EP2S130F780C5N

The EP2S130F780C5N is a Stratix® II field programmable gate array (FPGA) IC from Altera, offering high logic density and on-chip memory in a 780‑ball FCBGA package. With 132,540 logic elements, approximately 6.75 Mbits of embedded memory and 534 user I/O pins, this device is intended for designs that require substantial programmable logic capacity, significant embedded RAM, and large I/O connectivity.

Designed for surface-mount PCB assembly and rated for commercial temperature operation (0 °C to 85 °C), the device supports a core voltage supply range of 1.15 V to 1.25 V and is RoHS compliant.

Key Features

• FPGA Core  132,540 logic elements provide high-density programmable logic for complex digital designs.
• Embedded Memory  Approximately 6.75 Mbits of on-chip RAM to support buffering, state storage, and data processing.
• I/O Capacity  534 user I/O pins enable extensive external interfacing and high pin-count system integration.
• Power  Core voltage supply range of 1.15 V to 1.25 V for standard Stratix II power domains.
• Package & Mounting  780‑BBGA (FCBGA) package, supplier device package 780‑FBGA (29×29), surface mount for compact board-level integration.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital designs  Use the device where large amounts of programmable logic and embedded RAM are required to implement complex algorithms or data paths.
• Interface and protocol bridging  Leverage the 534 I/O pins to implement wide parallel interfaces, multi-protocol bridging, or extensive peripheral connectivity.
• Prototyping and system integration  The combination of logic capacity and on-chip memory supports hardware prototyping and integration of multiple subsystems on a single FPGA.

Unique Advantages

• High logic capacity: 132,540 logic elements enable implementation of large-scale digital designs without immediate need for multi-FPGA partitioning.
• Substantial embedded memory: Approximately 6.75 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 534 user I/Os provide flexibility for complex external interfaces and high integration density on the PCB.
• Compact, board-friendly package: 780‑ball FCBGA (29×29) supports surface-mount assembly while keeping package footprint optimized for dense system boards.
• Commercial operation and compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial applications and supply-chain requirements.

Why Choose EP2S130F780C5N?

The EP2S130F780C5N positions itself as a high-capacity Stratix II FPGA option for engineers who need a combination of large programmable logic resources, significant embedded RAM, and a high I/O count in a compact FCBGA form factor. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard electronic products and development projects.

This device is well suited to teams designing complex digital systems where integration density, memory on-chip, and extensive external connectivity are primary considerations.

Request a quote or submit an inquiry to purchase the EP2S130F780C5N and evaluate its fit for your next high-density FPGA design.