EP2S60F672C5
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 492 2544192 60440 672-BBGA |
|---|---|
| Quantity | 923 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 492 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2S60F672C5 – Stratix II FPGA, 60,440 Logic Elements, ~2.54 Mbits RAM, 492 I/Os, 672-BBGA
The EP2S60F672C5 is a Stratix® II field programmable gate array (FPGA) in a 672-ball BGA package, delivering large-scale programmable logic with on-chip memory and extensive I/O. It targets designs that require significant logic density, embedded memory, and a high pin count within a surface-mount BGA footprint.
Built on the Stratix II architecture, the device integrates core FPGA resources and family-level capabilities such as DSP support, advanced clocking and high-speed I/O features documented in the Stratix II device handbook.
Key Features
- Core Logic Approximately 60,440 logic elements provide substantial programmable logic capacity for complex glue logic, state machines, and custom datapaths.
- Embedded Memory Approximately 2.54 Mbits of on-chip RAM supports buffering, FIFOs, and on-chip data storage to reduce external memory dependence.
- High Pin Count I/O 492 dedicated I/O pins enable dense external interfacing and multi-channel connectivity in a single device.
- Advanced Architecture Features Family-level documentation shows support for Adaptive Logic Modules, TriMatrix memory, DSP blocks, MultiTrack interconnect, and enhanced/fast PLLs for flexible implementation of logic, memory and DSP functions.
- Configuration & Debug Stratix II family features include IEEE 1149.1 JTAG boundary-scan and SignalTap II embedded logic analyzer support for configuration and in-system debug.
- I/O and Signalling The device family documentation describes support for high-speed differential I/O, programmable drive strength, on-chip termination and multivoltage I/O standards to accommodate varied interface requirements.
- Power & Supply Core supply specified at 1.15 V to 1.25 V to match design power rails and ensure consistent device operation within recommended ranges.
- Package & Mounting 672-ball BGA (supplier device package listed as 672-FBGA (27×27)); surface-mount package suitable for compact, board-level integration.
- Commercial Grade & Environmental Rated for 0 °C to 85 °C operating temperature and RoHS compliant for standard commercial applications.
Typical Applications
- High-density logic integration Use the device where large combinational and sequential logic resources are needed to implement custom logic and protocol bridging within a single FPGA.
- Embedded memory buffering On-chip RAM (approximately 2.54 Mbits) supports data buffering, FIFOs and temporary storage to optimize board-level memory utilization.
- Signal processing and DSP Stratix II family DSP block support enables implementation of fixed-point DSP pipelines and custom arithmetic accelerators.
- Multi-channel I/O aggregation With 492 I/Os, the device is suited for designs requiring dense parallel interfaces or multiple peripheral channels routed to a single programmable device.
Unique Advantages
- High logic density: 60,440 logic elements provide the capacity to consolidate multiple functions into one FPGA, reducing system complexity.
- Significant embedded memory: Approximately 2.54 Mbits of on-chip RAM lowers dependence on external memory for many buffering and temporary-data use cases.
- Extensive I/O available: 492 I/O pins allow for dense interfacing without immediate need for external I/O expanders.
- Integrated family-level IP and tools: Stratix II documentation lists architecture and configuration features such as PLLs, SignalTap II, and JTAG that streamline development and debug.
- Compact BGA package: 672-ball BGA (672-FBGA, 27×27) offers a compact, surface-mount solution for space-constrained PCB designs.
- Commercial readiness and compliance: 0 °C to 85 °C operating range and RoHS compliance make the device suitable for a wide range of commercial electronic products.
Why Choose EP2S60F672C5?
The EP2S60F672C5 combines substantial logic capacity, embedded memory and a high I/O count in a compact 672-ball BGA package, making it a solid choice for designers who need to consolidate complex functions into a single programmable device. Its Stratix II family features—documented support for DSP blocks, flexible clocking and on-chip debug—help accelerate development and validation of sophisticated digital designs.
This device suits teams building commercial-grade embedded systems that require scalable logic, on-chip memory for buffering, and extensive external interfacing while taking advantage of established Stratix II architecture documentation and configuration options.
Request a quote or submit a pricing inquiry to evaluate EP2S60F672C5 for your next design project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018