EP2S30F672C5

The EP2S30F672C5 is a Stratix II family FPGA from Intel, providing a programmable logic platform for system integration and signal processing tasks. It implements the Stratix II architecture documented in the device handbook, including logic array blocks, on-chip memory, DSP capabilities, PLLs and advanced I/O structures.

Built for designs requiring substantial logic capacity and flexible I/O, this device offers 33,880 logic elements, approximately 1.37 Mbits of embedded memory, and 500 I/O pins in a 672-BBGA (27×27) surface-mount package. The device operates from a core supply of 1.15 V to 1.25 V and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity 33,880 logic elements implemented across 1,694 logic array blocks (LABs) to support complex combinational and sequential designs.
• Embedded Memory Approximately 1.37 Mbits (1,369,728 bits) of on-chip RAM for buffers, FIFOs, and state storage.
• High I/O Count 500 user I/O pins enabling dense external connectivity and interface implementation.
• Package & Mounting 672-BBGA (27×27) surface-mount package (supplier device package listed as 672-FBGA) for compact board-level integration.
• Power Core voltage supply range of 1.15 V to 1.25 V to match Stratix II core requirements.
• Operating Range & Grade Commercial-grade device specified for 0 °C to 85 °C operation.
• Stratix II Architecture Features Device handbook documents architecture blocks including logic array blocks, TriMatrix memory, digital signal processing blocks, PLLs and clock networks, and multi-track interconnect for flexible implementation.
• Configuration & Test Support Documentation covers JTAG boundary-scan support and SignalTap II embedded logic analyzer options for configuration and debug.
• Regulatory Compliance RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-performance signal processing: Use the device's DSP-oriented architecture and embedded RAM for FPGA-based filtering, transforms, and other compute-heavy tasks.
• High-density I/O interfacing: Implement wide parallel interfaces, multi-channel I/O, or protocol bridging using the 500 available I/O pins and advanced I/O structure.
• External memory interfaces: Build memory controllers and buffering logic leveraging on-chip RAM and the device's documented external memory interfacing support.
• Clocking and timing-sensitive designs: Leverage on-chip PLLs and hierarchical clocking features for synchronized multi-clock systems.

Unique Advantages

• High logic and memory integration: 33,880 logic elements plus approximately 1.37 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O resources: With 500 I/O pins, the device supports dense peripheral and board-level interfacing without complex multiplexing.
• Platform-level architecture: Stratix II architecture elements such as DSP blocks, TriMatrix memory, PLLs and multi-track interconnect provide building blocks for diverse system functions.
• Compact package footprint: 672-BBGA (27×27) surface-mount package enables high-density PCB designs while providing robust routing for I/O.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to meet typical commercial-application thermal requirements.
• RoHS compliant: Suitable for lead-free assembly and environmentally conscious manufacturing.

Why Choose EP2S30F672C5?

The EP2S30F672C5 delivers a balanced combination of logic density, embedded memory, and abundant I/O within the Stratix II architecture. It is suited for engineers who need a programmable platform with on-chip resources for signal processing, complex interfacing and memory-intensive tasks while maintaining a compact board footprint.

Backed by the Stratix II device documentation and configuration/testing features described in the device handbook, this device provides a clear specification set for integration, verification and system deployment in commercial-grade applications.

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