EPF10K100ARC240-3N

The EPF10K100ARC240-3N is a FLEX-10KA family FPGA from Intel offering embedded programmable logic targeted at commercial embedded and system-integration applications. It combines a high-density logic array with on-chip RAM and a generous I/O count to implement custom logic, memory-mapped functions, and peripheral interfacing in a single device.

Designed for 3.0–3.6 V operation in a 240-pin BFQFP exposed-pad surface-mount package, this device is suitable for board-level designs that need configurable logic capacity, on-chip memory, and JTAG-configurable in-circuit reconfigurability.

Key Features

• Logic Capacity — 4,992 logic elements providing the programmable resources required for medium-density designs and custom logic implementation.
• Gate Density — Up to 158,000 system gates as indicated for this device specification to support complex logic integration.
• Embedded Memory — 24,576 bits of on-chip RAM (~24.6 Kbits) for data buffering, FIFOs, and small memory structures without external SRAM.
• I/O Density — 189 user I/O pins to support multiple peripherals, parallel interfaces, and board-level system integration.
• Power and Voltage — Device specified for 3.0 V to 3.6 V supply operation, enabling integration into 3.3 V systems.
• Package and Mounting — 240-BFQFP exposed pad (240-RQFP, 32×32 footprint) in a surface-mount package for thermal relief and standard PCB assembly.
• Operating Range — Commercial-grade operation from 0 °C to 70 °C suitable for typical commercial embedded applications.
• Reconfiguration & Test — Supports in-circuit reconfigurability and includes JTAG boundary-scan test circuitry as provided by the FLEX 10K family.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic and peripheral glue logic for embedded systems using the device’s logic and I/O resources.
• Memory and Data Handling — Use on-chip RAM for buffering, small data stores, and FIFO implementations without immediate need for external memory.
• System Integration / SOPC — Consolidate multiple discrete functions onto a single programmable device for System-on-a-Programmable-Chip (SOPC) integration.
• Prototyping & Development — Flexible reconfiguration and JTAG access make the device suitable for iterative hardware development and validation on commercial boards.

Unique Advantages

• Balanced Logic and Memory: Combines 4,992 logic elements with 24,576 bits of embedded RAM to implement control, data-path, and small-memory functions within one device.
• High I/O Count: 189 user I/Os simplify board-level connectivity and reduce the need for external interface components.
• Commercial-Ready Package: 240-pin BFQFP exposed-pad surface-mount package offers a standard footprint with thermal pad for improved board-level thermal management.
• Configurable In-System: In-circuit reconfigurability and JTAG support streamline development, updates, and boundary-scan testing during manufacturing.
• Manufacturer Ecosystem: Part of the FLEX 10K family with documented design support referenced in the family datasheet for design entry and place-and-route tooling.
• Regulatory Friendly: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose EPF10K100ARC240-3N?

EPF10K100ARC240-3N positions itself as a versatile, medium-density FPGA for commercial embedded designs that need a balance of logic, on-chip RAM, and a substantial number of I/Os in a standard surface-mount package. Its 3.0–3.6 V supply range and exposed-pad BFQFP package make it suitable for conventional PCB assemblies requiring straightforward thermal management.

Engineers and procurement teams seeking a flexible programmable device with in-system reconfiguration, JTAG testability, and the support associated with the FLEX 10K family will find this device appropriate for consolidating functions, reducing discrete components, and accelerating design iterations.

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