EP2S180F1508C4N

IC FPGA 1170 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 1170 9383040 179400 1508-BBGA, FCBGA

Quantity 1,486 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O1170Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8970Number of Logic Elements/Cells179400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9383040

Overview of EP2S180F1508C4N – Stratix® II FPGA (179,400 logic elements)

The EP2S180F1508C4N is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel provided in a 1508-BBGA (1508-FBGA, FC 40×40) surface-mount package. The device delivers high logic density with 179,400 logic elements, approximately 9.38 Mbits of embedded RAM, and 1,170 I/O pins, targeting commercial-grade designs that require large programmable fabric, substantial on-chip memory, and extensive I/O capacity.

Architecturally, the device is part of the Stratix II family and includes the documented building blocks found in the family handbook—logic array blocks and adaptive logic modules, embedded memory organization, DSP resources, advanced clocking/PLL options, and a variety of configuration and debug features—making it suitable for complex digital system integration within the specified commercial temperature and supply ranges.

Key Features

  • Logic Capacity  179,400 logic elements and 8,970 logic array blocks provide a large programmable fabric for complex logic and state-machine implementations.
  • Embedded Memory  Approximately 9.38 Mbits of on-chip RAM organized in Stratix II TriMatrix memory blocks for internal buffering, FIFOs, and data storage.
  • I/O Density & Capabilities  1,170 I/O pins support extensive external interfacing and high-pin-count system designs; datasheet coverage includes high-speed differential I/O and I/O standards support.
  • DSP & Clocking  Device handbook sections describe dedicated digital signal processing blocks and enhanced/fast PLLs and clock networks for synchronous system design and DSP acceleration.
  • Configuration & Debug  Family documentation includes IEEE 1149.1 JTAG boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes for programming and testing.
  • Package & Power  Surface-mount 1508-BBGA (1508-FBGA, FC 40×40) package; recommended supply voltage range is 1.15 V to 1.25 V.
  • Operating Conditions  Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental and assembly considerations.

Typical Applications

  • High-density digital processing  Implement large combinational and sequential logic networks using the substantial logic element count and on-chip memory.
  • High-performance I/O and memory interfaces  Drive complex external memory interfaces and multi-channel signaling using the device’s high I/O count and documented I/O capabilities.
  • Custom DSP acceleration  Utilize the Stratix II DSP block architecture and embedded memory for computationally intensive processing tasks described in the device handbook.
  • System integration and prototyping  Leverage the device’s configuration options, JTAG support, and SignalTap II debug resources during system bring-up and iterative design.

Unique Advantages

  • Highly integrated programmable fabric: 179,400 logic elements and 8,970 logic array blocks reduce the need for multiple discrete devices in complex designs.
  • Substantial on-chip RAM: Approximately 9.38 Mbits of embedded memory supports large buffers, internal storage, and local data processing without external RAM.
  • Extensive I/O availability: 1,170 I/O pins provide flexibility for multi-interface systems and high-channel-count peripheral connectivity.
  • Comprehensive timing and DSP support: Dedicated DSP resources and enhanced/fast PLLs described in the family handbook enable synchronized, performance-focused implementations.
  • Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial product assemblies.
  • Surface-mount BBGA packaging: 1508-BBGA (1508-FBGA, FC 40×40) package supports compact, high-density board layouts.

Why Choose EP2S180F1508C4N?

The EP2S180F1508C4N positions itself as a high-capacity Stratix II FPGA for commercial designs that demand a large programmable fabric, significant embedded memory, and abundant I/O. Its documented architecture—covering logic array blocks, TriMatrix memory, DSP blocks, advanced clocking, and configuration/debug features—supports complex system implementations and iterative development workflows.

This device is well suited to engineers and system architects building commercial electronic systems that require high integration and configurability within the specified supply and temperature ranges. The inclusion of family-level documentation and configuration options provides a clear design reference to support development and validation activities.

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