EP2S30F672I4N

The EP2S30F672I4N is a Stratix® II field programmable gate array (FPGA) from Altera designed for logic‑intensive embedded designs. It provides a high logic element count, substantial on‑chip memory, and a large I/O complement in a 672‑ball FCBGA/FBGA package for compact surface‑mount implementation.

Targeted at industrial applications, the device offers a broad operating temperature range and RoHS compliance, making it suitable for systems that require reconfigurable logic, significant I/O capacity, and reliable operation across extended temperatures.

Key Features

• Logic Fabric — 33,880 logic elements for implementing complex custom logic and state machines.
• Embedded Memory — Approximately 1.37 Mbits of on‑chip RAM to support buffering, packet storage, and algorithmic state.
• I/O Capacity — 500 I/O pins to support high‑pin‑count interfaces, parallel buses, and multiple peripheral connections.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match platform power budgeting and core supply requirements.
• Package and Mounting — 672‑FBGA (27×27) FCBGA / 672‑BBGA package in a surface‑mount form factor for dense board layouts.
• Operating Range — Industrial temperature rating from −40 °C to 100 °C for deployment in extended‑temperature environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implements real‑time control logic and I/O aggregation where extended temperature operation and high I/O counts are required.
• Data Acquisition and Aggregation — Acts as a programmable interface and data buffer using its large embedded RAM and plentiful I/O for sensor and bus interfacing.
• Custom Logic and Protocol Bridging — Enables bespoke protocol conversion or glue logic for systems needing flexible, reprogrammable logic resources.

Unique Advantages

• High Logic Density: 33,880 logic elements allow implementation of complex algorithms and parallel processing functions on a single device.
• Substantial On‑Chip Memory: Approximately 1.37 Mbits of RAM reduces external memory requirements for many buffering and state storage tasks.
• Large I/O Count: 500 I/Os provide flexibility for multi‑bus systems, parallel interfaces, and extensive peripheral connectivity.
• Industrial Temperature Capability: Rated −40 °C to 100 °C to support deployment in temperature‑challenging environments.
• Compact Surface‑Mount Package: 672‑FBGA (27×27) FCBGA offers a dense footprint for space‑constrained PCBs while maintaining high pin count.
• Regulatory Compliance: RoHS compliance for adherence to lead‑free manufacturing requirements.

Why Choose EP2S30F672I4N?

The EP2S30F672I4N combines a high number of logic elements, significant embedded RAM, and a 500‑pin I/O interface in a compact 672‑ball FCBGA package, making it well suited for industrial and embedded designs that require substantial programmable logic and board‑level connectivity. Its industrial temperature rating and RoHS compliance add to its suitability for long‑lifecycle and regulated applications.

Manufactured by Altera, this Stratix® II FPGA is appropriate for engineers and procurement teams specifying a high‑density, reconfigurable device with defined supply voltage and temperature characteristics. Use it where on‑chip resources and a high I/O count can reduce system complexity and external component count.

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