EP2S180F1020C4

The EP2S180F1020C4 is a Stratix® II family FPGA from Intel, supplied in a 1020-BBGA (1020-FBGA, 33×33) surface-mount package for commercial-grade designs. It combines a large logic fabric with substantial on-chip memory and a high pin count to address complex digital processing, interface, and system-integration requirements.

With 179,400 logic elements and approximately 9.38 Mbits of embedded memory, this device targets high-density logic implementation, heavy buffering, and designs that require extensive I/O connectivity within a 0 °C to 85 °C operating range and a 1.15 V–1.25 V core supply window.

Key Features

• Logic Capacity — 179,400 logic elements to implement large-scale combinational and sequential logic, and to accommodate complex state machines and glue logic.
• On‑Chip Memory — Approximately 9.38 Mbits of embedded RAM for buffering, FIFOs, and local data storage without external memory for many use cases.
• I/O Density — 742 I/O pins to support extensive external interfaces, parallel buses, and multi-channel connectivity.
• High‑Performance Architecture — Stratix II architecture elements described in the device handbook such as adaptive logic modules, dedicated DSP circuitry, and TriMatrix memory structure for flexible routing and performance-oriented designs.
• DSP & Clocking — On‑chip digital signal processing blocks and enhanced/fast PLL and clock network features referenced in the device handbook for clock management and signal processing tasks.
• Advanced I/O Capabilities — Support for high‑speed differential I/O, MultiVolt I/O interface options, programmable drive strength, on‑chip termination, and advanced I/O standard support as documented in the device handbook.
• Configuration & Debug — JTAG boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes referenced in the device handbook to simplify bring-up and in-system debug.
• Package & Power — 1020-BBGA surface-mount package (supplier device package: 1020-FBGA, 33×33) and a specified core voltage supply range of 1.15 V to 1.25 V for proper power planning.
• Commercial Grade & Compliance — Commercial grade device with an operating range of 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

• High‑Performance Signal Processing — Uses on‑chip DSP blocks and large logic capacity to implement filtering, FFTs, and real‑time data processing pipelines.
• High‑Speed Communications — Leverages abundant I/O and high‑speed differential I/O support to implement multi‑lane interfaces and protocol bridging.
• Memory Interface & Controller Design — Combines many I/Os and substantial embedded RAM for external memory interfacing, buffering, and controller logic.
• System Integration & Prototyping — Large logic element count and configurable I/O make the device suitable for integrating multiple subsystems or validating complex designs in hardware.

Unique Advantages

• Large Logic Resource: 179,400 logic elements provide the density required to implement complex SoC glue logic and multi‑function designs without partitioning across devices.
• Significant Embedded Memory: Approximately 9.38 Mbits of on‑chip RAM reduces external memory dependency for many buffering and local storage needs.
• Extensive I/O: 742 I/Os enable broad connectivity options for multi‑channel interfaces, parallel buses, and mixed‑signal front ends.
• Comprehensive Architecture: Stratix II architectural features (DSP blocks, PLLs, TriMatrix memory, advanced I/O) deliver flexible implementation choices documented in the device handbook.
• Deployment‑Ready Package: 1020‑BBGA (33×33) surface‑mount package supports dense PCB integration while meeting commercial operating temperature requirements.
• Regulatory Compliance: RoHS‑compliant manufacturing helps meet environmental requirements for commercial electronics products.

Why Choose EP2S180F1020C4?

The EP2S180F1020C4 delivers a high-density Stratix II FPGA option for commercial designs that require a combination of abundant logic elements, sizable on‑chip memory, and very high I/O counts. Its documented architecture—covering adaptive logic modules, DSP blocks, advanced clocking, and robust I/O features—supports implementation of demanding processing, interface, and integration tasks.

This device is well suited for engineering teams building high‑complexity digital systems, communication interfaces, and signal processing solutions who need a commercially graded FPGA with detailed architectural and configuration support available in the device handbook.

Request a quote or submit an RFQ today to check pricing and availability for EP2S180F1020C4.