EPF10K100ABI356-3

The EPF10K100ABI356-3 is an Intel FLEX-10KA family FPGA supplied in a 356‑ball LGA package. This industrial‑grade, surface‑mount device integrates 4,992 logic elements and approximately 24,576 bits of on‑chip RAM with extensive I/O capability, making it suitable for embedded logic, I/O aggregation, and system integration tasks.

As a member of the FLEX 10KA family, the device supports family-level capabilities such as embedded array resources for megafunctions, in‑circuit reconfigurability and JTAG boundary‑scan. Its combination of logic density, embedded memory, and I/O count addresses mid‑range programmable logic requirements in industrial and embedded systems.

Key Features

• Logic Capacity — 4,992 logic elements and 624 LABs provide mid-range combinational and sequential logic resources for custom hardware functions.
• Embedded Memory — Approximately 24,576 bits of on‑chip RAM to support buffering, small lookup tables and megafunctions without external memory.
• I/O and System Gates — 274 user I/O pins and a device gate count of 158,000 to support dense interfacing and complex system logic.
• Package and Mounting — 356‑LBGA (356‑BGA, 35×35) package optimized for board space efficiency; surface‑mount assembly.
• Power Supply — Nominal supply range 3.0 V to 3.6 V (3.3 V systems compatibility).
• Industrial Temperature Range — Specified to operate from −40 °C to 85 °C for industrial applications.
• Family Features — FLEX 10KA family capabilities include embedded array support for megafunctions, multi‑volt I/O options, in‑circuit reconfigurability (ICR), and IEEE‑1149.1 JTAG boundary‑scan.
• Standards & Compliance — RoHS compliant and offered by Intel as part of the FLEX 10KA product line.

Typical Applications

• Industrial Control — Implement custom control logic, motor-control interfaces and deterministic state machines using the device’s logic elements and on‑chip RAM.
• Embedded Systems & SOPC — Integrate peripheral functions and megafunctions as part of a system‑on‑a‑programmable‑chip design leveraging FLEX 10KA family embedded array resources.
• I/O Aggregation & Protocol Bridging — Use the 274 I/O pins for sensor aggregation, protocol conversion or front‑end interfacing in mixed‑signal systems.
• PCI and Peripheral Interfaces — Applicable to PCI and other peripheral interface use cases supported by FLEX 10KA family features such as selectable pull‑up/clamping diodes and I/O options.
• Prototyping & Custom Logic — Rapidly iterate custom logic and hardware acceleration blocks with in‑circuit reconfigurability and JTAG‑based programming and test.

Unique Advantages

• Balanced Logic & Memory — Combines 4,992 logic elements with ~24,576 bits of embedded RAM so designers can implement mixed compute and buffering functions on‑chip.
• High I/O Count — 274 user I/O pins enable dense external connectivity without extensive glue logic.
• Industrial Temperature Rating — Specified −40 °C to 85 °C to meet a wide range of industrial use‑case temperature requirements.
• Surface‑Mount 356‑LBGA — Fine‑pitch BGA package maximizes board area efficiency for compact designs.
• Family Ecosystem Features — Access to FLEX 10KA family capabilities such as JTAG boundary‑scan and in‑circuit reconfigurability simplifies testing and field updates.
• RoHS Compliant — Conforms to RoHS requirements for environmentally responsible designs.

Why Choose EPF10K100ABI356-3?

The EPF10K100ABI356-3 offers a practical balance of logic density, embedded memory and high I/O count in a compact 356‑LBGA package for industrial and embedded applications. Its specifications—4,992 logic elements, ~24.6k bits of RAM, 274 I/Os and an industrial temperature rating—make it well suited to mid‑range system integration tasks where board space, on‑chip resources and connectivity are key considerations.

As part of the FLEX‑10KA family from Intel, the device benefits from family‑level features such as embedded array megafunction support, in‑circuit reconfigurability and JTAG boundary‑scan for development, test and field update workflows, providing long‑term flexibility and scalability across related designs.

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