EP2S30F484C3

The EP2S30F484C3 is a Stratix® II field-programmable gate array (FPGA) from Intel designed for commercial embedded and system applications. Built on the Stratix II device architecture, this FPGA combines a high logic density with on-chip memory and extensive I/O to support signal processing, communications, and complex control functions.

This device offers 33,880 logic elements, approximately 1.37 Mbits of embedded memory, and 342 I/O pins in a compact 484-BBGA / 484-FBGA (23×23) package. It operates from a core voltage range of 1.15 V to 1.25 V and is specified for commercial temperature operation (0 °C to 85 °C), with RoHS compliance for environmental compatibility.

Key Features

• Core Logic 33,880 logic elements provide the capacity for complex FPGA designs and high-density integration of custom logic functions.
• Embedded Memory Approximately 1.37 Mbits of on-chip RAM for buffers, FIFOs, and embedded storage to support data-intensive processing.
• High I/O Count 342 user I/O pins enable broad external interfacing for parallel buses, transceivers, and mixed-signal front ends.
• Power Supply Core operating voltage range of 1.15 V to 1.25 V to match system power architectures and regulator designs.
• Package & Mounting 484-ball BGA package (also listed as 484-FBGA, 23×23) in a surface-mount format for compact PCB integration.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Standards & Compliance RoHS compliant for environmental regulation conformity.
• Stratix II Architecture (datasheet) Device family documentation references advanced features such as DSP blocks, PLLs, hierarchical clocking, and high-speed I/O structures for performant system design.

Typical Applications

• High-performance signal processing — Use the device’s logic density and on-chip memory to implement DSP pipelines, filters, and real-time data manipulation.
• Communications infrastructure — Leverage the large I/O count and Stratix II I/O architecture for packet processing, protocol bridging, and interface aggregation.
• Embedded system control — Integrate control logic, state machines, and peripheral interfaces into a single FPGA to simplify board-level design.
• Prototyping and custom logic — Suitable for development platforms and custom hardware accelerators where reprogrammability and capacity matter.

Unique Advantages

• High logic capacity: 33,880 logic elements enable dense integration of custom digital functions, reducing the need for multiple discrete devices.
• Substantial embedded memory: Approximately 1.37 Mbits of on-chip RAM supports buffering and local data storage, improving throughput for streaming and bursty workloads.
• Extensive external connectivity: 342 I/O pins provide flexibility for parallel interfaces, external memory buses, and mixed-signal front ends.
• Compact BGA package: The 484-ball FBGA (23×23) package delivers a small PCB footprint with high pin density for space-constrained designs.
• Commercial operating range: Rated for 0 °C to 85 °C, matching a broad set of commercial and enterprise system environments.
• Regulatory and environmental compliance: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose EP2S30F484C3?

The EP2S30F484C3 positions itself as a capable Stratix II FPGA option for designers who need significant logic capacity, embedded memory, and plentiful I/O in a compact surface-mount BGA package. Its combination of 33,880 logic elements, approximately 1.37 Mbits of on-chip RAM, and 342 I/O pins makes it well suited for signal processing, communications, and complex embedded control tasks within commercial temperature ranges.

Choosing this device provides a pathway to consolidate functions, reduce board-level component count, and leverage the Stratix II device family documentation—covering DSP blocks, PLLs, and high-speed I/O structures—to support robust implementation and system integration.

Request a quote or submit a pricing inquiry to evaluate the EP2S30F484C3 for your next design and confirm availability and lead times.