F672C4N provides a balanced combination of logic capacity, embedded memory and high I/O count within the Stratix II device family documented in the device handbook. Its architecture and documented feature set—DSP blocks, PLLs, advanced I/O and configuration/debug support—make it suitable for designs that require integrated signal processing, sophisticated clocking and dense connectivity in a single commercial‑grade FPGA.

Choose this part when you need a programmable platform that consolidates mid‑to‑high complexity logic, on‑chip RAM, and flexible I/O in a packaged solution that aligns with standard surface‑mount manufacturing and RoHS compliance.

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