EP2S180F1508I4N

The EP2S180F1508I4N is an Intel Stratix® II FPGA optimized for designs that require very high logic density, extensive I/O, and significant on-chip memory. This device combines a large logic fabric with family-level features documented in the Stratix II device handbook, including clocking resources, DSP blocks, and configuration/debug capabilities.

Targeted at industrial applications, the part offers a broad operating temperature range and a robust package, making it suitable for systems that require integration of complex digital logic, memory, and high I/O counts in a single programmable device.

Key Features

• Core Density — 179,400 logic elements for complex digital functions and large-scale integration.
• Embedded Memory — approximately 9.38 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Capacity — 1,170 I/O pins to support wide external interfaces and dense connectivity.
• Power — Supply voltage range from 1.15 V to 1.25 V to match system power rails.
• Package & Mounting — 1508-BBGA (FCBGA) package; supplier device package listed as 1508-FBGA, FC (40×40); surface-mount mounting type for PCB assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial deployment.
• Configuration & Test — Family documentation includes IEEE 1149.1 JTAG boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes.
• Clocking & DSP — Stratix II device handbook documents enhanced and fast PLLs, global/hierarchical clocking, and dedicated digital signal processing blocks for high-performance timing and arithmetic operations.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — High logic density, extensive I/O, and an industrial temperature rating make the device suitable for control systems, sensor interfaces, and distributed automation modules.
• Telecommunications & Networking — Large on-chip memory, DSP resources, and flexible clocking support protocol processing and packet-handling functions in communications equipment.
• High-Performance Signal Processing — Embedded RAM and DSP blocks enable implementation of filters, transforms, and other signal-processing pipelines.
• Custom Hardware Acceleration — The combination of logic capacity and abundant I/O supports hardware offload and acceleration of computationally intensive algorithms.

Unique Advantages

• High Logic Integration: 179,400 logic elements reduce the need for multiple devices by consolidating complex functions into one FPGA.
• Significant On-Chip Memory: Approximately 9.38 Mbits of embedded RAM enables deep buffering and local data storage without external memory in many use cases.
• Extensive I/O Count: 1,170 I/Os provide flexibility for wide bus interfaces, multiple peripheral connections, and dense board-level designs.
• Industrial Reliability: Rated from −40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
• Robust System Integration: 1508-BBGA (FCBGA) packaging and surface-mount mounting support compact board layouts and modern assembly processes.
• Documented Family-Level Capabilities: The Stratix II device handbook details PLLs, DSP blocks, advanced I/O options, and configuration/testing features to aid design and validation.

Why Choose EP2S180F1508I4N?

The EP2S180F1508I4N positions itself as a high-density, industrial-grade FPGA for designs that demand substantial logic, memory, and I/O in a single programmable device. Its specifications—179,400 logic elements, about 9.38 Mbits of embedded RAM, and 1,170 I/Os—support complex, tightly integrated systems while the documented Stratix II family features provide the architectural building blocks designers rely on.

This device is suitable for engineering teams building industrial automation, communications, signal processing, and hardware-accelerated systems that require documented clocking, DSP, and configuration resources along with long-term product support from the device family documentation.

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