EP2S130F780I4N

The EP2S130F780I4N is an Intel Stratix II family FPGA designed for high-density digital designs. The device integrates a large logic fabric, substantial on-chip memory, and a broad I/O count to support complex system integration and board-level consolidation.

With 132,540 logic elements and approximately 6.7 Mbits of embedded memory, this industrial-grade, surface-mount BGA package targets applications that require dense logic, extensive I/O, and reliable operation across an extended temperature range.

Key Features

• Core Logic: 132,540 logic elements across 6,627 LABs, providing the density needed for large custom digital designs and multi-function integration.
• Embedded Memory: Approximately 6.7 Mbits of on-chip RAM (6,747,840 bits) to support buffering, FIFOs, and embedded data storage without relying solely on external memory.
• I/O Capacity: 534 user I/O pins, enabling rich external interfacing and parallel connectivity for peripheral and memory buses.
• Power Supply: Core supply voltage range of 1.15 V to 1.25 V to match targeted FPGA core power rails and system power design.
• Package & Mounting: 780-ball BGA (780-BBGA) with supplier package noted as 780-FBGA (29×29), supplied as a surface-mount device for compact PCB integration.
• Industrial Temperature Rating: Qualified for operation from −40 °C to 100 °C, suitable for demanding operating environments.
• Environmental Compliance: RoHS compliant, supporting lead-free manufacturing and regulatory requirements.
• Stratix II Architecture: Documented Stratix II features in the device handbook—memory block structures, DSP blocks, PLLs, and advanced I/O capabilities—provide architectural context for system design.

Typical Applications

• Industrial Control: Dense logic and robust temperature rating enable complex control and machine-automation functions on a single FPGA.
• Signal Processing: The Stratix II architecture includes DSP block support and sizable embedded memory for algorithm acceleration and streaming data handling.
• Communications Infrastructure: Extensive I/O and clocking resources suit protocol bridging, data formatting, and interface aggregation in network equipment.
• Memory-Intensive Systems: Large on-chip RAM and external memory interfacing capability support buffering and high-throughput data paths.

Unique Advantages

• High Logic Density: 132,540 logic elements allow consolidation of multiple functions and reduce the need for additional devices on the board.
• Substantial On-Chip Memory: Approximately 6.7 Mbits of embedded RAM reduces external memory dependence and simplifies timing and board layout.
• Extensive I/O Count: 534 I/Os provide flexibility for parallel buses, multi-channel interfaces, and mixed-signal partitioning.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in harsh and temperature-variable environments.
• Compact BGA Integration: 780-ball BGA (29×29) enables high-pin-count integration in a compact footprint for space-constrained designs.
• Standards-Based Documentation: Backed by the Stratix II device handbook and Altera/Intel documentation for design, configuration, and timing guidance.

Why Choose EP2S130F780I4N?

The EP2S130F780I4N positions itself as a high-density Stratix II FPGA option for designs that require large logic capacity, ample embedded memory, and broad I/O resources in an industrial-grade package. Its combination of 132,540 logic elements, approximately 6.7 Mbits of on-chip RAM, and 534 I/Os makes it suitable for system-level integration where board count and external components must be minimized.

Engineers and procurement teams selecting this device gain a documented architecture with Stratix II device handbook guidance, RoHS compliance, and a package format optimized for surface-mount production. The device is aimed at projects demanding scalable logic, significant on-chip buffering, and reliable operation across extended temperatures.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for EP2S130F780I4N.