EP2S15F484C3N

IC FPGA 342 I/O 484FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 342 419328 15600 484-BBGA

Quantity 639 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O342Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs780Number of Logic Elements/Cells15600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits419328

Overview of EP2S15F484C3N – Stratix II FPGA, 15,600 logic elements, 342 I/O, 484-BBGA

The EP2S15F484C3N is an Intel Stratix® II field-programmable gate array (FPGA) designed for applications requiring a high logic density, extensive I/O, and flexible on-chip resources. Built on the Stratix II family architecture, this device integrates 15,600 logic elements, programmable DSP resources and clocking structures suitable for signal processing and high-speed interfacing.

Targeted market segments include communications, data-path and memory-interface designs, and complex embedded processing tasks where a high pin-count, reconfigurable solution provides design flexibility and rapid iteration.

Key Features

  • Logic Capacity  Provides 15,600 logic elements for implementing complex logic, control and datapath functions.
  • Embedded Memory  Approximately 0.4 Mbits of on-chip RAM (419,328 total bits) for buffering, FIFOs, and local data storage.
  • High I/O Count  342 I/O pins to support wide parallel interfaces and multiple high-density peripheral connections.
  • Package & Mounting  484-BBGA package (supplier package listed as 484-FBGA, 23×23) with surface-mount compatibility for compact board designs.
  • Core Voltage  Core supply range of 1.15 V to 1.25 V to match system power rails and design requirements.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation suitable for commercial applications.
  • Clocking & PLLs  Stratix II clock networks and PLLs for flexible clock management and distribution across the device.
  • DSP & High-Speed I/O Support  Device architecture includes DSP-oriented resources and high-speed I/O features documented for Stratix II devices, enabling signal processing and fast data transfers.
  • Configuration & Test Support  Supports IEEE Std. 1149.1 JTAG boundary-scan and device configuration/test flows referenced in the Stratix II documentation.
  • Regulatory Status  RoHS-compliant.

Typical Applications

  • High-speed communications  Implements protocol processing, data-path aggregation and custom packet handling where extensive I/O and programmable logic are required.
  • Signal processing  Leverages on-chip DSP structures and embedded RAM for filtering, transforms and real-time data manipulation.
  • External memory interfacing  Supports designs requiring complex external RAM interfaces and buffering, using on-chip memory and dedicated I/O resources.
  • Prototyping and custom logic integration  Acts as a reprogrammable platform for validating IP, integrating multiple functions, and accelerating product development cycles.

Unique Advantages

  • High logic density: 15,600 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
  • Substantial on-chip buffering: Approximately 0.4 Mbits of embedded memory helps minimize external memory dependencies and shortens data paths.
  • Extensive I/O resources: 342 I/O pins accommodate wide buses and multiple high-pin-count peripherals without multiplexing constraints.
  • Flexible clocking and DSP support: Built-in PLLs and DSP-oriented architecture allow deterministic timing and efficient signal-processing implementations.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C and RoHS-compliant for standard commercial deployments.
  • Surface-mount, high-density package: 484-BBGA (484-FBGA, 23×23) enables compact PCB layouts and dense system integration.

Why Choose EP2S15F484C3N?

The EP2S15F484C3N offers a balanced mix of logic capacity, embedded memory and high I/O count within the Stratix II family architecture. Its combination of programmable DSP resources, flexible clocking and comprehensive I/O makes it well suited for communications, data-path processing and complex embedded applications that demand integration and reconfigurability.

For teams building prototypes, validating custom IP, or integrating multiple functions into a single FPGA, this device provides a commercially rated, RoHS-compliant option with documented configuration and test support in the Stratix II handbook.

Request a quote or submit an inquiry to receive pricing and availability information for EP2S15F484C3N.

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