EP2S60F484I4

IC FPGA 334 I/O 484FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 334 2544192 60440 484-BBGA

Quantity 318 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O334Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F484I4 – Stratix® II FPGA, 60,440 logic elements

The EP2S60F484I4 is an industrial-grade Stratix II field programmable gate array in a 484-BBGA package. It combines a large logic capacity with on-chip embedded memory and extensive I/O counts to address demanding processing and interface tasks.

Built on the Stratix II device family architecture, this device targets high-performance digital signal processing, communications and industrial control applications that require flexible programmable logic, on-chip RAM, and advanced clocking and I/O structures.

Key Features

  • Logic Capacity  Approximately 60,440 logic elements for implementing complex custom logic, state machines and datapaths.
  • Embedded Memory  Approximately 2.54 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
  • I/O Density  334 user I/O pins provide broad peripheral and bus interfacing capability for multi-channel systems.
  • Stratix II Family Architecture  Family-level features documented in the Stratix II handbook include TriMatrix memory, DSP blocks, PLLs and advanced clock networks, and a rich I/O structure for high-speed and multi‑standard signaling.
  • Power Supply  Core voltage range of 1.15 V to 1.25 V to match system power budgets and platform design requirements.
  • Package & Mounting  484-BBGA / supplier device package 484-FBGA (23×23) in a surface-mount form factor for compact board-level integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • Standards & Compliance  RoHS-compliant material status for environmental and regulatory considerations.

Typical Applications

  • High‑performance signal processing  Leverage the Stratix II architecture and on-chip RAM for DSP algorithms, real-time filtering and multi-channel data aggregation.
  • Communications infrastructure  Use the device's extensive I/O and clocking features for protocol bridging, line cards and packet processing tasks.
  • Industrial control & automation  Industrial temperature rating and high logic density make it suitable for motor control, real-time control, and deterministic I/O handling.
  • Custom interface logic  Implement complex bus translators, timing-critical interfaces and multi‑standard I/O directly in programmable logic.

Unique Advantages

  • High integration density: Consolidate functions with approximately 60,440 logic elements and on-chip RAM to reduce external components and board area.
  • Broad I/O capability: 334 I/O pins enable multiple parallel interfaces and flexible system connectivity without immediate need for expansion devices.
  • Family-proven architecture: Access Stratix II family features such as DSP blocks, PLLs and advanced memory structures to accelerate implementation of complex designs.
  • Industrial robustness: Rated for −40 °C to 100 °C, supporting deployment in industrial environments with extended temperature requirements.
  • RoHS compliant: Manufactured to meet RoHS requirements for environmentally constrained programs and product lines.

Why Choose EP2S60F484I4?

The EP2S60F484I4 provides a balanced combination of high logic capacity, substantial embedded memory and a large number of I/Os in a compact 484‑BBGA surface-mount package. It is positioned for designers who need Stratix II family capabilities—such as advanced clocking, DSP and memory resources—within an industrial-temperature, RoHS-compliant device.

This device is a fit for customers building scalable, performance-focused FPGA designs that require on-chip RAM and significant I/O without sacrificing board density. Its documented family features and industrial rating support long-term deployment and system-level robustness.

Request a quote or submit a product inquiry to obtain pricing, availability and technical support for EP2S60F484I4.

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