EP2S60F672C3

IC FPGA 492 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 492 2544192 60440 672-BBGA

Quantity 326 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O492Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F672C3 – Stratix® II FPGA IC 672-BBGA

The EP2S60F672C3 is a Stratix II field programmable gate array (FPGA) featuring the Stratix II device architecture described in the accompanying device handbook. It integrates programmable logic, on-chip memory, DSP-capable resources and a comprehensive I/O structure to support complex digital designs.

This device is targeted at commercial embedded systems and communication applications that require substantial logic capacity, abundant I/O, and on-chip memory within a compact ball-grid array package.

Key Features

  • Logic Capacity  Approximately 60,440 logic elements providing significant programmable fabric for complex designs.
  • Logic Array Blocks (LABs)  3,022 LABs for organized, scalable logic implementation consistent with Stratix II architecture.
  • Embedded Memory  Approximately 2.54 Mbits of on-chip RAM (2,544,192 total RAM bits) for FIFOs, buffers and distributed storage.
  • I/O Density  492 I/O pins to support wide external interfaces, multiple memory buses, and multi-channel signaling.
  • Package & Mounting  672-ball BGA package (supplier package listed as 672-FBGA, 27×27) with surface-mount mounting for compact board integration.
  • Power Supply  Core voltage support from 1.15 V to 1.25 V to match Stratix II recommended operating conditions.
  • Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard ambient environments.
  • Standards & Compliance  RoHS compliant for lead-free assembly and regulatory alignment.
  • Stratix II Architecture Highlights  Documented family features include logic array blocks, TriMatrix memory, DSP blocks, PLLs and advanced I/O structures (as described in the Stratix II device handbook).

Typical Applications

  • High-performance digital processing  Use the device’s large logic element count and embedded memory to implement custom datapaths and accelerated processing tasks.
  • Communications and networking  Leverage abundant I/O and Stratix II I/O features for protocol bridging, packet processing and multi-channel interfaces.
  • Memory interface and buffering  Embedded RAM and plentiful I/O enable external RAM interfacing and on-chip buffering for streaming and storage applications.
  • Signal processing  Stratix II DSP block capabilities (documented in the device handbook) support common digital signal processing building blocks within the FPGA fabric.

Unique Advantages

  • Substantial programmable fabric: The approximately 60,440 logic elements and 3,022 LABs provide headroom for complex logic, state machines and custom accelerators.
  • On-chip memory for system integration: Approximately 2.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • High I/O count for flexible interfacing: 492 I/O pins permit multiple parallel buses, high-pin-count interfaces, and versatile board-level connectivity.
  • Compact BGA footprint: The 672-ball BGA (672-FBGA, 27×27) package enables dense board integration while supporting surface-mount assembly.
  • Documented Stratix II feature set: The device is part of the Stratix II family with documented architecture elements such as PLLs, DSP blocks and advanced I/O, assisting design planning and verification.
  • Regulatory readiness: RoHS compliance supports lead-free production flows and regulatory requirements.

Why Choose EP2S60F672C3?

The EP2S60F672C3 positions itself as a high-capacity Stratix II FPGA option for commercial embedded and communications designs that need substantial logic resources, on-chip memory and broad I/O. Its Stratix II family architecture and documented features give designers a clear technical reference for implementing DSP, clocking and I/O-intensive subsystems.

This device is well suited for teams building complex digital subsystems who require a compact BGA package, a 1.15–1.25 V core supply range, and commercial temperature operation. The combination of logic density, embedded RAM and I/O flexibility delivers a scalable platform for mid-to-large FPGA designs within the Stratix II family.

Request a quote or submit your procurement inquiry to obtain pricing, availability and delivery details for EP2S60F672C3.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up