EP2S180F1020I4

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 9383040 179400 1020-BBGA

Quantity 957 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8970Number of Logic Elements/Cells179400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9383040

Overview of EP2S180F1020I4 – Stratix II FPGA, 179,400 Logic Elements, 1020‑BBGA

The EP2S180F1020I4 is an industrial‑grade Stratix® II field programmable gate array offered in a 1020‑BBGA (33×33) surface‑mount package. It provides a large programmable fabric with 179,400 logic elements and extensive I/O capability for complex digital designs.

Designed for high‑density applications, this device combines a substantial on‑chip memory resource (approximately 9.38 Mbits) and up to 742 I/O pins with a low core supply range (1.15 V to 1.25 V) and an industrial operating range (−40 °C to 100 °C).

Key Features

  • Logic Capacity — 179,400 logic elements to implement large, high‑logic‑density designs.
  • Embedded Memory — Approximately 9.38 Mbits of on‑chip RAM for implemented buffers, FIFOs, and local storage.
  • High I/O Count — Up to 742 I/O pins to support wide parallel interfaces and multiple peripherals.
  • Package & Mounting — 1020‑BBGA (supplier package 1020‑FBGA, 33×33) in a surface‑mount form factor for dense PCB integration.
  • Power — Core supply range 1.15 V to 1.25 V to match system power rails and design constraints.
  • Temperature & Grade — Industrial grade with operating temperature from −40 °C to 100 °C for demanding environments.
  • Standards & On‑Chip Tools (family features) — Stratix II family support for IEEE 1149.1 JTAG boundary‑scan and the SignalTap II embedded logic analyzer for in‑system debug and visibility.
  • Clocking & DSP Support (family features) — On‑chip PLLs and clock networks plus dedicated DSP circuitry and clock management features described in the Stratix II handbook.
  • I/O Capabilities (family features) — Advanced I/O structure including multi‑voltage I/O interface options, programmable drive strength and on‑chip termination support as detailed in the device handbook.
  • Compliance — RoHS compliant for regulatory and environmental requirements.

Typical Applications

  • High‑performance Networking — Implement wide parallel and serialized interfaces using the device’s large logic capacity and high I/O count for packet processing and traffic management.
  • Telecommunications Equipment — Use the abundant embedded memory and DSP resources for buffering, framing, and signal processing tasks in telecom line cards and infrastructure.
  • Test & Measurement — Leverage on‑chip debug tools (JTAG, embedded logic analyzer) and high I/O density for custom instrumentation and data acquisition systems.
  • Industrial Control — Deploy hardened logic and industrial operating temperature to handle complex control algorithms, motion control interfaces, and I/O aggregation in industrial systems.

Unique Advantages

  • Substantial Logic Density: 179,400 logic elements enable implementation of large, multi‑function designs without partitioning across multiple devices.
  • Large On‑Chip Memory: Approximately 9.38 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O Count: 742 I/O pins provide flexibility to connect multiple peripherals, buses, and high‑speed interfaces directly to the FPGA.
  • Industrial Reliability: Rated for −40 °C to 100 °C and labeled industrial grade for deployment in demanding environments.
  • System Integration: Surface‑mount 1020‑BBGA (33×33) package enables dense PCB layouts and integration into space‑constrained assemblies.
  • Design Visibility & Testability: Family features including JTAG boundary‑scan and the SignalTap II embedded logic analyzer assist in development, debug, and manufacturing test flows.

Why Choose EP2S180F1020I4?

The EP2S180F1020I4 positions itself as a high‑capacity, industrial‑grade Stratix II FPGA well suited for large, complex digital systems that require significant logic resources, on‑chip memory, and extensive I/O. Its combination of 179,400 logic elements, approximately 9.38 Mbits of embedded RAM, and 742 I/O pins enables consolidation of multi‑function designs into a single device.

This device is appropriate for engineering teams designing networking, telecom, industrial control, and instrumentation products that benefit from abundant logic and memory, family‑level debug and configuration features, and a robust operating temperature range.

Request a quote or submit your project requirements to receive pricing and availability information for the EP2S180F1020I4.

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