EP2S90F1020C3

IC FPGA 758 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 758 4520488 90960 1020-BBGA

Quantity 1,179 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O758Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1020C3 – Stratix® II Field Programmable Gate Array (FPGA) IC 758 4520488 90960 1020-BBGA

The EP2S90F1020C3 is a Stratix II family FPGA providing a high-density programmable logic fabric in a 1020-ball FBGA package. It combines a large logic capacity with substantial on-chip RAM and an extensive I/O complement, making it suitable for designs that require dense digital integration and high I/O counts.

Built around the Stratix II architecture, this device targets applications that benefit from significant embedded memory (approximately 4.52 Mbits), 90,960 logic elements, and up to 758 I/O pins while operating from a 1.15 V to 1.25 V core supply within a commercial 0 °C to 85 °C range.

Key Features

  • Logic Capacity — 90,960 logic elements to implement large combinational and sequential logic networks.
  • Embedded Memory — Approximately 4.52 Mbits of on-chip RAM for FIFOs, buffers, and local data storage.
  • High I/O Count — Up to 758 I/O pins to support wide external interfaces and multi-channel connectivity.
  • Stratix II Architecture — Family-level features documented in the Stratix II Device Handbook, including logic array blocks, ALMs, DSP resources, and multi-track interconnect.
  • Clocking and PLLs — On-chip PLLs and hierarchical clocking resources as described in the device handbook for flexible clock management.
  • Configuration & Debug Support — JTAG boundary-scan and embedded logic analyzer capabilities referenced in the Stratix II documentation.
  • Power and Mounting — Surface-mount FBGA package with a 1.15 V to 1.25 V core supply requirement.
  • Package — 1020-ball FBGA (33 × 33) / 1020-BBGA package case for compact board-level integration.
  • Commercial Operating Range — Specified for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

  • High-density digital processing — Implement complex state machines, protocol stacks, and custom logic using the device’s large logic element count and embedded memory.
  • Signal processing and DSP — Leverage the Stratix II digital signal processing resources and on-chip RAM for filtering, packet processing, and data path acceleration.
  • Multi-channel interface hubs — Support numerous parallel or serial interfaces with up to 758 I/Os for connectivity and bridging functions.
  • Embedded system integration — Combine logic, memory, and clock-management resources to consolidate functions and reduce external component count.

Unique Advantages

  • High logic density: 90,960 logic elements enable consolidation of complex designs into a single device, reducing board-level routing complexity.
  • Substantial on-chip memory: Approximately 4.52 Mbits of embedded RAM provide local storage for buffers, packet queues, and DSP data paths.
  • Extensive I/O capacity: Up to 758 I/Os allow broad external connectivity without additional multiplexing hardware.
  • Robust device architecture: Stratix II family features—documented in the device handbook—include advanced clocking, DSP blocks, and a flexible interconnect fabric for diverse design needs.
  • Compact package: 1020-ball FBGA (33 × 33) package offers a high pin-count solution in a space-efficient footprint for surface-mount assembly.
  • Compliance and operating range: RoHS-compliant construction and a commercial operating range (0 °C to 85 °C) suitable for typical commercial electronics applications.

Why Choose EP2S90F1020C3?

The EP2S90F1020C3 delivers a balance of large programmable logic capacity, significant on-chip memory, and high I/O density within the Stratix II architecture. Its documented feature set—covering logic array blocks, DSP resources, PLLs, and configuration/debug facilities—makes it a practical choice for projects that require substantial digital processing and heavy interface integration while maintaining a compact board footprint.

This device is well suited for engineering teams and procurement teams targeting commercial electronics that demand integrated logic and memory resources, flexible clocking, and broad I/O support. Detailed technical guidance is available in the Stratix II Device Handbook referenced in the product documentation.

Request a quote or submit a procurement inquiry to secure EP2S90F1020C3 for your next design.

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