EP2S60F672C4

The EP2S60F672C4 is a Stratix® II field programmable gate array (FPGA) IC from Intel, providing a high-density programmable fabric with substantial on-chip memory and a large I/O count. It implements Stratix II architecture elements and is supplied in a compact 672‑ball BGA package suitable for surface-mount assembly.

With 60,440 logic elements, approximately 2.54 Mbits of embedded RAM, and 492 I/O pins, this device targets complex digital designs that require dense logic, significant local memory, and extensive external connectivity within a commercial temperature range.

Key Features

• Logic Capacity  Provides 60,440 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 2.54 Mbits of on‑chip RAM enable local buffering, lookup tables, and state storage to support data‑intensive logic.
• I/O and Package  492 I/O pins in a 672‑BBGA package (supplier device package: 672‑FBGA, 27×27) support broad external interfacing while maintaining a compact footprint for system integration.
• Stratix II Architecture  Documentation and device handbook reference architecture elements such as Logic Array Blocks, Adaptive Logic Modules, DSP blocks, PLLs, and multi‑track interconnects to enable complex timing and signal processing implementations.
• Power Supply  Requires core supply in the range 1.15 V to 1.25 V, enabling designs that target the specified supply envelope.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation, suitable for commercial‑grade applications.
• Mounting & Compliance  Surface mount device with RoHS compliance for lead‑free assembly processes.

Typical Applications

• High‑performance signal processing  On‑chip DSP resources and abundant logic elements support implementation of filtering, transforms, and custom datapaths.
• External memory controllers  Architecture and I/O resources support designs that interface to external RAM and high‑bandwidth memory peripherals.
• Protocol bridging and I/O aggregation  Large I/O count enables multi‑interface bridging, protocol conversion, and complex I/O routing in communication and system‑integration roles.
• System prototyping and integration  High logic density and embedded memory make the device suitable for prototyping large digital systems and integrating custom logic into larger assemblies.

Unique Advantages

• High logic density: 60,440 logic elements provide capacity for complex, large‑scale logic implementations without external gate arrays.
• Substantial embedded memory: Approximately 2.54 Mbits of on‑chip RAM reduce external memory dependence and improve local data throughput.
• Extensive I/O: 492 I/O pins in a compact BGA package enable broad peripheral connectivity and flexible pin assignments.
• Proven Stratix II architecture: Built on a documented device family with dedicated DSP blocks, PLLs, and a hierarchical clocking structure to support advanced timing and signal processing requirements.
• Commercial readiness: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployment.
• Compact surface‑mount package: 672‑BBGA (672‑FBGA footprint) balances thermal and board‑space considerations for dense PCB designs.

Why Choose EP2S60F672C4?

The EP2S60F672C4 offers a combination of high logic element count, significant embedded RAM, and a large number of I/O pins in a compact BGA package, making it a fit for designs that demand on‑chip capacity and extensive external interfacing within a commercial temperature envelope. Its foundation in the Stratix II family provides architectural features—DSP blocks, PLLs, and a rich I/O structure—documented for system designers.

This device is suited to engineering teams building complex digital systems, signal processing engines, or custom interface controllers who need a reliable, well‑documented FPGA platform and the on‑device resources to minimize external components.

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