EP2S180F1020C3

The EP2S180F1020C3 is an Intel Stratix® II Field Programmable Gate Array (FPGA) in a 1020-BBGA / 1020-FBGA (33×33) package, designed for surface-mount applications. It delivers a high logic density architecture with substantial embedded memory and a large I/O count for demanding commercial designs.

Built on the Stratix II device family architecture, this FPGA combines programmable logic, on-chip memory, DSP and clocking resources (as documented in the Stratix II device handbook) to address designs that require high gate counts, significant embedded RAM, and extensive external interfacing.

Key Features

• Core Logic  8,970 LABs providing approximately 179,400 logic elements for complex digital designs.
• Embedded Memory  Approximately 9.38 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Capacity  742 I/O pins to support wide parallel interfaces and large I/O bank requirements.
• Stratix II Architecture  Device handbook coverage includes DSP blocks, TriMatrix memory, PLLs and advanced clock networks for sophisticated timing and signal-processing implementations.
• Power Supply  Core voltage operation from 1.15 V to 1.25 V to match system power architecture requirements.
• Package & Mounting  1020-BBGA package (supplier package: 1020-FBGA 33×33) with surface-mount mounting for compact board-level integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C ambient operation, suitable for commercial-class systems.
• Standards & Testability  Stratix II documentation includes JTAG boundary-scan, configuration options, and on-chip debugging and testing features as part of the device family handbook.
• Environmental Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High-density logic systems  Use the large logic-element count for complex protocol processing, glue logic, and custom hardware acceleration.
• Data buffering and local memory  Leverage approximately 9.38 Mbits of embedded RAM for packet buffering, FIFOs, and on-chip data manipulation.
• Interfaces with large I/O requirements  742 I/O pins enable broad external connectivity for multi-channel interfaces and parallel buses.
• Timing-sensitive designs  Built-in PLLs and hierarchical clock networks from the Stratix II family support precise clocking strategies and timing control.

Unique Advantages

• High logic density: Approximately 179,400 logic elements provide room to implement complex functions on a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 9.38 Mbits of embedded RAM simplifies data-path designs and lowers dependence on external memory.
• Extensive I/O capability: 742 I/O pins enable direct connection to multiple peripherals and wide external buses without additional interface chips.
• Stratix II family features: Access to DSP resources, advanced clocking, and high-speed I/O support documented in the Stratix II handbook, enabling a broad set of system functions.
• Commercial-grade operation: 0 °C to 85 °C rating and RoHS compliance support standard commercial deployments and regulatory requirements.
• Compact package: 1020-BBGA (33×33) surface-mount package enables high-density PCB layouts for space-constrained applications.

Why Choose EP2S180F1020C3?

The EP2S180F1020C3 combines the Stratix II device family's architectural capabilities with a very large logic element count, substantial embedded memory, and a high I/O count in a compact 1020-BBGA package. That combination makes it a strong choice for commercial designs that require dense programmable logic, on-chip storage and broad external interfacing while maintaining a compact board footprint.

Designed in accordance with Stratix II device documentation, this FPGA is suitable for teams needing a scalable, well-documented platform for complex digital signal processing, buffering, and multi-interface implementations where commercial-grade temperature and RoHS compliance are appropriate.

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