EP2S15F672C4N

IC FPGA 366 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 366 419328 15600 672-BBGA

Quantity 1,906 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O366Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs780Number of Logic Elements/Cells15600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits419328

Overview of EP2S15F672C4N – Stratix® II FPGA, 15,600 logic elements, 672-BBGA

The EP2S15F672C4N is a Stratix® II Field Programmable Gate Array (FPGA) in a 672-ball BGA package designed for commercial applications. It implements Stratix II architecture elements and provides a balance of programmable logic, embedded memory, and I/O resources for mid-range FPGA designs.

Typical use cases include digital signal processing, custom logic acceleration, and complex I/O interfacing where on-chip RAM, clock management and flexible I/O support are required. The device offers industry-standard surface-mount packaging and RoHS compliance for streamlined board-level integration.

Key Features

  • Programmable Logic  15,600 logic elements provide the programmable fabric to implement control, data-path, and state-machine logic.
  • Logic Array Blocks  780 logic array blocks (LABs) enabling structured placement of adaptive logic modules for efficient resource utilization.
  • Embedded Memory  Approximately 0.419 Mbits (419,328 bits) of on-chip RAM for FIFOs, packet buffers, and small data stores.
  • I/O Capacity  366 I/O pins for flexible external interfacing and multiple bus connections on a single device.
  • Power Supply Range  Core supply range from 1.15 V to 1.25 V to match system power domains and specified operating conditions.
  • Package & Mounting  672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact board integration.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C, suitable for standard commercial environments.
  • Standards & Reliability  RoHS compliant to meet contemporary lead-free and environmental requirements.
  • Stratix II Family Capabilities  Stratix II architecture elements highlighted in the device handbook include configurable PLLs and clock networks, DSP blocks, on-chip termination and a comprehensive I/O structure for advanced timing and interface options.
  • Configuration & Debug Support  Series-level support includes JTAG boundary-scan and embedded logic analysis capabilities referenced in the Stratix II documentation.

Typical Applications

  • Digital Signal Processing  Use the device’s programmable logic and embedded memory to implement filters, FFTs, and custom DSP pipelines.
  • High-Channel I/O Interfaces  Leverage 366 I/O pins for multi-channel sensor arrays, parallel buses, or complex peripheral aggregation.
  • Protocol Bridging & Custom Glue Logic  Implement protocol converters, timing-adjusted interfaces, and glue logic between heterogeneous subsystems.
  • Embedded Control Systems  Apply the Stratix II fabric for state machines, motor-control logic, or real-time control tasks in commercial equipment.

Unique Advantages

  • Balanced Logic and Memory:  15,600 logic elements paired with approximately 0.419 Mbits of on-chip RAM enable compact implementations of control and buffering in a single device, reducing board-level component count.
  • Substantial I/O Density:  366 I/O pins allow high-connectivity designs without immediate need for external multiplexing or expanders.
  • Flexible Power Integration:  The defined core voltage range (1.15 V–1.25 V) supports integration into modern power architectures while maintaining specified device operation.
  • Commercial Grade for Standard Environments:  Rated for 0 °C–85 °C operation, this device fits production systems and customer designs targeting commercial temperature requirements.
  • Compact Surface-Mount BGA:  672-BBGA (27×27) packaging delivers a high-pin-count solution in a compact footprint for dense PCB layouts.
  • Series-Level Feature Set:  Stratix II family capabilities such as PLLs, DSP blocks, on-chip termination, and configuration/debug infrastructure help accelerate design development and validation.

Why Choose EP2S15F672C4N?

The EP2S15F672C4N places Stratix II programmable fabric, embedded memory, and extensive I/O into a compact 672-ball BGA package targeted at commercial designs. It is suited for engineers who need mid-range logic density with flexible interfacing and the architectural capabilities documented for the Stratix II family.

Choosing this part provides a balanced platform for integrating logic, buffering and timing resources on a single device, enabling streamlined BOMs and conservative board real estate usage while meeting RoHS and commercial operating requirements.

Request a quote or submit a sales inquiry to obtain pricing and availability for the EP2S15F672C4N and to discuss lead times and order quantities.

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