EP2S60F672C3
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 492 2544192 60440 672-BBGA |
|---|---|
| Quantity | 326 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 492 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2S60F672C3 – Stratix® II FPGA IC 672-BBGA
The EP2S60F672C3 is a Stratix II field programmable gate array (FPGA) featuring the Stratix II device architecture described in the accompanying device handbook. It integrates programmable logic, on-chip memory, DSP-capable resources and a comprehensive I/O structure to support complex digital designs.
This device is targeted at commercial embedded systems and communication applications that require substantial logic capacity, abundant I/O, and on-chip memory within a compact ball-grid array package.
Key Features
- Logic Capacity Approximately 60,440 logic elements providing significant programmable fabric for complex designs.
- Logic Array Blocks (LABs) 3,022 LABs for organized, scalable logic implementation consistent with Stratix II architecture.
- Embedded Memory Approximately 2.54 Mbits of on-chip RAM (2,544,192 total RAM bits) for FIFOs, buffers and distributed storage.
- I/O Density 492 I/O pins to support wide external interfaces, multiple memory buses, and multi-channel signaling.
- Package & Mounting 672-ball BGA package (supplier package listed as 672-FBGA, 27×27) with surface-mount mounting for compact board integration.
- Power Supply Core voltage support from 1.15 V to 1.25 V to match Stratix II recommended operating conditions.
- Operating Temperature Commercial grade operation from 0 °C to 85 °C for standard ambient environments.
- Standards & Compliance RoHS compliant for lead-free assembly and regulatory alignment.
- Stratix II Architecture Highlights Documented family features include logic array blocks, TriMatrix memory, DSP blocks, PLLs and advanced I/O structures (as described in the Stratix II device handbook).
Typical Applications
- High-performance digital processing Use the device’s large logic element count and embedded memory to implement custom datapaths and accelerated processing tasks.
- Communications and networking Leverage abundant I/O and Stratix II I/O features for protocol bridging, packet processing and multi-channel interfaces.
- Memory interface and buffering Embedded RAM and plentiful I/O enable external RAM interfacing and on-chip buffering for streaming and storage applications.
- Signal processing Stratix II DSP block capabilities (documented in the device handbook) support common digital signal processing building blocks within the FPGA fabric.
Unique Advantages
- Substantial programmable fabric: The approximately 60,440 logic elements and 3,022 LABs provide headroom for complex logic, state machines and custom accelerators.
- On-chip memory for system integration: Approximately 2.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- High I/O count for flexible interfacing: 492 I/O pins permit multiple parallel buses, high-pin-count interfaces, and versatile board-level connectivity.
- Compact BGA footprint: The 672-ball BGA (672-FBGA, 27×27) package enables dense board integration while supporting surface-mount assembly.
- Documented Stratix II feature set: The device is part of the Stratix II family with documented architecture elements such as PLLs, DSP blocks and advanced I/O, assisting design planning and verification.
- Regulatory readiness: RoHS compliance supports lead-free production flows and regulatory requirements.
Why Choose EP2S60F672C3?
The EP2S60F672C3 positions itself as a high-capacity Stratix II FPGA option for commercial embedded and communications designs that need substantial logic resources, on-chip memory and broad I/O. Its Stratix II family architecture and documented features give designers a clear technical reference for implementing DSP, clocking and I/O-intensive subsystems.
This device is well suited for teams building complex digital subsystems who require a compact BGA package, a 1.15–1.25 V core supply range, and commercial temperature operation. The combination of logic density, embedded RAM and I/O flexibility delivers a scalable platform for mid-to-large FPGA designs within the Stratix II family.
Request a quote or submit your procurement inquiry to obtain pricing, availability and delivery details for EP2S60F672C3.

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