EP2S15F484C3

The EP2S15F484C3 is a Stratix® II family field programmable gate array (FPGA) in a 484‑ball fine‑pitch BGA package. It integrates 15,600 logic elements, approximately 0.419 Mbits of on‑chip RAM, and a high‑density I/O count to support complex, reconfigurable digital designs built on the Stratix II architecture.

This commercial‑grade, surface‑mount device operates from a 1.15 V to 1.25 V core supply and across a 0 °C to 85 °C temperature range, offering a balance of integration, I/O capacity, and power domain characteristics for system designs that require flexible logic, embedded memory, and extensive connectivity.

Key Features

• Logic Capacity — 15,600 logic elements and 780 LABs provide substantial programmable logic resources for mid‑range to complex designs.
• Embedded Memory — Approximately 0.419 Mbits of total on‑chip RAM to support buffering, state storage, and memory‑centric logic functions.
• I/O Density — 342 I/O pins for broad external device interfacing and multi‑bus connectivity options.
• Package & Mounting — 484‑BBGA (484‑FBGA, 23×23) fine‑pitch BGA package, surface mount for compact board integration.
• Power Supply — Core voltage support from 1.15 V to 1.25 V to match Stratix II supply requirements.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Stratix II Family Architecture — Family features documented in the Stratix II handbook including DSP blocks, PLLs and clock networks, TriMatrix memory, and advanced I/O structures to enable high‑performance system functions.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Memory‑interface designs — Use the device where external RAM interfacing and on‑chip memory are needed to implement buffering, controllers, or bridge logic.
• High‑I/O control and aggregation — High I/O count supports designs requiring multiple parallel buses, sensor arrays, or wide peripheral connectivity.
• DSP and custom datapaths — Stratix II family DSP block and programmable logic resources enable implementation of custom signal processing pipelines and specialized arithmetic functions.

Unique Advantages

• Substantial programmable logic — 15,600 logic elements give designers the capacity to implement complex control, processing, and glue logic in a single device.
• Embedded RAM for local storage — Approximately 0.419 Mbits of on‑chip RAM reduces external memory dependence for many buffering and state‑machine needs.
• High pin count for system integration — 342 I/O pins simplify connectivity to multiple peripherals, memories, and interfaces without board‑level multiplexing.
• Compact BGA package — 484‑FBGA (23×23) package provides a high I/O density in a space‑efficient footprint for compact PCBs.
• Validated family architecture — Stratix II documented features such as PLLs, clock networks, DSP blocks, and advanced I/O support help streamline implementation of timing, clocking, and high‑speed interfaces.
• Regulatory and assembly readiness — Surface‑mount, RoHS‑compliant package suitable for modern manufacturing flows.

Why Choose EP2S15F484C3?

The EP2S15F484C3 delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O density within the Stratix II family architecture. Its 15,600 logic elements, substantial on‑chip RAM, and 342 I/O pins make it well suited for designs that require flexible, reconfigurable logic, localized memory, and broad external connectivity while maintaining a compact BGA footprint.

This commercial‑grade FPGA is appropriate for engineering teams and OEMs building mid‑range FPGA systems that benefit from Stratix II features such as DSP resources, PLLs and advanced I/O structures, with RoHS compliance and standard surface‑mount packaging for streamlined production.

Request a quote or submit an inquiry today to check availability and pricing for the EP2S15F484C3 and to get support for integrating this Stratix II FPGA into your design.