EP2S180F1020C3N

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 9383040 179400 1020-BBGA

Quantity 635 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8970Number of Logic Elements/Cells179400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9383040

Overview of EP2S180F1020C3N – Stratix® II Field Programmable Gate Array (FPGA) IC 1020-BBGA

The EP2S180F1020C3N is a Stratix II family FPGA in a 1020-BBGA package designed for high-density, configurable logic implementations. It delivers substantial on-chip resources—including 179,400 logic elements, approximately 9.38 Mbits of embedded memory, and 742 I/O pins—making it suitable for designs that require large logic capacity, extensive I/O, and integrated memory.

Built for commercial-temperature systems and RoHS-compliant boards, this device targets applications that demand dense logic integration, on-chip storage, and flexible clock and I/O architectures while operating from a 1.15 V to 1.25 V core supply.

Key Features

  • High Logic Capacity  179,400 logic elements provide extensive LUT and register resources for complex, multi-function designs.
  • Embedded Memory  Approximately 9.38 Mbits of on-chip RAM (TriMatrix memory architecture referenced in the device family handbook) supports large buffering, on-chip caches, and state storage.
  • Large I/O Count  742 I/O pins enable multi-channel interfaces, broad external device connectivity, and flexible bus architectures.
  • Dedicated DSP & Clock Resources  Device-family documentation references digital signal processing blocks and a variety of PLL and clock network options for high-performance timing and DSP implementations.
  • Configuration & Debug Support  Family documentation includes IEEE 1149.1 JTAG boundary-scan support and the SignalTap II embedded logic analyzer for in-system debug and configuration visibility.
  • Power and Voltage  Core voltage supply range of 1.15 V to 1.25 V provides the required operating window for the device.
  • Package & Mounting  1020-BBGA (supplier package: 1020-FBGA, 33×33) surface-mount package delivers a compact, high-pin-count footprint for PCB integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications.
  • Regulatory Status  RoHS compliant, supporting lead-free board assembly processes.

Typical Applications

  • High-density logic integration  Complex control systems and large-scale programmable logic implementations that require extensive LUTs and registers.
  • On-chip buffering and memory handling  Designs that need substantial embedded RAM for frame buffering, packet storage, or caching—leveraging approximately 9.38 Mbits of on-chip memory.
  • Multi-channel I/O systems  Applications requiring many external interfaces or parallel data paths benefit from the device’s 742 I/O pins.
  • Signal processing and timing-critical designs  Use cases that utilize the family’s DSP blocks and PLL/clock network capabilities for deterministic timing and arithmetic workloads.

Unique Advantages

  • Large programmable fabric: 179,400 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Significant on-chip memory: Approximately 9.38 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratch/storage needs.
  • Extensive I/O availability: 742 I/O pins support wide buses, multiple peripherals, and high-channel-count interfaces without board-level multiplexing.
  • Comprehensive configuration and debug: Built-in JTAG support and family tools (SignalTap II referenced in documentation) help accelerate bring-up and in-field debugging.
  • Compact high-pin-count packaging: The 1020-BBGA / 1020-FBGA (33×33) package delivers high I/O density in a surface-mount form factor for space-constrained PCBs.
  • Commercial-ready and RoHS-compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for lead-free assembly.

Why Choose EP2S180F1020C3N?

The EP2S180F1020C3N positions itself as a high-capacity Stratix II FPGA option for teams needing substantial programmable logic, embedded memory, and broad I/O on a single package. Its combination of 179,400 logic elements, approximately 9.38 Mbits of on-chip RAM, and 742 I/Os supports consolidation of complex systems and minimizes external component requirements.

Engineers and system designers focused on high-density logic implementations, in-system debugging, and multi-channel interfacing will find this device suitable for commercial-temperature applications where the Stratix II device family’s clocking, DSP, configuration, and I/O capabilities are required.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for EP2S180F1020C3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up