EP2S30F484I4N

The EP2S30F484I4N is a Stratix II family Field Programmable Gate Array from Intel, supplied in a 484-ball BGA package. It combines a substantial logic resource set with embedded memory and a large I/O count to address industrial embedded designs.

With 33,880 logic elements, approximately 1.37 Mbits of on-chip RAM, 342 I/O pins, and an industrial operating range from −40 °C to 100 °C, the device is suited for applications that require programmable logic, on-chip memory and flexible I/O in a compact surface-mount FBGA footprint. The device operates from a core supply of 1.15 V to 1.25 V and is RoHS compliant.

Key Features

• Core Logic 33,880 logic elements provide a large programmable fabric for complex control, glue logic, or custom processing functions.
• Embedded Memory Approximately 1.37 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capacity & Flexibility 342 I/O pins delivered in a high-density package to support broad external interfacing requirements; datasheet family content includes support for high-speed and double data rate I/O options.
• DSP & Timing Resources (Family-Level) Stratix II family documentation describes integrated digital signal processing blocks, multiple PLLs and a hierarchical clock network for precise timing and signal processing—capabilities available across the device family.
• Power Core supply voltage range of 1.15 V to 1.25 V to match platform power requirements and budgets.
• Package Supplied in a 484-ball BGA (484-BBGA) / supplier device package 484-FBGA (23 × 23), optimized for surface-mount assembly in space-constrained boards.
• Industrial Grade Rated for −40 °C to 100 °C operation, supporting deployment in industrial operating environments.
• Standards & Compliance RoHS compliant.

Typical Applications

• Industrial Control Use the EP2S30F484I4N for programmable control logic, state machines and I/O aggregation in industrial automation where industrial temperature range and programmable logic are required.
• Signal Processing Family-level DSP blocks and abundant logic and embedded memory make the device suitable for on-device filtering, protocol processing and intermediate signal-conditioning tasks.
• Communications & Interfaces High I/O count and documented high-speed I/O support enable protocol bridging, interface conversion and packet-handling roles in communications equipment.
• Embedded Prototyping & Evaluation The combination of logic density, embedded RAM and multiple clocking resources is appropriate for system prototyping and hardware validation tasks.

Unique Advantages

• Substantial Logic Capacity: 33,880 logic elements allow integration of complex digital functions on a single device, reducing board-level component count.
• On-Chip Memory: Approximately 1.37 Mbits of embedded RAM supports buffering, FIFOs and local data storage without external memory dependencies.
• High I/O Density: 342 I/O pins in a 484-ball package provide broad external connectivity for sensors, peripherals and high-pin-count interfaces.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and temperature-variable applications.
• Compact FBGA Package: The 484-FBGA (23 × 23) footprint balances pin count and board real estate for space-constrained designs.
• Manufacturer Backing: Provided by Intel and documented in the Stratix II device handbook, with family-level resources covering configuration, PLLs, I/O standards and testing.

Why Choose EP2S30F484I4N?

The EP2S30F484I4N positions itself as a robust programmable logic option within the Stratix II family, offering a combination of significant logic density, embedded memory and a large I/O complement in a compact 484-ball FBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for production systems that require reliable operation across a wide thermal range.

This device is well suited to engineers and system designers who need a versatile FPGA for industrial control, signal processing, communications interfacing or hardware prototyping where on-chip resources and flexible I/O are key determinants of design efficiency and board-level simplification.

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