EP2S60F672I4

The EP2S60F672I4 is a Stratix® II family FPGA manufactured by Intel, delivering a high-density, reprogrammable logic fabric for industrial embedded systems. It combines 60,440 logic elements with dedicated architecture building blocks from the Stratix II device family to support complex digital logic, DSP functions, and high-speed I/O requirements.

Designed for industrial applications, the device offers approximately 2.54 Mbits of embedded memory, 492 I/O pins, and on-package options optimized for surface-mount assembly in a 672-BBGA (672-FBGA, 27×27) package. Voltage supply and operating temperature ranges support deployment across industrial temperature environments.

Key Features

• Core Capacity — 60,440 logic elements provide substantial routing and logic resources for medium- to high-complexity FPGA designs.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for frame buffers, FIFOs, and intermediate data storage.
• I/O Density & Flexibility — 492 I/O pins support a wide mix of external interfaces; Stratix II I/O architecture and high-speed differential I/O capabilities are documented in the device handbook.
• DSP & Clocking Resources — Stratix II architecture includes dedicated DSP blocks and enhanced/fast PLLs and clock networks for deterministic timing and signal processing tasks.
• Package & Mounting — 672-BBGA (supplier package: 672-FBGA, 27×27) surface-mount package suited to compact board designs.
• Power Supply — Supported core voltage supply range of 1.15 V to 1.25 V to match system power architectures.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
• Standards & Compliance — RoHS-compliant to meet modern environmental requirements.

Typical Applications

• Industrial Control & Automation — Implements custom logic, timing, and signal processing needed for PLCs, motor control interfaces, and factory automation where industrial temperature range and robust I/O matter.
• Communications & Signal Processing — Uses the Stratix II DSP blocks, PLLs, and high-density logic to implement protocol processing, frame buffering, and real-time data handling.
• Embedded Systems & Prototyping — Provides flexible on-chip memory and plentiful logic elements for custom embedded functionality and rapid design iteration.

Unique Advantages

• High-density logic — 60,440 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• On-chip embedded memory — Approximately 2.54 Mbits of RAM lowers reliance on external memory for many buffering and temporary storage needs.
• Comprehensive Stratix II architecture — Includes DSP blocks, PLLs, and a documented I/O structure to support complex timing and signal-processing designs.
• Industrial-grade thermal range — −40 °C to 100 °C rating allows deployment in a wide range of industrial environments without derating logic capacity.
• Compact, manufacturable package — 672-BBGA (27×27) surface-mount package supports high-density PCB designs and automated assembly.
• Regulatory hygiene — RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP2S60F672I4?

The EP2S60F672I4 places Stratix II family capability into a 672-BBGA package that balances high logic density, embedded memory, and comprehensive FPGA architecture elements for industrial embedded designs. Its combination of 60,440 logic elements, roughly 2.54 Mbits of on-chip RAM, DSP resources, and a broad I/O count makes it suitable for systems that need substantial programmable logic, deterministic clocking, and significant on-chip buffering.

Backed by Intel’s Stratix II device documentation and family-level resources, the EP2S60F672I4 is appropriate for design teams seeking a robust, field-programmable solution with industrial temperature capability and RoHS compliance for long-life deployments.

Request a quote or submit a procurement inquiry to evaluate EP2S60F672I4 for your next industrial FPGA design.