EPF10K100ARC240-1

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 24576 4992 240-BFQFP Exposed Pad

Quantity 817 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates158000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K100ARC240-1 – FLEX-10KA Field Programmable Gate Array (FPGA) IC, 4,992 Logic Elements, 24,576-bit RAM, 189 I/O, 240-BFQFP

The EPF10K100ARC240-1 is a FLEX-10KA family field programmable gate array (FPGA) from Intel. It combines a mid-range programmable logic capacity with embedded memory and flexible I/O in a 240-pin BFQFP surface-mount package.

Designed for embedded-system integration and complex logic functions, this commercial-grade FPGA provides on-chip resources appropriate for applications that need integrated logic, embedded RAM, and a dense I/O footprint within a 0 °C to 70 °C operating range.

Key Features

  • Programmable logic capacity — 4,992 logic elements (LEs) and approximately 158,000 gates for implementing medium-complexity logic and combinational/sequential functions.
  • Embedded memory — Total on-chip RAM of 24,576 bits to support buffering, look-up tables, and megafunction implementations.
  • I/O resources — 189 user I/O pins to connect peripherals, sensors, and external subsystems.
  • Voltage supply — Operates from 3 V to 3.6 V, matching common 3.3 V embedded system power domains.
  • Package and mounting — 240-BFQFP with exposed pad, supplied as a 240-RQFP (32×32) surface-mount package for PCB assembly and thermal conduction.
  • Temperature and grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
  • Board-level compliance — RoHS-compliant component.
  • FLEX 10KA family capabilities (from datasheet) — Family-level features include System-on-a-Programmable-Chip (SOPC) integration, in-circuit reconfigurability (ICR) and JTAG boundary-scan test circuitry, FastTrack interconnect, dedicated carry and cascade chains, and clock management options such as ClockLock and ClockBoost.

Typical Applications

  • Embedded systems and SOPC integration — On-chip logic and embedded RAM enable consolidation of control, glue logic, and memory-intensive functions into a single programmable device.
  • Interface bridging and I/O expansion — 189 I/O pins make the device suitable for implementing protocol adapters, bus bridges, and peripheral interfaces.
  • Data buffering and packet processing — The 24,576 bits of embedded memory support temporary storage, FIFO buffering, and small on-chip data structures used in communication and data-path designs.
  • Prototyping and evaluation — The combination of substantial logic elements and family-level configuration features supports proof-of-concept designs and iterative development.

Unique Advantages

  • Balanced logic and memory — 4,992 logic elements combined with 24,576 bits of RAM provide a useful balance for designs that need both combinational/sequential logic and embedded storage without external memory.
  • High I/O density — 189 I/O pins support complex peripheral connectivity and reduce the need for external I/O expanders.
  • Standard 3.3 V domain compatibility — 3 V to 3.6 V supply range aligns with common 3.3 V system architectures for straightforward power integration.
  • Surface-mount BFQFP with exposed pad — The 240-pin exposed-pad package supports board-level assembly and thermal management in compact layouts.
  • Family-level system features — FLEX-10KA series capabilities such as in-circuit reconfigurability and JTAG boundary-scan help simplify development, testing, and field update strategies.
  • Regulatory and supply readiness — RoHS compliance supports deployment in assemblies requiring lead-free components.

Why Choose EPF10K100ARC240-1?

The EPF10K100ARC240-1 positions itself as a commercially graded FLEX-10KA FPGA that balances logic density, embedded RAM, and substantial I/O in a surface-mount BFQFP package. Its on-chip resources and family-level configuration features make it a practical choice for embedded designs that require consolidation of logic and memory into a single programmable device.

Engineers looking for a mid-range FPGA solution for SOPC-style integration, interface bridging, or prototype development will find the EPF10K100ARC240-1 offers the predictable power domain (3 V–3.6 V), package options, and development support associated with the FLEX-10KA family and Intel’s FPGA toolchain.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EPF10K100ARC240-1.

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