EP2S180F1020I4N

IC FPGA 742 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 742 9383040 179400 1020-BBGA

Quantity 589 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O742Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8970Number of Logic Elements/Cells179400
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9383040

Overview of EP2S180F1020I4N – Stratix II FPGA 1020-BBGA

The EP2S180F1020I4N is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1020-BBGA surface-mount package. It provides a high-capacity programmable fabric with 179,400 logic elements and 8,970 logic array blocks (LABs), plus extensive on-chip resources for complex digital designs.

Designed for industrial-grade applications, the device includes approximately 9.38 Mbits of embedded memory and 742 I/O pins, operates from a 1.15 V to 1.25 V core supply, and supports an operating temperature range of −40 °C to 100 °C. The Stratix II family handbook and device datasheet enumerate the FPGA’s architecture and configuration features for system integration and development.

Key Features

  • Core Capacity  179,400 logic elements and 8,970 logic array blocks (LABs) provide the programmable fabric needed for large, complex designs.
  • Embedded Memory  Approximately 9.38 Mbits of on-chip RAM for packet buffers, FIFOs, and intermediate storage within custom datapaths.
  • I/O Density  742 I/O pins delivered in a 1020-BBGA (supplier package 1020-FBGA, 33×33) footprint for rich peripheral and bus connectivity.
  • Clocking & DSP  Device handbook describes enhanced and fast PLLs, global and hierarchical clocking, and DSP block interfaces for high-performance timing and signal processing tasks.
  • Advanced I/O Support  Documentation covers double data rate I/O, high-speed differential I/O, programmable drive strength, on‑chip termination, and multi-voltage I/O interfacing.
  • Configuration & Debug  Includes IEEE 1149.1 JTAG boundary-scan support and SignalTap II embedded logic analyzer capability as detailed in the Stratix II handbook.
  • Power & Mounting  Surface-mount package with a core voltage supply range of 1.15 V to 1.25 V and specifications for hot-socketing and power-on reset in the device documentation.
  • Industrial Grade & Compliance  Specified operating temperature range of −40 °C to 100 °C and RoHS compliance for industrial deployments.

Typical Applications

  • High‑performance signal processing: Use the DSP block interface and embedded memory to implement filtering, transforms, and real‑time data paths.
  • High‑speed memory interfaces: The device supports external RAM interfacing and on‑chip memory structures for complex memory controller designs.
  • Complex digital systems & prototyping: Large logic capacity and abundant I/O make the FPGA suitable for system prototyping, protocol bridging, and custom logic consolidation.
  • Industrial control & automation: Industrial temperature rating and robust I/O support enable deployment in factory automation, motion control, and process control equipment.

Unique Advantages

  • High logic capacity: 179,400 logic elements reduce the need for multi‑chip implementations and simplify system design integration.
  • Substantial embedded memory: Approximately 9.38 Mbits of on‑chip RAM supports large buffers and local data storage for latency‑sensitive applications.
  • Extensive I/O count: 742 I/Os in a 1020‑BBGA package provides flexibility for parallel interfaces, memory buses, and mixed‑signal front ends.
  • Deterministic temperature range: Specified operation from −40 °C to 100 °C aligns with industrial deployment and reliability expectations.
  • Configurable clocking and DSP support: Built‑in PLLs, hierarchical clocking, and DSP block interfaces in the Stratix II architecture facilitate high‑speed, low‑jitter designs.
  • Standards and debug support: JTAG boundary‑scan and embedded logic analyzer features documented for the family streamline validation and production testing.

Why Choose EP2S180F1020I4N?

The EP2S180F1020I4N combines large logic capacity, substantial embedded memory, and broad I/O resources in a compact 1020‑BBGA footprint well suited for complex digital and industrial designs. With core documentation provided in the Stratix II device handbook, designers gain access to detailed architectural guidance covering memory, DSP, clock networks, and configuration options.

This device is positioned for projects that require high integration, deterministic industrial operation, and a documented architecture for advanced timing, I/O, and signal processing implementations. It is a practical choice for engineering teams building scalable, performance‑oriented FPGA solutions backed by Intel’s Stratix II family documentation.

Request a quote or submit a sourcing inquiry to obtain pricing, availability, and additional technical support for the EP2S180F1020I4N.

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