EP2S30F484C5N

The EP2S30F484C5N is a Stratix® II Field Programmable Gate Array (FPGA) IC offering a programmable logic fabric and on-chip memory in a 484-BBGA package. It integrates a substantial logic capacity, abundant I/O, and Stratix II architecture elements—such as TriMatrix memory, DSP resources, and PLL/clock network features—exposed in the device handbook.

This commercial-grade, surface-mount device targets designs that require flexible programmable logic, significant embedded memory, and extensive I/O connectivity while operating within a 1.15–1.25 V core supply and a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity — 33,880 logic elements supported by the Stratix II architecture, providing a large programmable fabric for complex digital designs.
• Logic Array Blocks — 1,694 LABs documented for the device family, enabling structured placement of logic and routing resources.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM (1,369,728 total RAM bits) for data buffering, FIFOs, and on-chip storage.
• Rich I/O — 342 I/O pins to support wide external interfaces and dense connectivity requirements.
• Advanced Architecture Elements — Device handbook references TriMatrix memory, DSP blocks, and enhanced/fast PLLs and clock networks for on-chip timing and signal processing support.
• Power and Supply — Core voltage supply range of 1.15 V to 1.25 V to match system power design requirements.
• Package & Mounting — 484-BBGA package (supplier package 484-FBGA, 23 × 23) with surface-mount mounting type suited for board-level assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic integration — Implement complex custom logic and control functions using the device’s 33,880 logic elements and structured LAB resources.
• On-chip memory-dependent designs — Use approximately 1.37 Mbits of embedded RAM for data buffering, protocol FIFOs, and small on-device storage needs.
• I/O-intensive systems — Leverage 342 I/O pins for wide parallel interfaces, external device control, and multi-channel I/O requirements.
• Clocked signal processing — Use the Stratix II PLLs and clock network architecture described in the device handbook for synchronized, multi-clock designs.

Unique Advantages

• Substantial programmable resources — Large logic element count enables consolidation of multiple functions into a single FPGA, simplifying BOM and board complexity.
• Embedded memory for system-level buffering — Approximately 1.37 Mbits of on-chip RAM reduces reliance on external memory for intermediate storage and low-latency data paths.
• Extensive external connectivity — 342 I/O pins provide flexibility for parallel interfaces, diverse signaling standards, and multiple peripheral connections.
• Package options for compact designs — 484-BBGA (484-FBGA, 23 × 23) lets designers implement high-density solutions in surface-mount form factors.
• Documented architecture and resources — The Stratix II device handbook details memory architectures, DSP blocks, PLLs, and I/O behavior to support design planning and validation.
• Regulatory friendliness — RoHS compliance supports meet environmental requirements for electronic assemblies.

Why Choose EP2S30F484C5N?

The EP2S30F484C5N positions itself as a capable Stratix II FPGA solution for designs requiring significant logic capacity, embedded memory, and abundant I/O in a compact BGA package. With documented architecture elements such as TriMatrix memory, DSP resources, and extensive clocking options in the device handbook, engineers can map complex digital systems and multi-clock designs onto a single device.

This commercial-grade FPGA is suited to teams seeking a field-programmable platform with clear, datasheet-backed specifications for logic, memory, I/O count, power rails, and operating range—providing predictable integration into system designs and long-term support via the device documentation.

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