EP2S30F484I4

IC FPGA 342 I/O 484FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 342 1369728 33880 484-BBGA

Quantity 885 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O342Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1694Number of Logic Elements/Cells33880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1369728

Overview of EP2S30F484I4 – Stratix® II Field Programmable Gate Array (FPGA) IC 342 1369728 33880 484-BBGA

The EP2S30F484I4 is an Intel Stratix II family FPGA in a 484-BBGA package. It provides a programmable logic fabric with a significant logic element count, embedded RAM, and a large I/O complement for complex digital designs.

Designed for applications that require on-chip memory, extensive I/O, and flexible clocking and DSP resources, this industrial-grade device targets embedded systems, signal processing functions, and systems requiring advanced I/O configuration and debugging support.

Key Features

  • Programmable Logic Capacity — 1,694 LABs and 33,880 logic elements provide the programmable fabric for implementing custom logic, state machines, and data-paths.
  • Embedded Memory — Approximately 1.37 Mbits of on-chip RAM (1,369,728 total RAM bits) for buffering, FIFOs, and on-chip storage.
  • I/O & Interface Density — 342 I/O pins to support broad connectivity; datasheet coverage includes double data rate I/O, multi-volt I/O interfaces, and on-chip termination options.
  • DSP & Clocking Resources — Device documentation details dedicated digital signal processing blocks and comprehensive PLLs and clock networks (enhanced and fast PLLs) for clock management and DSP interfacing.
  • Configuration & Debug — Supports IEEE 1149.1 JTAG boundary-scan and SignalTap II embedded logic analysis for in-system testing and debug, with multiple configuration schemes described in the device handbook.
  • Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23); surface-mount mounting type for board-level assembly.
  • Power & Environmental — Core voltage supply range 1.15 V to 1.25 V; industrial operating temperature range from −40 °C to 100 °C. RoHS compliant.

Typical Applications

  • Signal Processing — Use the dedicated DSP blocks and on-chip RAM for filtering, transforms, and other real-time data-path operations.
  • High-Speed I/O Systems — Leverage the 342 I/O pins and documented DDR and differential I/O support for memory interfaces and high-bandwidth external links.
  • Industrial Embedded Control — Industrial-grade temperature range and programmable logic density make this device suitable for control systems and embedded automation functions.
  • In-System Debug & Prototyping — JTAG boundary-scan and SignalTap II capabilities aid in system bring-up, validation, and iterative hardware/software integration.

Unique Advantages

  • Highly Integrated Logic & Memory: Combines 33,880 logic elements with approximately 1.37 Mbits of embedded RAM to reduce external component needs and simplify board design.
  • Extensive I/O Capacity: 342 I/O pins offer broad connectivity options for complex systems and multi-interface designs.
  • Advanced Clocking & DSP Support: Built-in PLLs and DSP block documentation support flexible clock architectures and signal-processing tasks without external clock-management chips.
  • Industrial Operating Range: Rated for −40 °C to 100 °C and specified core supply range (1.15 V–1.25 V), enabling use in temperature-demanding environments.
  • On-Board Test & Configuration Features: JTAG and SignalTap II support facilitate in-system testing, configuration, and debug workflows during development and production.
  • Compact, Surface-Mount Package: 484-FBGA (23×23) package enables high-density PCB layouts while maintaining a robust mounting footprint.

Why Choose EP2S30F484I4?

The EP2S30F484I4 delivers a balanced combination of programmable logic density, embedded RAM, and comprehensive I/O in an industrial-grade Stratix II device. Its documented clocking, DSP, and I/O features support designs that require flexible timing architectures, on-chip data processing, and extensive external interfacing.

This FPGA is suitable for engineering teams building embedded systems, signal-processing modules, or I/O-intensive applications that benefit from integrated configuration and debug support, a compact FBGA package, and the industrial temperature range and voltage specifications provided in the device handbook.

Request a quote or submit an inquiry to receive pricing and availability details for the EP2S30F484I4. Include your required quantity and any specific packaging or lead-time needs to get a prompt response.

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