EP2S15F484C3N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 342 419328 15600 484-BBGA |
|---|---|
| Quantity | 639 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 342 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 780 | Number of Logic Elements/Cells | 15600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 419328 |
Overview of EP2S15F484C3N – Stratix II FPGA, 15,600 logic elements, 342 I/O, 484-BBGA
The EP2S15F484C3N is an Intel Stratix® II field-programmable gate array (FPGA) designed for applications requiring a high logic density, extensive I/O, and flexible on-chip resources. Built on the Stratix II family architecture, this device integrates 15,600 logic elements, programmable DSP resources and clocking structures suitable for signal processing and high-speed interfacing.
Targeted market segments include communications, data-path and memory-interface designs, and complex embedded processing tasks where a high pin-count, reconfigurable solution provides design flexibility and rapid iteration.
Key Features
- Logic Capacity Provides 15,600 logic elements for implementing complex logic, control and datapath functions.
- Embedded Memory Approximately 0.4 Mbits of on-chip RAM (419,328 total bits) for buffering, FIFOs, and local data storage.
- High I/O Count 342 I/O pins to support wide parallel interfaces and multiple high-density peripheral connections.
- Package & Mounting 484-BBGA package (supplier package listed as 484-FBGA, 23×23) with surface-mount compatibility for compact board designs.
- Core Voltage Core supply range of 1.15 V to 1.25 V to match system power rails and design requirements.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation suitable for commercial applications.
- Clocking & PLLs Stratix II clock networks and PLLs for flexible clock management and distribution across the device.
- DSP & High-Speed I/O Support Device architecture includes DSP-oriented resources and high-speed I/O features documented for Stratix II devices, enabling signal processing and fast data transfers.
- Configuration & Test Support Supports IEEE Std. 1149.1 JTAG boundary-scan and device configuration/test flows referenced in the Stratix II documentation.
- Regulatory Status RoHS-compliant.
Typical Applications
- High-speed communications Implements protocol processing, data-path aggregation and custom packet handling where extensive I/O and programmable logic are required.
- Signal processing Leverages on-chip DSP structures and embedded RAM for filtering, transforms and real-time data manipulation.
- External memory interfacing Supports designs requiring complex external RAM interfaces and buffering, using on-chip memory and dedicated I/O resources.
- Prototyping and custom logic integration Acts as a reprogrammable platform for validating IP, integrating multiple functions, and accelerating product development cycles.
Unique Advantages
- High logic density: 15,600 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
- Substantial on-chip buffering: Approximately 0.4 Mbits of embedded memory helps minimize external memory dependencies and shortens data paths.
- Extensive I/O resources: 342 I/O pins accommodate wide buses and multiple high-pin-count peripherals without multiplexing constraints.
- Flexible clocking and DSP support: Built-in PLLs and DSP-oriented architecture allow deterministic timing and efficient signal-processing implementations.
- Commercial-grade reliability: Rated for 0 °C to 85 °C and RoHS-compliant for standard commercial deployments.
- Surface-mount, high-density package: 484-BBGA (484-FBGA, 23×23) enables compact PCB layouts and dense system integration.
Why Choose EP2S15F484C3N?
The EP2S15F484C3N offers a balanced mix of logic capacity, embedded memory and high I/O count within the Stratix II family architecture. Its combination of programmable DSP resources, flexible clocking and comprehensive I/O makes it well suited for communications, data-path processing and complex embedded applications that demand integration and reconfigurability.
For teams building prototypes, validating custom IP, or integrating multiple functions into a single FPGA, this device provides a commercially rated, RoHS-compliant option with documented configuration and test support in the Stratix II handbook.
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