EP2S130F1508C5

The EP2S130F1508C5 is a Stratix® II FPGA device providing a high-density, reprogrammable logic platform. Built on the Stratix II architecture, the device integrates a large number of logic elements, substantial embedded RAM and extensive I/O to support complex digital designs.

Typical uses for this device include compute- and I/O-intensive functions such as digital signal processing, external memory interfacing and high-speed data-routing tasks where logic density, embedded memory and flexible I/O are required. Key device-level attributes include 132,540 logic elements, approximately 6.75 Mbits of embedded memory, 1,126 I/O pins and a 1508-BBGA (FCBGA) package.

Key Features

• Core Logic 132,540 logic elements (cells) to implement complex combinational and sequential logic structures and custom datapaths.
• Embedded Memory Approximately 6.75 Mbits of on-chip RAM to support buffers, FIFOs and local data storage for high-throughput designs.
• I/O Capacity 1,126 I/O pins to support broad external connectivity and multi-channel interfaces.
• Power Supply Supported device core voltage range of 1.15 V to 1.25 V for system power budgeting and supply design.
• Package & Mounting Surface-mount 1508-BBGA (FCBGA); supplier device package listed as 1508-FBGA, FC (40×40) for compact, high-density board integration.
• Operating Grade & Temperature Commercial grade with an operating temperature range of 0°C to 85°C suitable for standard commercial electronics environments.
• Family-Level Capabilities (from Stratix II handbook) Architecture documentation describes integrated features such as digital signal processing blocks, PLLs and clock networks, high-speed differential I/O support, on-chip termination and JTAG boundary-scan for configuration and test.
• RoHS Compliance Device is RoHS compliant to meet common environmental regulatory requirements.

Typical Applications

• DSP Acceleration Use the device’s high logic density and on-chip RAM to implement signal-processing pipelines and algorithm acceleration.
• External Memory Interfacing Implement memory controllers and high-bandwidth interfaces leveraging the device’s embedded memory and I/O resources.
• High-Speed Data Routing Deploy for multi-channel data aggregation, protocol bridging or custom packet processing using abundant I/O and programmable logic.
• Custom Logic and Prototyping Implement bespoke hardware functions and system prototypes where reprogrammability and high gate count are required.

Unique Advantages

• High logic density: 132,540 logic elements enable implementation of large, integrated designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 6.75 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage needs.
• Extensive I/O footprint: 1,126 I/O pins provide design flexibility for connecting multiple peripherals, memory buses and high-speed links.
• Compact packaged solution: 1508-BBGA (FCBGA) package supports high-density board layouts in space-constrained systems.
• Comprehensive family features: Stratix II architecture includes DSP blocks, PLLs and high-speed I/O capabilities documented in the device handbook to support advanced timing and interface requirements.
• Commercial temperature rating: Rated 0°C to 85°C for consistent operation across standard commercial environments.

Why Choose EP2S130F1508C5?

The EP2S130F1508C5 positions itself as a high-density Stratix II FPGA option for designs that require significant programmable logic, embedded memory and broad I/O. Its mix of 132,540 logic elements, approximately 6.75 Mbits of on-chip RAM and 1,126 I/O pins makes it suitable for compute- and I/O-heavy applications such as DSP acceleration, memory interfacing and complex data-routing tasks.

Designed for commercial applications and packaged in a 1508-BBGA surface-mount form factor, this device offers a compact, RoHS-compliant solution that aligns with Stratix II family-level features—such as DSP blocks, PLLs and high-speed I/O—documented in the device handbook.

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