EP2S60F1020C4

IC FPGA 718 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 718 2544192 60440 1020-BBGA

Quantity 609 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O718Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F1020C4 – Stratix II FPGA, 60,440 Logic Elements, 1020-BBGA

The EP2S60F1020C4 is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with 60,440 logic elements and approximately 2.54 Mbits of embedded RAM in a 1020-BBGA (33 × 33) surface-mount package.

Designed for commercial-grade applications, this Stratix II device supports advanced clocking, DSP-oriented resources, and extensive I/O capability—making it suitable for designs that require substantial logic capacity, on-chip memory, and complex interfacing within a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity  60,440 logic elements provide significant programmable logic resources for complex combinational and sequential functions.
  • On‑Chip Memory  Approximately 2.54 Mbits of embedded RAM for buffering, lookup tables, and state storage.
  • I/O Density & Package  Up to 718 I/O pins in a 1020-BBGA (supplier package 1020-FBGA, 33×33) surface-mount package to support large, complex interfaces.
  • Power Supply  Core voltage supply range of 1.15 V to 1.25 V to match system power domains.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial environments.
  • Clocking and PLLs  Stratix II architecture includes enhanced and fast PLLs and comprehensive clock networks, enabling flexible, low-skew clock distribution for timing-critical designs.
  • Digital Signal Processing  The family documentation details dedicated DSP resources and interfaces aimed at signal processing tasks.
  • High‑Speed I/O and Memory Interfaces  Architecture support for high-speed differential I/O, DDR I/O, on‑chip termination, and external RAM interfacing for high-bandwidth designs.
  • Configuration & Test  IEEE 1149.1 JTAG boundary-scan support and an embedded logic analyzer (SignalTap II) are documented for in-system debug and testing.
  • Standards & Compliance  RoHS compliant and supplied in a surface-mount package suitable for modern PCB assembly processes.

Typical Applications

  • Digital Signal Processing  Utilize the Stratix II DSP resources and on-chip RAM for data streaming, filtering, and real-time signal manipulation.
  • High‑Speed Memory Interfaces  Implement external RAM interfaces and DDR signaling for applications that need high bandwidth buffering or memory controllers.
  • Complex I/O and Protocol Bridging  Leverage 718 I/O pins and advanced I/O features to bridge multiple buses, manage large sensor arrays, or aggregate I/O in system integration tasks.
  • Clock‑Critical Systems  Use the enhanced and fast PLLs and hierarchical clocking for designs requiring precise clock distribution and low-skew timing.
  • In‑System Debug & Production Test  Take advantage of JTAG boundary-scan and the documented embedded logic analyzer for design validation and manufacturing test visibility.

Unique Advantages

  • High Logic Density: 60,440 logic elements enable integration of large functions and consolidation of multiple components into a single device.
  • Substantial Embedded Memory: Approximately 2.54 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and LUT requirements.
  • Extensive I/O Capability: 718 I/O pins in a 1020-BBGA package simplify routing for designs with many external interfaces and peripherals.
  • Flexible Clocking: Enhanced and fast PLLs with global/hierarchical clock networks support complex timing architectures and multiple clock domains.
  • Design-for-Test and Debug: JTAG boundary-scan and an embedded logic analyzer documented for the device improve observability during development and production testing.
  • Commercial-Grade Reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance align with commercial product requirements and assembly practices.

Why Choose EP2S60F1020C4?

The EP2S60F1020C4 delivers a balanced combination of high logic capacity, embedded memory, and broad I/O in a compact 1020‑BBGA package. Its Stratix II architecture provides advanced clocking, DSP-oriented resources, and documented support for high-speed I/O and external memory interfaces, making it well suited for commercial designs that require significant programmable logic and complex interfacing.

Backed by Intel/Altera device documentation and family-level technical details, the EP2S60F1020C4 is a strong choice for engineers developing high-density, performance-oriented FPGA designs that need a mature architecture and comprehensive design and test features.

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