EP2S15F672C3

IC FPGA 366 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 366 419328 15600 672-BBGA

Quantity 648 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O366Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs780Number of Logic Elements/Cells15600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits419328

Overview of EP2S15F672C3 – Stratix® II FPGA, 15,600 Logic Elements, 366 I/O, 672-BBGA

The EP2S15F672C3 is a Stratix® II field-programmable gate array (FPGA) offered in a 672-ball BGA package. It provides a programmable logic fabric with 15,600 logic elements, approximately 0.419 Mbits of embedded RAM, and up to 366 I/O pins, targeting commercial-grade programmable logic applications.

Built on the Stratix II device family architecture, the device includes the series' documented features such as configurable logic array blocks, dedicated memory structures, DSP block interfaces, PLLs and clock networks, and advanced I/O structure for high-speed interfacing and external memory support.

Key Features

  • Logic Capacity — 15,600 logic elements provide a flexible resource pool for implementing custom digital logic and state machines.
  • Embedded Memory — Approximately 0.419 Mbits of on-chip RAM (419,328 bits) for data buffering, FIFOs, and on-die storage.
  • I/O Density — Up to 366 I/O pins support extensive external interfacing and parallel connectivity requirements.
  • Power and Voltage — Core voltage supply range of 1.15 V to 1.25 V to match target system power rails.
  • Package & Mounting — 672-ball FBGA surface-mount package (27 × 27 mm footprint) for high-density board integration.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0°C to 85°C.
  • Stratix II Architecture Features — Includes the family’s documented capabilities such as Adaptive Logic Modules, TriMatrix memory, DSP block interface, enhanced PLLs and clock networks, configuration and JTAG support, and advanced I/O standards support as described in the Stratix II device handbook.
  • Compliance — RoHS compliant for global environmental requirements.

Typical Applications

  • Digital signal processing — Use the device's DSP block interface and on-chip memory to implement signal processing pipelines and algorithm acceleration.
  • High-density I/O bridging — 366 I/O pins enable parallel data paths and flexible external device interfacing for systems that require broad connectivity.
  • External memory interfacing — Built-in support within the Stratix II family for external RAM interfacing and high-speed I/O makes the device suited for designs that combine on-chip and off-chip memory.
  • Prototyping and system integration — The combination of programmable logic, embedded RAM, and comprehensive clocking features supports complex prototype and integration tasks in commercial electronic products.

Unique Advantages

  • Substantial logic resources: 15,600 logic elements give designers room to implement complex functionality on a single device, reducing board-level component count.
  • On-chip memory for efficient data handling: Approximately 0.419 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage tasks.
  • High I/O count: 366 I/O pins enable broad connectivity to peripherals, sensors, and external interfaces without compromise.
  • Robust clocking and timing features: Family-documented PLLs, clock networks, and timing controls support synchronous designs and multi-clock-domain systems.
  • Commercial-grade reliability: Specified operating temperature of 0°C to 85°C and RoHS compliance align with commercial product requirements.
  • Compact, surface-mount package: 672-FBGA (27 × 27 mm) package supports high-density PCB layouts while maintaining manufacturability.

Why Choose EP2S15F672C3?

The EP2S15F672C3 delivers a balance of logic density, embedded memory, and extensive I/O in a commercial-grade Stratix II FPGA package. Its documented family features—programmable logic array blocks, dedicated memory structures, DSP interfaces, PLLs and advanced I/O—make it well suited for designs that require significant on-chip resources and flexible interfacing.

Designers and engineers seeking a Stratix II device backed by detailed device handbook documentation will find the EP2S15F672C3 appropriate for complex digital implementations where on-chip RAM, sizable logic capacity, and high I/O counts are required.

Request a quote or submit an RFQ through your preferred distributor or procurement channel to obtain pricing, availability, and further ordering details for EP2S15F672C3.

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