EP2S30F484C3N

The EP2S30F484C3N is a Stratix II family FPGA from Intel, offering a mid-range programmable fabric optimized for custom digital logic, I/O aggregation, and embedded memory usage. Built on the Stratix II architecture, the device provides a balanced combination of logic capacity, on-chip RAM, and I/O resources suitable for commercial embedded and system designs.

This FPGA targets applications that require flexible logic implementation combined with significant I/O and on-chip memory, delivering a platform for custom interfaces, signal processing blocks, and complex control logic within a compact 484-ball BGA package.

Key Features

• Core Logic — 33,880 logic elements organized across 1,694 LABs, providing scalable programmable logic resources for complex designs.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM (1,369,728 total RAM bits) to store state, buffers, and intermediate data without external memory for many use cases.
• I/O Capacity — 342 user I/O pins to support broad external connectivity and multi-channel interfacing requirements.
• Clocking & DSP Support — Stratix II family features such as PLLs, clock networks, and digital signal processing blocks are included in the device architecture, enabling complex timing topologies and dedicated signal-processing implementations.
• Configuration & Debug — Architecture-level support for configuration and embedded logic analysis, including JTAG boundary-scan and the SignalTap II embedded logic analyzer as documented for the Stratix II family.
• Package & Mounting — 484-ball BBGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Power Supply — Core voltage supply range of 1.15 V to 1.25 V for device operation.
• Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS-compliant construction.

Typical Applications

• Custom digital signal processing — Use on-chip DSP blocks and embedded RAM to implement filters, transforms, and other signal-processing pipelines.
• High-speed interface bridging — Leverage the device I/O count and Stratix II I/O features for protocol conversion and multi-channel interface aggregation.
• Embedded system control — Implement control logic, state machines, and glue logic for complex embedded platforms without excessive external components.
• Memory interfacing and buffering — Combine on-chip RAM and external memory interface support from the Stratix II architecture to create efficient buffering and data staging solutions.

Unique Advantages

• Balanced logic and memory — 33,880 logic elements and approximately 1.37 Mbits of embedded RAM offer a practical mix for mid-range FPGA designs that need both compute and storage on-chip.
• High I/O availability — 342 I/O pins simplify board-level connectivity and reduce the need for external multiplexing or I/O expanders.
• Comprehensive Stratix II feature set — Integrated PLLs, clock networks, DSP blocks, and I/O features from the Stratix II family provide architectural building blocks for advanced designs.
• Compact BGA packaging — 484-ball FBGA footprint (23×23) enables dense PCB layouts while maintaining extensive I/O and logic capacity.
• Commercial-grade reliability — Designed for operation across a commercial temperature range (0 °C to 85 °C) with RoHS compliance for regulatory considerations.

Why Choose EP2S30F484C3N?

The EP2S30F484C3N positions itself as a flexible, mid-range Stratix II FPGA option that combines substantial programmable logic, meaningful on-chip RAM, and a high I/O count in a compact BGA package. It is well suited for engineers building custom digital logic, interface bridges, and embedded control systems who need the Stratix II architectural features such as PLLs, DSP blocks, and robust configuration and debug options.

For development teams and OEMs seeking a commercially graded FPGA with a documented architecture and ecosystem, this device offers an effective platform for scalable designs where integration, connectivity, and on-chip resources are key selection criteria.

Request a quote or submit an inquiry to discuss availability, lead time, and pricing for the EP2S30F484C3N.