EP2S180F1508C5

IC FPGA 1170 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 1170 9383040 179400 1508-BBGA, FCBGA

Quantity 1,247 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O1170Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8970Number of Logic Elements/Cells179400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9383040

Overview of EP2S180F1508C5 – Stratix® II FPGA, 179,400 logic elements, 1508-BBGA

The EP2S180F1508C5 is a Stratix® II field programmable gate array (FPGA) IC offering a high-density programmable fabric and extensive on-chip memory and I/O resources. Built on the Stratix II device architecture, the device is suited for demanding digital designs that require large logic capacity, multi-megabit embedded memory, and flexible high-speed I/O.

With 179,400 logic elements, approximately 9.38 Mbits of embedded memory, and 1,170 I/O pins in a 1508-BBGA FCBGA package, this device targets communications, DSP, video and complex control applications where integration and deterministic performance are important.

Key Features

  • Logic Capacity — 179,400 logic elements provide extensive programmable resources for complex digital designs and large-scale integration.
  • Embedded Memory — Approximately 9.38 Mbits of on-chip RAM to support buffers, FIFOs, and data-Intensive processing close to the logic fabric.
  • I/O Density — 1,170 I/O pins enable broad interfacing options for multi-channel systems and dense board-level integration.
  • Package Options — 1508-BBGA, FCBGA package; supplier device package listed as 1508-FBGA, FC (40×40) to support high pin-count board designs.
  • Power Supply Range — Core voltage operation from 1.15 V to 1.25 V for the device core power domain.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C.
  • FPGA Architecture Features — Stratix II architecture includes logic array blocks, adaptive logic modules, DSP blocks, PLLs and clock networks, and multi-track interconnect to support complex timing and high-performance datapaths (as described in the Stratix II device documentation).
  • High-Speed and Advanced I/O — Family-level I/O capabilities documented for DDR I/O, multi‑voltage interface options, on‑chip termination and high-speed differential signaling to support fast external memory and serial interfaces.
  • Configuration & Debug Support — Family documentation includes support for JTAG boundary-scan, SignalTap II embedded logic analyzer, and multiple configuration schemes for board and system-level integration.
  • Regulatory & Environmental — RoHS compliant.

Typical Applications

  • High-Speed Communications — Protocol offload, packet processing, and multi-channel PHY interfacing using abundant logic and high-density I/O.
  • Digital Signal Processing — DSP block support and large on-chip RAM enable filtering, FFTs, and real-time signal chain implementations.
  • Video & Imaging — Frame buffering, format conversion, and parallel pixel processing using large memory and I/O bandwidth.
  • Test & Measurement — Custom instrument logic, data capture and real-time analysis with high logic density and flexible I/O.

Unique Advantages

  • High Logic Density: 179,400 logic elements allow consolidation of multiple functions into a single device, reducing system BOM and board complexity.
  • Substantial On-Chip Memory: Approximately 9.38 Mbits of embedded RAM supports large buffering and on-chip data processing to minimize external memory dependence.
  • Extensive I/O Count: 1,170 I/Os provide flexible connectivity for multi-lane interfaces, parallel buses, and dense peripheral integration.
  • Comprehensive Family Documentation: Stratix II device handbook material (architecture, PLLs, I/O standards, configuration and debug) aids design planning and system-level integration.
  • Commercial-Temperature Operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and enterprise applications.
  • RoHS Compliant: Meets current RoHS environmental requirements for lead-free designs.

Why Choose EP2S180F1508C5?

The EP2S180F1508C5 positions itself as a high-capacity Stratix II FPGA for designs that require large programmable logic, multi-megabit embedded memory, and very high I/O density in a 1508-ball BGA package. It is appropriate for teams implementing communications, DSP, video, or measurement systems that need to consolidate functionality into a single programmable device while relying on documented Stratix II architecture features such as DSP blocks, PLLs, and advanced I/O options.

Backed by the Stratix II device documentation and Altera/Intel product material, the EP2S180F1508C5 offers a documented platform for system-level development and scaling within the Stratix II device family.

Request a quote or submit a purchase inquiry to get pricing and availability for the EP2S180F1508C5 for your next design project.

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