EPF10K100BFC256-2

LOADABLE PLD, 12NS PBGA256
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 6144 576 256-BGA

Quantity 154 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991HTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K100BFC256-2 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 6144 576 256-BGA

The EPF10K100BFC256-2 is a FLEX-10K® field programmable gate array from Altera designed for commercial applications requiring mid-density programmable logic. It integrates 576 logic elements, 6,144 bits of on-chip RAM and up to 191 user I/O in a 256-ball FBGA package, providing a compact platform for implementing custom digital functions.

With a 4.75 V to 5.25 V supply range and a 0 °C to 70 °C operating temperature, this surface-mount device targets commercial electronic designs where moderate logic capacity, on-chip memory and flexible I/O count are primary requirements.

Key Features

  • Core Logic 576 logic elements and 72 LABs provide mid-density programmable logic capacity for custom digital implementations; device gate equivalence is listed as 31,000 gates.
  • Embedded Memory 6,144 bits of total on-chip RAM for small data buffering, state storage and lookup tables.
  • I/O and Packaging Up to 191 user I/O lines in a 256-ball FBGA (256-BGA, 17×17) package facilitate multiple peripheral interfaces in a compact footprint.
  • Power and Thermal Operates from a 4.75 V to 5.25 V supply and specified for a 0 °C to 70 °C commercial temperature range.
  • Mounting and Compliance Surface-mount package with RoHS compliance for lead-free assembly and commercial-grade applications.

Typical Applications

  • Prototyping and Development Implement and iterate custom digital logic and control functions during hardware development and proof-of-concept work.
  • Consumer and Commercial Electronics Provide configurable glue logic, interface bridging and peripheral control in compact, surface-mount designs.
  • Embedded Control Handle custom sequencing, simple state machines and control logic where moderate logic density and modest on-chip RAM suffice.

Unique Advantages

  • Balanced Logic and Memory: 576 logic elements combined with 6,144 bits of RAM allow compact implementations of control logic and small data buffering without external memory.
  • High I/O Count in Compact Package: 191 I/O pins in a 256-FBGA (17×17) package enable multiple interfaces while preserving PCB area.
  • Commercial Temperature Rating: Specified 0 °C to 70 °C operation aligns with typical commercial electronics deployment scenarios.
  • RoHS-Compliant Surface-Mount Device: Supports lead-free manufacturing processes and modern assembly workflows.
  • Established Vendor: Manufactured by Altera, providing a recognized source for FLEX-10K® family programmable logic.

Why Choose EPF10K100BFC256-2?

The EPF10K100BFC256-2 delivers a practical balance of logic capacity, on-chip RAM and I/O density in a surface-mount 256-FBGA package, making it well suited for commercial designs that need mid-range programmable logic without external memory. Its 4.75 V–5.25 V supply range and commercial temperature rating provide clear deployment parameters for embedded system designers.

Choose this device when you need a compact, RoHS-compliant FPGA from Altera that supports a range of control, interfacing and prototyping tasks while keeping PCB area and BOM complexity low.

Request a quote or submit a sales inquiry to discuss pricing, availability and volume options for the EPF10K100BFC256-2.

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