EP2S130F780C5

The EP2S130F780C5 is a Stratix® II Field Programmable Gate Array (FPGA) from Altera delivered in a 780-ball BBGA package. It provides a high logic density device with substantial on-chip memory and a large number of I/O for complex digital designs.

Key attributes visible from the device data include 132,540 logic elements, approximately 6.75 Mbits of embedded memory, 534 user I/O, and a 1.15 V–1.25 V core supply range. The device is supplied in a surface-mount 780-BBGA (29 × 29 mm) package and is RoHS compliant.

Key Features

• Core Logic 132,540 logic elements for high-density digital integration and complex programmable logic implementations.
• Embedded Memory Approximately 6.75 Mbits of on-chip RAM to support buffer, FIFO, and local data storage requirements.
• I/O Capacity 534 user I/O pins to accommodate broad interfacing needs and multiple parallel connections.
• Power Core voltage supply range of 1.15 V to 1.25 V to match specified power-rail requirements.
• Package & Mounting 780-ball BBGA (supplier device package: 780-FBGA, 29 × 29 mm); surface-mount mounting suitable for modern PCB assembly.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS compliant, meeting lead-free material requirements for environmental compliance.

Typical Applications

• High-density digital systems — Consolidating large amounts of programmable logic into a single device using 132,540 logic elements.
• Memory-intensive functions — Designs requiring substantial on-chip storage, leveraging approximately 6.75 Mbits of embedded RAM.
• I/O-heavy interfaces — Systems that need many parallel or diverse external connections using 534 I/O pins.
• Board-level integration — Surface-mount 780-BBGA package suitable for compact, PCB-mounted FPGA implementations.

Unique Advantages

• High logic capacity: 132,540 logic elements enable integration of complex logic functions without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 6.75 Mbits of embedded memory reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O: 534 user I/O pins support wide parallel interfaces and flexible external connectivity.
• Compact surface-mount package: 780-BBGA (29 × 29 mm) allows high-density PCB layouts while maintaining a large device footprint.
• RoHS compliant: Meets lead-free material requirements for environmentally conscious designs.
• Commercial temperature range: Rated 0 °C to 85 °C for standard commercial applications.

Why Choose EP2S130F780C5?

The EP2S130F780C5 positions itself as a high-capacity Stratix II FPGA option for designs that require significant programmable logic, substantial embedded memory, and a large number of I/O. The combination of 132,540 logic elements, approximately 6.75 Mbits of on-chip RAM, and 534 I/O provides a balance of integration and interfacing capability for demanding digital applications.

Packaged in a 780-BBGA surface-mount form factor with a 1.15 V–1.25 V core supply and commercial temperature rating, this device is suited to engineering teams seeking a RoHS-compliant, high-density FPGA for compact board-level implementations.

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