EP2S15F672I4N

IC FPGA 366 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 366 419328 15600 672-BBGA

Quantity 1,532 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O366Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs780Number of Logic Elements/Cells15600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits419328

Overview of EP2S15F672I4N – Stratix® II FPGA, 15,600 logic elements, 672-BBGA

The EP2S15F672I4N is an Intel Stratix® II field programmable gate array (FPGA) supplied in a 672-ball BGA package for surface-mount assembly. It integrates 15,600 logic elements, approximately 0.42 Mbits of embedded memory, and 366 user I/O pins to address demanding industrial embedded designs.

Architected for applications that require high logic density, significant on-chip memory and abundant I/O, this FPGA delivers a balance of integration and configurability while operating over an industrial temperature range and RoHS-compliant supply requirements.

Key Features

  • Logic Capacity  15,600 logic elements provide a substantive fabric for implementing complex custom logic, control state machines, and datapath functions.
  • Embedded Memory  Approximately 0.42 Mbits of on-chip RAM supports buffering, lookup tables, and small frame storage directly inside the fabric.
  • I/O Count  366 user I/Os enable broad external connectivity for high-pin-count interfaces and parallel buses.
  • Package & Mounting  672-BBGA (supplier package: 672-FBGA, 27×27) suitable for surface-mount PCB assembly and dense board layouts.
  • Power Supply  Core supply operating range from 1.15 V to 1.25 V, allowing designers to plan accurate power routing and regulation.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
  • Standards & Compliance  RoHS compliant for environmental and assembly process compatibility.
  • Device Family Resources  Stratix II family documentation covers architecture, DSP blocks, PLLs, fast/high-speed I/O, and configuration/testing features for system design reference.

Typical Applications

  • High-Speed Communications  Uses the device's high I/O count and Stratix II high-speed I/O architecture for protocol implementation, bridging, and data-path aggregation.
  • Signal Processing and DSP  Leverages on-chip logic and embedded memory together with the Stratix II DSP block architecture described in the device handbook for real-time processing tasks.
  • Industrial Control & Automation  Industrial-grade temperature rating and numerous I/Os accommodate control logic, sensor interfacing, and deterministic I/O management.
  • Memory Interfaces & Bus Bridging  On-chip resources and documented external memory interface capabilities enable implementation of memory controllers and bus converters.

Unique Advantages

  • Substantial Logic Density: 15,600 logic elements enable implementation of mid-sized to complex FPGA designs without splitting functionality across multiple devices, reducing BOM complexity.
  • Significant On-Chip RAM: Approximately 0.42 Mbits of embedded memory reduces external memory dependency for many buffering and LUT needs, improving latency and board-level integration.
  • High I/O Count: 366 I/Os provide flexibility to connect multiple peripherals, parallel interfaces, or multi-channel front-ends directly to the FPGA fabric.
  • Industrial Readiness: Rated for −40 °C to 100 °C operation, matching the needs of industrial environments and extended-temperature deployments.
  • Compact BGA Packaging: The 672-BBGA (27×27) package supports dense PCB layouts while delivering the pin count required for complex systems.
  • Vendor Documentation: Comprehensive Stratix II device handbook material on architecture, PLLs, I/O and configuration supports design integration and verification activities.

Why Choose EP2S15F672I4N?

The EP2S15F672I4N positions itself as a capable Stratix II FPGA option for industrial applications that require a balance of logic capacity, on-chip memory and extensive I/O connectivity. Its documented family architecture—including DSP blocks, high-speed I/O and configuration features—helps engineers integrate complex functions while keeping system-level component counts manageable.

This device is suited for designers seeking a mid-to-high logic-density FPGA with industrial temperature capability and a high pin count in a compact BGA footprint. Combined with available device handbook resources, it delivers a development foundation for robust, scalable embedded designs.

Request a quote or submit a product inquiry to receive pricing, availability and ordering information for the EP2S15F672I4N.

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