EP2S15F672I4N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 366 419328 15600 672-BBGA |
|---|---|
| Quantity | 1,532 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 366 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 780 | Number of Logic Elements/Cells | 15600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 419328 |
Overview of EP2S15F672I4N – Stratix® II FPGA, 15,600 logic elements, 672-BBGA
The EP2S15F672I4N is an Intel Stratix® II field programmable gate array (FPGA) supplied in a 672-ball BGA package for surface-mount assembly. It integrates 15,600 logic elements, approximately 0.42 Mbits of embedded memory, and 366 user I/O pins to address demanding industrial embedded designs.
Architected for applications that require high logic density, significant on-chip memory and abundant I/O, this FPGA delivers a balance of integration and configurability while operating over an industrial temperature range and RoHS-compliant supply requirements.
Key Features
- Logic Capacity 15,600 logic elements provide a substantive fabric for implementing complex custom logic, control state machines, and datapath functions.
- Embedded Memory Approximately 0.42 Mbits of on-chip RAM supports buffering, lookup tables, and small frame storage directly inside the fabric.
- I/O Count 366 user I/Os enable broad external connectivity for high-pin-count interfaces and parallel buses.
- Package & Mounting 672-BBGA (supplier package: 672-FBGA, 27×27) suitable for surface-mount PCB assembly and dense board layouts.
- Power Supply Core supply operating range from 1.15 V to 1.25 V, allowing designers to plan accurate power routing and regulation.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
- Standards & Compliance RoHS compliant for environmental and assembly process compatibility.
- Device Family Resources Stratix II family documentation covers architecture, DSP blocks, PLLs, fast/high-speed I/O, and configuration/testing features for system design reference.
Typical Applications
- High-Speed Communications Uses the device's high I/O count and Stratix II high-speed I/O architecture for protocol implementation, bridging, and data-path aggregation.
- Signal Processing and DSP Leverages on-chip logic and embedded memory together with the Stratix II DSP block architecture described in the device handbook for real-time processing tasks.
- Industrial Control & Automation Industrial-grade temperature rating and numerous I/Os accommodate control logic, sensor interfacing, and deterministic I/O management.
- Memory Interfaces & Bus Bridging On-chip resources and documented external memory interface capabilities enable implementation of memory controllers and bus converters.
Unique Advantages
- Substantial Logic Density: 15,600 logic elements enable implementation of mid-sized to complex FPGA designs without splitting functionality across multiple devices, reducing BOM complexity.
- Significant On-Chip RAM: Approximately 0.42 Mbits of embedded memory reduces external memory dependency for many buffering and LUT needs, improving latency and board-level integration.
- High I/O Count: 366 I/Os provide flexibility to connect multiple peripherals, parallel interfaces, or multi-channel front-ends directly to the FPGA fabric.
- Industrial Readiness: Rated for −40 °C to 100 °C operation, matching the needs of industrial environments and extended-temperature deployments.
- Compact BGA Packaging: The 672-BBGA (27×27) package supports dense PCB layouts while delivering the pin count required for complex systems.
- Vendor Documentation: Comprehensive Stratix II device handbook material on architecture, PLLs, I/O and configuration supports design integration and verification activities.
Why Choose EP2S15F672I4N?
The EP2S15F672I4N positions itself as a capable Stratix II FPGA option for industrial applications that require a balance of logic capacity, on-chip memory and extensive I/O connectivity. Its documented family architecture—including DSP blocks, high-speed I/O and configuration features—helps engineers integrate complex functions while keeping system-level component counts manageable.
This device is suited for designers seeking a mid-to-high logic-density FPGA with industrial temperature capability and a high pin count in a compact BGA footprint. Combined with available device handbook resources, it delivers a development foundation for robust, scalable embedded designs.
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