EP2S180F1508C4

The EP2S180F1508C4 is a commercial‑grade Stratix® II Field Programmable Gate Array (FPGA) from Altera, designed for high‑density digital designs. It integrates a large logic fabric, substantial on‑chip memory, and a high I/O count in a 1508‑ball FCBGA package, making it suitable for applications that require significant programmable logic and embedded memory within a surface‑mount form factor.

Key Features

• Core Capacity Provides 179,400 logic elements to implement complex programmable logic and state machines.
• Embedded Memory Approximately 9.38 Mbits of on‑chip RAM for buffers, FIFOs, and embedded data storage.
• I/O Density 1,170 user I/O pins to support broad external connectivity and parallel interfaces.
• Power Core voltage supply range of 1.15 V to 1.25 V to match system power domains.
• Package and Mounting Available in a 1508‑BBGA (1508‑FBGA, 40×40) surface‑mount package for compact, board‑level integration.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS‑compliant manufacturing to meet environmental requirements for lead‑free assembly.

Typical Applications

• High‑density digital logic — Implement complex custom logic, datapath processing, and glue logic where large logic capacity is required.
• Embedded memory buffering — Use the device's on‑chip RAM for buffering, FIFOs, and temporary data storage in streaming or packet‑based systems.
• Interface aggregation — Leverage the 1,170 I/O pins to consolidate multiple parallel and serial interfaces on a single FPGA.

Unique Advantages

• High logic element count: 179,400 logic elements enable implementation of extensive programmable logic without external discrete logic.
• Substantial on‑chip memory: Approximately 9.38 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 1,170 I/O pins simplify system integration by supporting multiple peripherals and parallel buses directly.
• Compact FCBGA package: The 1508‑ball FBGA (40×40) package offers a high‑density, surface‑mount solution for space‑constrained boards.
• Commercial grade and RoHS compliant: Designed for standard commercial environments with lead‑free compliance for modern assembly processes.

Why Choose EP2S180F1508C4?

The EP2S180F1508C4 combines a high logic element count, substantial embedded memory, and a very large I/O complement in a compact FCBGA package, making it a strong choice for commercial designs that need high integration and programmable flexibility. With a defined core voltage range and commercial operating temperature, it fits production systems that require predictable electrical and thermal operating points.

This device is suited to engineering teams building high‑density digital systems that benefit from consolidating logic and memory into a single FPGA, reducing bill of materials and simplifying board layout while maintaining RoHS compliance.

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