EP2S15F484C4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 342 419328 15600 484-BBGA |
|---|---|
| Quantity | 162 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 342 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 780 | Number of Logic Elements/Cells | 15600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 419328 |
Overview of EP2S15F484C4 – Stratix® II Field Programmable Gate Array (FPGA) IC 342 419328 15600 484-BBGA
The EP2S15F484C4 is a Stratix® II FPGA from Intel designed for high-density, programmable logic applications. It integrates 15,600 logic elements across 780 LABs and provides on-chip memory and high pin-count I/O to support complex digital designs.
This commercial-grade, surface-mount device targets applications requiring substantial logic resources, embedded RAM, and flexible I/O. Key value propositions include high logic density, plentiful I/O, and integrated architecture elements described in the Stratix II device handbook (PLLs, DSP resources, advanced I/O and configuration support).
Key Features
- Logic Capacity 15,600 logic elements distributed across 780 LABs for implementing sizeable combinational and sequential logic.
- Embedded Memory 419,328 total RAM bits of on-chip memory (approximately 0.419 Mbits) for data buffering, FIFOs, and local storage.
- I/O Resources 342 programmable I/O pins to support wide bus interfaces, parallel connectivity, and diverse signaling requirements.
- Package & Mounting 484-BBGA package; supplier device package listed as 484-FBGA (23×23). Surface-mount mounting type suitable for modern PCB assembly.
- Supply Voltage Core operating range of 1.15 V to 1.25 V to match system power domains.
- Operating Temperature Commercial operating range from 0 °C to 85 °C.
- Configuration & Test Support Device handbook documents configuration options, IEEE 1149.1 JTAG boundary-scan support, and embedded logic analysis (SignalTap II) features.
- Architecture Elements Stratix II architecture includes dedicated blocks such as digital signal processing resources, PLL and clock networks, multi-volt I/O support and on-chip termination as described in the device handbook.
- Environmental RoHS compliant.
Typical Applications
- Communications & Networking High logic density and 342 I/Os support protocol bridging, packet processing, and custom interface implementations.
- Digital Signal Processing On-chip RAM and documented DSP block architecture enable implementation of data buffering and processing pipelines.
- Prototyping & System Integration Flexible configuration options, JTAG boundary-scan, and embedded logic analysis support make the device suitable for board-level prototyping and system integration tasks.
- Custom Control & Glue Logic 15,600 logic elements and abundant I/O allow consolidation of control, sequencing, and interface logic into a single programmable device.
Unique Advantages
- High logic density: 15,600 logic elements across 780 LABs deliver capacity for complex digital designs without immediate need for external logic.
- Ample on-chip memory: 419,328 RAM bits (approximately 0.419 Mbits) provide local storage for buffering, FIFOs, and small data structures.
- Extensive I/O count: 342 I/Os enable broad external connectivity and parallel interfaces, reducing board-level glue logic.
- Documented architecture features: Stratix II handbook coverage of PLLs, DSP blocks, multi-volt I/O, and configuration/testing options supports informed system design.
- Compact, manufacturable package: 484-BBGA / 484-FBGA (23×23) surface-mount package fits modern PCB assembly flows.
- Regulatory & environmental compliance: RoHS compliance supports use in assemblies targeting lead-free manufacturing processes.
Why Choose EP2S15F484C4?
The EP2S15F484C4 positions itself as a high-density Stratix II FPGA option for designs that require a balance of logic capacity, embedded memory, and a high number of I/Os within a compact surface-mount package. Its documented architecture elements—PLL and clock networks, DSP resources, multi-volt I/O support, and configuration/test features—help engineers integrate sophisticated digital functions while relying on a well-described device family.
This device is well suited for teams building communications interfaces, DSP pipelines, or consolidated control logic who need predictable commercial-grade operation (0 °C to 85 °C), core supply compatibility (1.15 V–1.25 V), and RoHS-compliant manufacturing.
If you would like pricing, availability, or to request a formal quote for EP2S15F484C4, submit your inquiry and include quantity and required lead time for a prompt response.

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