EP2S60F672C5

IC FPGA 492 I/O 672FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 492 2544192 60440 672-BBGA

Quantity 923 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O492Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2S60F672C5 – Stratix II FPGA, 60,440 Logic Elements, ~2.54 Mbits RAM, 492 I/Os, 672-BBGA

The EP2S60F672C5 is a Stratix® II field programmable gate array (FPGA) in a 672-ball BGA package, delivering large-scale programmable logic with on-chip memory and extensive I/O. It targets designs that require significant logic density, embedded memory, and a high pin count within a surface-mount BGA footprint.

Built on the Stratix II architecture, the device integrates core FPGA resources and family-level capabilities such as DSP support, advanced clocking and high-speed I/O features documented in the Stratix II device handbook.

Key Features

  • Core Logic  Approximately 60,440 logic elements provide substantial programmable logic capacity for complex glue logic, state machines, and custom datapaths.
  • Embedded Memory  Approximately 2.54 Mbits of on-chip RAM supports buffering, FIFOs, and on-chip data storage to reduce external memory dependence.
  • High Pin Count I/O  492 dedicated I/O pins enable dense external interfacing and multi-channel connectivity in a single device.
  • Advanced Architecture Features  Family-level documentation shows support for Adaptive Logic Modules, TriMatrix memory, DSP blocks, MultiTrack interconnect, and enhanced/fast PLLs for flexible implementation of logic, memory and DSP functions.
  • Configuration & Debug  Stratix II family features include IEEE 1149.1 JTAG boundary-scan and SignalTap II embedded logic analyzer support for configuration and in-system debug.
  • I/O and Signalling  The device family documentation describes support for high-speed differential I/O, programmable drive strength, on-chip termination and multivoltage I/O standards to accommodate varied interface requirements.
  • Power & Supply  Core supply specified at 1.15 V to 1.25 V to match design power rails and ensure consistent device operation within recommended ranges.
  • Package & Mounting  672-ball BGA (supplier device package listed as 672-FBGA (27×27)); surface-mount package suitable for compact, board-level integration.
  • Commercial Grade & Environmental  Rated for 0 °C to 85 °C operating temperature and RoHS compliant for standard commercial applications.

Typical Applications

  • High-density logic integration  Use the device where large combinational and sequential logic resources are needed to implement custom logic and protocol bridging within a single FPGA.
  • Embedded memory buffering  On-chip RAM (approximately 2.54 Mbits) supports data buffering, FIFOs and temporary storage to optimize board-level memory utilization.
  • Signal processing and DSP  Stratix II family DSP block support enables implementation of fixed-point DSP pipelines and custom arithmetic accelerators.
  • Multi-channel I/O aggregation  With 492 I/Os, the device is suited for designs requiring dense parallel interfaces or multiple peripheral channels routed to a single programmable device.

Unique Advantages

  • High logic density: 60,440 logic elements provide the capacity to consolidate multiple functions into one FPGA, reducing system complexity.
  • Significant embedded memory: Approximately 2.54 Mbits of on-chip RAM lowers dependence on external memory for many buffering and temporary-data use cases.
  • Extensive I/O available: 492 I/O pins allow for dense interfacing without immediate need for external I/O expanders.
  • Integrated family-level IP and tools: Stratix II documentation lists architecture and configuration features such as PLLs, SignalTap II, and JTAG that streamline development and debug.
  • Compact BGA package: 672-ball BGA (672-FBGA, 27×27) offers a compact, surface-mount solution for space-constrained PCB designs.
  • Commercial readiness and compliance: 0 °C to 85 °C operating range and RoHS compliance make the device suitable for a wide range of commercial electronic products.

Why Choose EP2S60F672C5?

The EP2S60F672C5 combines substantial logic capacity, embedded memory and a high I/O count in a compact 672-ball BGA package, making it a solid choice for designers who need to consolidate complex functions into a single programmable device. Its Stratix II family features—documented support for DSP blocks, flexible clocking and on-chip debug—help accelerate development and validation of sophisticated digital designs.

This device suits teams building commercial-grade embedded systems that require scalable logic, on-chip memory for buffering, and extensive external interfacing while taking advantage of established Stratix II architecture documentation and configuration options.

Request a quote or submit a pricing inquiry to evaluate EP2S60F672C5 for your next design project.

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