EP2S130F1508C3N

The EP2S130F1508C3N is a Stratix® II FPGA IC from Intel designed for commercial-grade system designs requiring high logic density and extensive I/O. This device integrates 132,540 logic elements across 6,627 logic array blocks and approximately 6.75 Mbits of embedded RAM, enabling large, on-chip digital systems and buffering.

With 1,126 user I/Os, a 1508-BBGA FCBGA package (supplier package: 1508-FBGA, FC 40×40), and a core supply range of 1.15 V to 1.25 V, the EP2S130F1508C3N targets high-pin-count applications where integration density, on-chip memory, and configurable logic resources are primary requirements. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.

Key Features

• High Logic Capacity  132,540 logic elements arranged across 6,627 logic array blocks to implement complex digital designs and dense logic fabrics.
• Embedded Memory  Approximately 6.75 Mbits of on-chip RAM for data buffering, FIFOs, and local storage to support large state machines and memory-mapped functions.
• Extensive I/O  1,126 user I/O pins suitable for designs requiring large external connectivity and parallel interfaces.
• Power and Operating Range  Core supply voltage from 1.15 V to 1.25 V; commercial operating temperature range of 0 °C to 85 °C.
• Package and Mounting  1508-BBGA, FCBGA package (supplier device package: 1508-FBGA, FC 40×40) with surface-mount mounting type for compact board-level integration.
• Standards and Compliance  RoHS compliant to meet lead-free and environmental requirements for commercial electronic products.

Typical Applications

• High-density digital processing  Use the large logic element count and abundant on-chip RAM to implement complex state machines, protocol stacks, and custom compute pipelines.
• Memory interfacing and buffering  Embedded RAM and extensive I/O enable local buffering and external memory interfacing in systems that require large temporary storage.
• Multi-I/O control systems  1,126 I/Os support designs with numerous parallel interfaces, signal aggregation, or large connector pinouts.
• Prototyping and system integration  Commercial temperature-rated FPGA suitable for development platforms and integration into production electronics where commercial-grade operation is required.

Unique Advantages

• Large on-chip logic density: 132,540 logic elements provide the headroom needed to implement multi-function systems on a single FPGA, reducing external FPGA count and system complexity.
• Significant embedded memory: Approximately 6.75 Mbits of RAM allows for substantial local data storage, minimizing bandwidth requirements to external memory in many designs.
• Very high I/O count: 1,126 I/Os enable broad external connectivity and facilitate parallel interfaces, sensor arrays, and wide datapath implementations.
• Compact, surface-mount package: 1508-BBGA/1508-FBGA (40×40) packaging supports dense PCB layouts while maintaining the pin count required for complex systems.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for commercial electronics production and regulatory requirements.

Why Choose EP2S130F1508C3N?

The EP2S130F1508C3N delivers a balance of high logic capacity, substantial on-chip memory, and a very large I/O complement in a compact FCBGA package — a combination well suited to commercial systems that demand integration and flexibility. Its specification set makes it appropriate for designers building complex digital processing, high-bandwidth buffering, or multi-interface control systems.

Selected for projects that require scalable logic resources and extensive connectivity, this Stratix II FPGA supports integration-driven designs and long-term platform development where vendor documentation and device family support are part of the design lifecycle.

Request a quote or submit a pricing inquiry for EP2S130F1508C3N to begin integrating this Stratix® II FPGA into your next commercial design.