EPF10K100AFC484-2N

The EPF10K100AFC484-2N is a FLEX-10KA family field programmable gate array (FPGA) supplied in a 484-ball fine-pitch BGA package. It delivers a balanced combination of logic capacity, embedded RAM, and a high I/O count for system-level integration and custom logic implementation.

Designed for commercial applications, this device is suited to designs that require on-chip memory and flexible interfacing, providing 4,992 logic elements, 24,576 bits of embedded RAM, and 369 user I/O pins while operating from a 3.0 V to 3.6 V supply over a 0 °C to 70 °C temperature range.

Key Features

• Logic Capacity  Approximately 4,992 logic elements enabling medium-density programmable logic and combinational/sequential designs.
• Embedded Memory  24,576 total RAM bits of on-chip memory for implementing FIFOs, buffers, and other memory-intensive megafunctions.
• I/O and Interface Flexibility  369 user I/O pins support complex external interfacing and dense board-level connectivity.
• Package and Mounting  484-ball BGA (484-FBGA, 23×23) surface-mount package for compact board integration and improved signal routing.
• Power and Temperature  3.0 V to 3.6 V supply range with commercial-grade operating temperature from 0 °C to 70 °C.
• System-Level Features  Family-level capabilities include embedded arrays for megafunctions, in-circuit reconfigurability, JTAG boundary-scan support, and options such as ClockLock and ClockBoost for clock management (as provided by the FLEX 10K family).
• Manufacturing and Compliance  RoHS-compliant construction to meet standard environmental requirements.

Typical Applications

• System Integration / SOPC  Implement system-on-a-programmable-chip designs that combine custom logic and embedded memory for compact system architectures.
• High‑I/O Interface Bridging  Use the device’s 369 I/O pins to bridge peripherals, protocol converters, or custom board-level interfaces.
• Memory and Buffering Functions  Leverage the on-chip RAM to implement FIFOs, small data buffers, and scratchpad memory for dataflow control.
• Prototyping and Development  Medium-density logic and flexible reconfiguration make this device suitable for hardware prototyping and iterative design cycles.
• PCI and Peripheral Subsystems  Family-level support for PCI-related features enables integration into PCI-local-bus-capable designs where applicable.

Unique Advantages

• Balanced logic and memory: 4,992 logic elements combined with 24,576 bits of embedded RAM deliver a useful mix of compute and storage for mid-range designs.
• High pin-count connectivity: 369 user I/O pins enable complex external interfacing without additional bridge devices, reducing BOM and board complexity.
• Compact BGA packaging: 484-ball FBGA (23×23) minimizes board footprint while supporting dense routing for high-functionality boards.
• Family-level system features: Support for embedded arrays, JTAG boundary-scan, in-circuit reconfiguration, and clock management options simplifies system integration and debug.
• Commercial-grade suitability: Designed for 0 °C to 70 °C operation and RoHS-compliant manufacturing to meet standard commercial product requirements.

Why Choose EPF10K100AFC484-2N?

The EPF10K100AFC484-2N offers a practical balance of logic resources, embedded memory, and I/O capacity for commercial system designs that require on-chip buffering, protocol interfacing, and reconfigurable logic. Its FLEX-10KA family features provide system-level capabilities—including embedded arrays and JTAG support—useful for integrating megafunctions and simplifying board-level architecture.

This device is well suited for engineering teams building medium-density programmable solutions where compact packaging, flexible I/O, and on-chip memory improve integration, shorten development cycles, and reduce component count.

Request a quote or submit a quotation for EPF10K100AFC484-2N to check availability and pricing for your project needs.