EP2S180F1020I4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 742 9383040 179400 1020-BBGA |
|---|---|
| Quantity | 957 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 742 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8970 | Number of Logic Elements/Cells | 179400 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9383040 |
Overview of EP2S180F1020I4 – Stratix II FPGA, 179,400 Logic Elements, 1020‑BBGA
The EP2S180F1020I4 is an industrial‑grade Stratix® II field programmable gate array offered in a 1020‑BBGA (33×33) surface‑mount package. It provides a large programmable fabric with 179,400 logic elements and extensive I/O capability for complex digital designs.
Designed for high‑density applications, this device combines a substantial on‑chip memory resource (approximately 9.38 Mbits) and up to 742 I/O pins with a low core supply range (1.15 V to 1.25 V) and an industrial operating range (−40 °C to 100 °C).
Key Features
- Logic Capacity — 179,400 logic elements to implement large, high‑logic‑density designs.
- Embedded Memory — Approximately 9.38 Mbits of on‑chip RAM for implemented buffers, FIFOs, and local storage.
- High I/O Count — Up to 742 I/O pins to support wide parallel interfaces and multiple peripherals.
- Package & Mounting — 1020‑BBGA (supplier package 1020‑FBGA, 33×33) in a surface‑mount form factor for dense PCB integration.
- Power — Core supply range 1.15 V to 1.25 V to match system power rails and design constraints.
- Temperature & Grade — Industrial grade with operating temperature from −40 °C to 100 °C for demanding environments.
- Standards & On‑Chip Tools (family features) — Stratix II family support for IEEE 1149.1 JTAG boundary‑scan and the SignalTap II embedded logic analyzer for in‑system debug and visibility.
- Clocking & DSP Support (family features) — On‑chip PLLs and clock networks plus dedicated DSP circuitry and clock management features described in the Stratix II handbook.
- I/O Capabilities (family features) — Advanced I/O structure including multi‑voltage I/O interface options, programmable drive strength and on‑chip termination support as detailed in the device handbook.
- Compliance — RoHS compliant for regulatory and environmental requirements.
Typical Applications
- High‑performance Networking — Implement wide parallel and serialized interfaces using the device’s large logic capacity and high I/O count for packet processing and traffic management.
- Telecommunications Equipment — Use the abundant embedded memory and DSP resources for buffering, framing, and signal processing tasks in telecom line cards and infrastructure.
- Test & Measurement — Leverage on‑chip debug tools (JTAG, embedded logic analyzer) and high I/O density for custom instrumentation and data acquisition systems.
- Industrial Control — Deploy hardened logic and industrial operating temperature to handle complex control algorithms, motion control interfaces, and I/O aggregation in industrial systems.
Unique Advantages
- Substantial Logic Density: 179,400 logic elements enable implementation of large, multi‑function designs without partitioning across multiple devices.
- Large On‑Chip Memory: Approximately 9.38 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O Count: 742 I/O pins provide flexibility to connect multiple peripherals, buses, and high‑speed interfaces directly to the FPGA.
- Industrial Reliability: Rated for −40 °C to 100 °C and labeled industrial grade for deployment in demanding environments.
- System Integration: Surface‑mount 1020‑BBGA (33×33) package enables dense PCB layouts and integration into space‑constrained assemblies.
- Design Visibility & Testability: Family features including JTAG boundary‑scan and the SignalTap II embedded logic analyzer assist in development, debug, and manufacturing test flows.
Why Choose EP2S180F1020I4?
The EP2S180F1020I4 positions itself as a high‑capacity, industrial‑grade Stratix II FPGA well suited for large, complex digital systems that require significant logic resources, on‑chip memory, and extensive I/O. Its combination of 179,400 logic elements, approximately 9.38 Mbits of embedded RAM, and 742 I/O pins enables consolidation of multi‑function designs into a single device.
This device is appropriate for engineering teams designing networking, telecom, industrial control, and instrumentation products that benefit from abundant logic and memory, family‑level debug and configuration features, and a robust operating temperature range.
Request a quote or submit your project requirements to receive pricing and availability information for the EP2S180F1020I4.

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