EP2S180F1020C5N

The EP2S180F1020C5N is a Stratix® II field programmable gate array (FPGA) in a 1020-BBGA FCBGA package, designed for high-density programmable logic applications. It provides a substantial on-chip resource set, including a large logic element count, multi-megabit embedded memory, and extensive I/O, making it suitable for complex digital designs that require significant integration.

This device targets commercial applications that need high logic capacity, abundant I/O, and on-chip RAM while operating from a 1.15 V to 1.25 V supply and within a 0 °C to 85 °C ambient range.

Key Features

• Core Logic Capacity  Approximately 179,400 logic elements for implementing large-scale combinational and sequential logic designs.
• Logic Blocks  8,970 logic blocks (CLBs) to organize and distribute logic resources across the device.
• Embedded Memory  Approximately 9.38 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage without external memory.
• High I/O Count  742 I/O pins to enable broad interfacing options and dense system connectivity.
• Power Supply  Operates from a 1.15 V to 1.25 V supply range to match system power-rail requirements.
• Package & Mounting  1020-BBGA, FCBGA package (supplier device package: 1020-FBGA, 33 × 33 mm) with surface-mount mounting for compact board integration.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing requirements.

Typical Applications

• High-density digital processing  Implementation of complex logic functions and custom datapaths using approximately 179,400 logic elements and extensive block resources.
• Memory-intensive designs  Systems that require on-chip buffering or local data storage can leverage approximately 9.38 Mbits of embedded RAM to reduce external memory dependencies.
• Multi-interface systems  Platforms requiring many parallel or serial connections can utilize the device’s 742 I/O pins for broad peripheral and bus integration.
• Prototyping and system integration  Use as a programmable platform for validating large-scale logic architectures and consolidating functions onto a single FPGA package.

Unique Advantages

• High integration density: The large logic element count and thousands of logic blocks allow consolidation of numerous functions into one device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 9.38 Mbits of embedded RAM supports buffers and local storage, minimizing reliance on external memory components.
• Extensive I/O availability: 742 I/O pins provide flexibility for connecting multiple interfaces, sensors, or parallel data paths without frequent multiplexing.
• Compact, surface-mount BGA package: The 1020-BBGA (33 × 33 mm) package enables high-density PCB layouts while maintaining robust mounting.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• RoHS compliant: Supports environmental and manufacturing compliance requirements.

Why Choose EP2S180F1020C5N?

The EP2S180F1020C5N combines a very large logic element count, multi-megabit embedded RAM, and a high I/O pin count in a compact 1020-BBGA FCBGA package, positioning it for complex commercial designs that require high integration and flexible interfacing. Its specified operating voltage range and commercial temperature rating make it suitable for systems designed around a 1.15 V–1.25 V core supply operating between 0 °C and 85 °C.

This part is appropriate for engineering teams seeking a programmable solution that consolidates logic, memory, and I/O in a single device, helping reduce board-level component count and simplify system architecture.

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