EPF10K100ARC240-2N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 24576 4992 240-BFQFP Exposed Pad

Quantity 122 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates158000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K100ARC240-2N – FLEX-10KA® Field Programmable Gate Array (FPGA), 4,992 Logic Elements, 24,576-bit RAM, 189 I/O, 240-BFQFP

The EPF10K100ARC240-2N is a FLEX-10KA® family field programmable gate array (FPGA) offering embedded programmable logic and memory for system-level integration. It combines a dedicated logic array and embedded memory blocks to implement custom logic, megafunctions, and on-chip data storage for medium-density designs.

Designed for commercial-grade applications, this surface-mount device provides 4,992 logic elements, approximately 24,576 bits of embedded RAM, and 189 user I/O signals in a 240-pin BFQFP package—making it suitable for communication interfaces, control logic, and SOPC-style integration where reconfigurable logic and on-chip memory reduce board-level complexity.

Key Features

  • Core Logic — 4,992 logic elements and a reported 158,000 system gates provide programmable logic resources for custom algorithms and glue logic.
  • Embedded Memory — Approximately 24,576 bits of on-chip RAM support data buffering, small FIFOs, and lookup tables without external memory.
  • I/O Capacity — 189 user I/O pins enable broad peripheral interfacing and flexible board-level connectivity.
  • Package and Mounting — 240-BFQFP exposed pad (supplier package: 240-RQFP, 32 × 32) suitable for surface-mount assembly while providing a thermal exposed pad.
  • Power — Operates from a 3.0 V to 3.6 V supply range compatible with 3.3 V system rails.
  • Environmental & Grade — Commercial grade device with RoHS compliance; specified operating temperature range 0 °C to 70 °C.
  • Configuration & Test — Series-level features include in-circuit reconfigurability options and IEEE 1149.1 JTAG boundary-scan test circuitry for device programming and board-level test access.
  • System Features from FLEX 10K Family — Series documentation describes SOPC integration, ClockLock and ClockBoost options for clock control, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and built-in low-skew clock distribution trees.

Typical Applications

  • Communications Interfaces — Implement protocol glue logic, custom interface bridging, and timing-critical data paths leveraging the device’s I/O count and on-chip RAM.
  • Embedded Control & Prototyping — Use as a reconfigurable controller for motor drives, industrial controllers, or system prototypes where flexible logic and embedded memory accelerate development.
  • Signal Aggregation & Pre-processing — Aggregate multiple sensor or peripheral streams and perform pre-processing or buffering using the device’s logic and RAM resources.
  • SOPC and Megafunction Integration — Implement system-on-a-programmable-chip (SOPC) architectures and megafunctions that combine embedded memory with general-purpose logic.

Unique Advantages

  • Balanced Logic and Memory — The combination of 4,992 logic elements and ~24,576 bits of embedded RAM lets designers keep critical state and buffers on-chip, reducing external component count.
  • High I/O Count — 189 user I/Os enable direct interfacing to multiple peripherals and buses without external multiplexing logic.
  • Flexible Configuration and Test — Support for in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan simplifies programming, debug, and board-level testing.
  • Commercial Temperature Range — Specified 0 °C to 70 °C operation aligns with many commercial and lab environments for dependable performance.
  • RoHS Compliant — Environmentally compliant manufacturing supports modern assembly and procurement requirements.
  • Clock and Arithmetic Support (Family-Level) — Family features such as ClockLock/ClockBoost and dedicated carry/cascade chains help implement low-skew clocks and efficient arithmetic functions when used in system designs.

Why Choose EPF10K100ARC240-2N?

The EPF10K100ARC240-2N positions itself as a commercially graded, mid-density FPGA for designs that need a balanced mix of logic, embedded RAM, and I/O without relying on external memory. Its 4,992 logic elements, substantial on-chip RAM, and 189 I/Os make it well suited to system integration tasks, protocol bridging, and prototyping where in-circuit reconfigurability and JTAG support simplify development and test.

Backed by FLEX 10K family documentation and design support references, this device is appropriate for engineering teams seeking a reprogrammable, RoHS-compliant FPGA in a 240-pin BFQFP package with standard 3.3 V supply compatibility and commercial temperature operation.

If you would like pricing or availability, request a quote or submit a procurement inquiry today.

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