EP2S60F484C5N

The EP2S60F484C5N is a Stratix II field-programmable gate array (FPGA) from Intel, offered in a 484-ball BGA package for surface-mount assembly. It is built on the Stratix II family architecture and provides a combination of high logic density, embedded memory, and flexible I/O for commercial-temperature embedded designs.

Typical use cases include high-density logic integration, on-chip memory-rich designs, and systems requiring extensive I/O and programmable clocking. The device balances integration and configurability with RoHS compliance and standard commercial operating conditions.

Key Features

• Logic Capacity  Approximately 60,440 logic elements and 3,022 logic array blocks, enabling large-scale combinational and sequential logic implementation.
• Embedded Memory  Approximately 2.54 Mbits of on-chip RAM (2,544,192 bits) for data buffering, FIFOs, and local storage.
• I/O Resources  334 user I/O pins to support broad interfacing needs and high pin-count peripheral connections.
• Package & Mounting  484-BBGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting type suited for compact board-level integration.
• Power  Core voltage supply range of 1.15 V to 1.25 V for device operation.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Family Architecture Features (Stratix II)  Documentation for the Stratix II family describes logic array blocks, TriMatrix memory, DSP blocks, enhanced and fast PLLs and clock networks, and advanced I/O structure including DDR support and on-chip termination.
• Configuration & Test Support  Family-level features include IEEE Std. 1149.1 JTAG boundary-scan support and embedded logic analysis capabilities documented for Stratix II devices.
• Environmental  RoHS compliant, meeting common lead-free requirements for electronics manufacturing.

Typical Applications

• High-performance signal processing  Leverage the device's large logic capacity and documented DSP block architecture to implement FPGA-based digital signal processing pipelines.
• Memory interface controllers  Use the on-chip memory and documented external RAM interfacing guidance from the Stratix II family to build memory controllers and buffering subsystems.
• High-speed communications  Take advantage of the extensive I/O count and the family’s high-speed I/O and DDR support to implement communication links and protocol bridging.
• Embedded system integration  Integrate large amounts of custom logic and local RAM for control, preprocessing, and glue-logic in commercial embedded products.

Unique Advantages

• High logic density: The device’s ~60,440 logic elements and 3,022 logic array blocks provide capacity for complex, high-gate-count designs without external glue logic.
• Substantial on-chip memory: Approximately 2.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O count: 334 I/O pins enable broad connectivity for multi-interface designs and board-level consolidation.
• Stratix II family feature set: Documented features such as DSP blocks, PLLs and clock networks, TriMatrix memory organization, and advanced I/O options support a wide range of system architectures.
• Commercial-temperature suitability: Rated for 0 °C to 85 °C, appropriate for standard commercial embedded applications and systems.
• Manufacturing & regulatory readiness: Surface-mount 484-BBGA packaging and RoHS compliance support modern PCB assembly and environmental requirements.

Why Choose EP2S60F484C5N?

The EP2S60F484C5N is positioned for designers who need a Stratix II FPGA with significant logic and embedded memory resources, a high I/O count, and the documented family-level features required for complex designs. Its combination of logic capacity, on-chip RAM, and flexible I/O makes it suitable for integrating multiple functions into a single device on commercial-temperature products.

Backed by the Stratix II device documentation, the device provides the architectural building blocks—logic array blocks, DSP support, programmable PLLs, and I/O options—needed to develop scalable FPGA-based systems while maintaining RoHS compliance and standard surface-mount packaging.

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