EP2S30F484I4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 342 1369728 33880 484-BBGA |
|---|---|
| Quantity | 885 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 342 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1694 | Number of Logic Elements/Cells | 33880 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1369728 |
Overview of EP2S30F484I4 – Stratix® II Field Programmable Gate Array (FPGA) IC 342 1369728 33880 484-BBGA
The EP2S30F484I4 is an Intel Stratix II family FPGA in a 484-BBGA package. It provides a programmable logic fabric with a significant logic element count, embedded RAM, and a large I/O complement for complex digital designs.
Designed for applications that require on-chip memory, extensive I/O, and flexible clocking and DSP resources, this industrial-grade device targets embedded systems, signal processing functions, and systems requiring advanced I/O configuration and debugging support.
Key Features
- Programmable Logic Capacity — 1,694 LABs and 33,880 logic elements provide the programmable fabric for implementing custom logic, state machines, and data-paths.
- Embedded Memory — Approximately 1.37 Mbits of on-chip RAM (1,369,728 total RAM bits) for buffering, FIFOs, and on-chip storage.
- I/O & Interface Density — 342 I/O pins to support broad connectivity; datasheet coverage includes double data rate I/O, multi-volt I/O interfaces, and on-chip termination options.
- DSP & Clocking Resources — Device documentation details dedicated digital signal processing blocks and comprehensive PLLs and clock networks (enhanced and fast PLLs) for clock management and DSP interfacing.
- Configuration & Debug — Supports IEEE 1149.1 JTAG boundary-scan and SignalTap II embedded logic analysis for in-system testing and debug, with multiple configuration schemes described in the device handbook.
- Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23); surface-mount mounting type for board-level assembly.
- Power & Environmental — Core voltage supply range 1.15 V to 1.25 V; industrial operating temperature range from −40 °C to 100 °C. RoHS compliant.
Typical Applications
- Signal Processing — Use the dedicated DSP blocks and on-chip RAM for filtering, transforms, and other real-time data-path operations.
- High-Speed I/O Systems — Leverage the 342 I/O pins and documented DDR and differential I/O support for memory interfaces and high-bandwidth external links.
- Industrial Embedded Control — Industrial-grade temperature range and programmable logic density make this device suitable for control systems and embedded automation functions.
- In-System Debug & Prototyping — JTAG boundary-scan and SignalTap II capabilities aid in system bring-up, validation, and iterative hardware/software integration.
Unique Advantages
- Highly Integrated Logic & Memory: Combines 33,880 logic elements with approximately 1.37 Mbits of embedded RAM to reduce external component needs and simplify board design.
- Extensive I/O Capacity: 342 I/O pins offer broad connectivity options for complex systems and multi-interface designs.
- Advanced Clocking & DSP Support: Built-in PLLs and DSP block documentation support flexible clock architectures and signal-processing tasks without external clock-management chips.
- Industrial Operating Range: Rated for −40 °C to 100 °C and specified core supply range (1.15 V–1.25 V), enabling use in temperature-demanding environments.
- On-Board Test & Configuration Features: JTAG and SignalTap II support facilitate in-system testing, configuration, and debug workflows during development and production.
- Compact, Surface-Mount Package: 484-FBGA (23×23) package enables high-density PCB layouts while maintaining a robust mounting footprint.
Why Choose EP2S30F484I4?
The EP2S30F484I4 delivers a balanced combination of programmable logic density, embedded RAM, and comprehensive I/O in an industrial-grade Stratix II device. Its documented clocking, DSP, and I/O features support designs that require flexible timing architectures, on-chip data processing, and extensive external interfacing.
This FPGA is suitable for engineering teams building embedded systems, signal-processing modules, or I/O-intensive applications that benefit from integrated configuration and debug support, a compact FBGA package, and the industrial temperature range and voltage specifications provided in the device handbook.
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