EP2S130F1508I4N

IC FPGA 1126 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 1126 6747840 132540 1508-BBGA, FCBGA

Quantity 431 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1508-BBGA, FCBGANumber of I/O1126Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6627Number of Logic Elements/Cells132540
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6747840

Overview of EP2S130F1508I4N – Stratix® II FPGA, 132,540 logic elements, ~6.75 Mbits RAM, 1,126 I/Os, 1508-BBGA

The EP2S130F1508I4N is a Stratix® II field programmable gate array (FPGA) provided in a 1508-ball FCBGA package. It combines a large programmable logic fabric, substantial on-chip memory, and a high I/O count to address demanding industrial designs.

Built on the Stratix II architecture described in the device handbook, the device integrates logic array blocks, dedicated DSP structures, configurable clocking (PLLs), and advanced I/O capabilities that support system-level integration for communications, signal processing, and other compute-intensive embedded applications.

Key Features

  • Logic Capacity  Provides 132,540 logic elements and 6,627 logic array blocks (LABs) for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 6.75 Mbits of on‑chip RAM to support frame buffers, FIFOs, and local data storage for high-throughput designs.
  • I/O Density  1126 user I/Os available to drive wide external interfaces and multi-channel signal paths.
  • Voltage Supply  Operates from a 1.15 V to 1.25 V core supply, enabling integration into regulated power architectures.
  • Package & Mounting  1508-BBGA FCBGA package (supplier device package: 1508-FBGA, FC 40×40) with surface-mount mounting for board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
  • Architecture & Tools  Device documentation (Stratix II Device Handbook) describes programmable resources such as DSP blocks, PLLs and clock networks, multi-volt I/O support, on-chip termination, and configuration/testing features including JTAG and embedded logic analysis.
  • Environmental Compliance  RoHS-compliant construction to support environmentally conscious manufacturing.

Typical Applications

  • High‑Performance Signal Processing  Leverage the device’s large logic capacity and embedded memory to implement multi-channel DSP pipelines and data path acceleration.
  • Communications & Networking  Use the high I/O count and advanced I/O features for interfacing with high-speed transceivers, parallel links, and multiport network fabrics.
  • Industrial Controls  Industrial temperature rating and flexible I/O make the FPGA suitable for motor control, automation controllers, and robust factory‑floor systems.
  • Embedded Prototyping & Custom SoCs  Large logic and memory resources enable hardware prototyping and custom system-on-chip implementations that consolidate multiple functions into a single programmable device.

Unique Advantages

  • Large, Programmable Fabric: 132,540 logic elements and 6,627 LABs provide the capacity to implement complex algorithms and multi-function systems within one device.
  • Substantial On‑Chip Memory: Approximately 6.75 Mbits of embedded RAM reduces external memory dependence and improves data throughput for latency-sensitive tasks.
  • High I/O Count: 1,126 I/Os allow broad external connectivity without extensive multiplexing or additional interface ICs, simplifying board design.
  • Industrial Robustness: Rated operation from −40 °C to 100 °C and surface-mount FCBGA packaging support deployments in demanding environments.
  • Documented Architecture: Backed by the Stratix II Device Handbook and Altera documentation covering logic array structure, DSP blocks, PLLs, I/O standards, and configuration/testing features for engineering reference.
  • RoHS Compliance: Environmentally compliant materials ease integration into modern manufacturing workflows.

Why Choose EP2S130F1508I4N?

The EP2S130F1508I4N positions itself as a high-capacity Stratix II FPGA option for engineers who need significant programmable logic, abundant embedded memory, and extensive I/O in an industrial-temperature device. Its combination of logic elements, multi-megabit on-chip RAM, and documented architectural features makes it suitable for consolidating complex functions and accelerating data-path workloads.

Design teams targeting communications, signal processing, industrial automation, or custom embedded systems will find the device’s resource balance and package options align with board-level integration and long-term deployment needs, supported by the Stratix II handbook and Altera documentation.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the EP2S130F1508I4N.

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