EP2S15F484C5

IC FPGA 342 I/O 484FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 342 419328 15600 484-BBGA

Quantity 1,043 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O342Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs780Number of Logic Elements/Cells15600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits419328

Overview of EP2S15F484C5 – Stratix® II Field Programmable Gate Array, 15,600 logic elements, 484-BBGA

The EP2S15F484C5 is a Stratix® II field programmable gate array (FPGA) IC offered in a 484-ball BGA package. It delivers a balanced combination of logic density, embedded memory, and high I/O count targeted at commercial FPGA designs requiring complex logic integration and flexible I/O interfacing.

Built on the Stratix II architecture, this device is suitable for applications that leverage on-chip memory and DSP/clocking resources and that demand a compact surface-mount 484‑FBGA (23×23) package and single-core supply operation in the 1.15 V–1.25 V range.

Key Features

  • Logic Capacity — 15,600 logic elements provide substantial programmable logic resources for medium-complexity designs and custom system integration.
  • Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (419,328 bits) to support buffering, local data storage, and memory-mapped functions.
  • I/O Density & Flexibility — 342 user I/O pins for broad external device connectivity; datasheet references support for DDR I/O, multi-volt I/O interfaces, programmable pull-ups, and on-chip termination.
  • Clocking & Timing — Stratix II family clock architecture includes enhanced and fast PLLs plus global and hierarchical clock networks to support synchronous designs and multi-clock domains.
  • Signal Processing Support — Device handbook documents dedicated digital signal processing resources and memory architectures (TriMatrix memory) suitable for DSP-centric functions.
  • Configuration & Debug — Supports standard configuration and test features documented in the Stratix II handbook, including IEEE 1149.1 JTAG boundary-scan and an embedded logic analyzer (SignalTap II) for in-system debugging.
  • Package & Power — Surface-mount 484‑BBGA package (supplier package 484‑FBGA, 23×23) with recommended operating core supply of 1.15 V to 1.25 V and commercial-grade operating temperature range of 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-performance signal processing — Use embedded memory and documented DSP resources to implement filtering, transforms, and stream processing functions.
  • High-speed communications and protocol bridging — Leverage the device's high I/O count and Stratix II I/O features (DDR and differential I/O support) for interface conversion and link-level processing.
  • Memory interface and buffering — On-chip RAM combined with the Stratix II memory architecture supports external memory controllers, data buffering, and packet staging.
  • Custom logic integration and prototyping — Medium logic density and comprehensive configuration/test features make the device suitable for custom FPGA-based system modules and board-level integration in commercial products.

Unique Advantages

  • Substantial logic resources: 15,600 logic elements provide the capacity to integrate multiple functions on a single device, reducing board-level BOM complexity.
  • Embedded on-chip memory: Approximately 0.42 Mbits of RAM enables local storage and reduces reliance on external memory for many designs.
  • High I/O count: 342 I/O pins afford broad external connectivity options for peripherals, interfaces, and multi-lane links.
  • Comprehensive clocking and DSP support: Documented PLLs, clock networks, and DSP resources facilitate multi-clock and signal-processing applications.
  • Compact SMD package: 484‑FBGA (23×23) surface-mount footprint balances board space with thermal and routing considerations for compact commercial designs.
  • Production-ready compliance: Commercial grade operating range (0 °C to 85 °C) and RoHS compliance support mainstream product deployment.

Why Choose EP2S15F484C5?

The EP2S15F484C5 places Stratix II family capabilities—logic density, embedded memory, extensive I/O, and documented clocking/DSP resources—into a single 484‑BBGA device built for commercial applications. It is well suited for designers who need medium-to-high logic capacity alongside flexible I/O and on-chip RAM for signal processing, interface bridging, or custom system functions.

Backed by the Stratix II device handbook and standard configuration/debug features, the EP2S15F484C5 provides a documented platform that helps accelerate integration and in-system validation for commercial FPGA-based products.

Request a quote or submit a product inquiry to receive pricing, availability, and delivery information for the EP2S15F484C5. Our team will respond with a formal quote and ordering details tailored to your project requirements.

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