EPF10K100ARC240-1
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 189 24576 4992 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 817 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 158000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K100ARC240-1 – FLEX-10KA Field Programmable Gate Array (FPGA) IC, 4,992 Logic Elements, 24,576-bit RAM, 189 I/O, 240-BFQFP
The EPF10K100ARC240-1 is a FLEX-10KA family field programmable gate array (FPGA) from Intel. It combines a mid-range programmable logic capacity with embedded memory and flexible I/O in a 240-pin BFQFP surface-mount package.
Designed for embedded-system integration and complex logic functions, this commercial-grade FPGA provides on-chip resources appropriate for applications that need integrated logic, embedded RAM, and a dense I/O footprint within a 0 °C to 70 °C operating range.
Key Features
- Programmable logic capacity — 4,992 logic elements (LEs) and approximately 158,000 gates for implementing medium-complexity logic and combinational/sequential functions.
- Embedded memory — Total on-chip RAM of 24,576 bits to support buffering, look-up tables, and megafunction implementations.
- I/O resources — 189 user I/O pins to connect peripherals, sensors, and external subsystems.
- Voltage supply — Operates from 3 V to 3.6 V, matching common 3.3 V embedded system power domains.
- Package and mounting — 240-BFQFP with exposed pad, supplied as a 240-RQFP (32×32) surface-mount package for PCB assembly and thermal conduction.
- Temperature and grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
- Board-level compliance — RoHS-compliant component.
- FLEX 10KA family capabilities (from datasheet) — Family-level features include System-on-a-Programmable-Chip (SOPC) integration, in-circuit reconfigurability (ICR) and JTAG boundary-scan test circuitry, FastTrack interconnect, dedicated carry and cascade chains, and clock management options such as ClockLock and ClockBoost.
Typical Applications
- Embedded systems and SOPC integration — On-chip logic and embedded RAM enable consolidation of control, glue logic, and memory-intensive functions into a single programmable device.
- Interface bridging and I/O expansion — 189 I/O pins make the device suitable for implementing protocol adapters, bus bridges, and peripheral interfaces.
- Data buffering and packet processing — The 24,576 bits of embedded memory support temporary storage, FIFO buffering, and small on-chip data structures used in communication and data-path designs.
- Prototyping and evaluation — The combination of substantial logic elements and family-level configuration features supports proof-of-concept designs and iterative development.
Unique Advantages
- Balanced logic and memory — 4,992 logic elements combined with 24,576 bits of RAM provide a useful balance for designs that need both combinational/sequential logic and embedded storage without external memory.
- High I/O density — 189 I/O pins support complex peripheral connectivity and reduce the need for external I/O expanders.
- Standard 3.3 V domain compatibility — 3 V to 3.6 V supply range aligns with common 3.3 V system architectures for straightforward power integration.
- Surface-mount BFQFP with exposed pad — The 240-pin exposed-pad package supports board-level assembly and thermal management in compact layouts.
- Family-level system features — FLEX-10KA series capabilities such as in-circuit reconfigurability and JTAG boundary-scan help simplify development, testing, and field update strategies.
- Regulatory and supply readiness — RoHS compliance supports deployment in assemblies requiring lead-free components.
Why Choose EPF10K100ARC240-1?
The EPF10K100ARC240-1 positions itself as a commercially graded FLEX-10KA FPGA that balances logic density, embedded RAM, and substantial I/O in a surface-mount BFQFP package. Its on-chip resources and family-level configuration features make it a practical choice for embedded designs that require consolidation of logic and memory into a single programmable device.
Engineers looking for a mid-range FPGA solution for SOPC-style integration, interface bridging, or prototype development will find the EPF10K100ARC240-1 offers the predictable power domain (3 V–3.6 V), package options, and development support associated with the FLEX-10KA family and Intel’s FPGA toolchain.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EPF10K100ARC240-1.

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