EPF10K100ABI356-2N

The EPF10K100ABI356-2N is a FLEX-10KA family field programmable gate array (FPGA) in a 356-ball LBGA package targeted for industrial applications. It combines a logic array and embedded programmable memory to implement both general-purpose logic and megafunctions for system-on-a-programmable-chip designs.

With 4,992 logic elements and 24,576 bits of on-chip RAM, this device addresses mid-density integration requirements where a balance of logic resources, embedded memory and I/O count is needed for embedded control, interface bridging and custom logic functions.

Key Features

• Logic Capacity  4,992 logic elements and approximately 158,000 gates provide mid-range implementation resources for combinational and sequential logic.
• Logic Array Blocks (LABs)  624 logic array blocks (LABs) support structured placement of logic for predictable synthesis and routing.
• Embedded Memory  24,576 total RAM bits for on-chip data buffering, lookup tables and small FIFOs.
• I/O  274 user I/O pins enable multi-pin interfacing and board-level connectivity for peripherals and external devices.
• Package  356-LBGA (35 × 35 mm) surface-mount package for compact board integration and high-density PCB designs.
• Power  3.0 V to 3.6 V supply range to support 3.3 V system environments.
• Operating Range  Industrial temperature rating: –40 °C to +85 °C for deployment in temperature-challenging environments.
• Family-Level Architecture  FLEX 10KA family features such as embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, JTAG boundary-scan and low-skew clock distribution are available at the device-family level.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the device for motor control logic, machine I/O aggregation and real-time control functions that require industrial temperature support and robust I/O counts.
• Interface Bridging  Implement protocol conversion, bus bridging and custom interface logic where the combination of logic elements and embedded RAM simplifies board-level design.
• Embedded Systems  Integrate custom processing, peripheral aggregation and glue logic within embedded products that benefit from the device’s on-chip RAM and structured logic resources.
• Prototyping and SOPC Integration  Leverage the FLEX 10KA family’s embedded array architecture for implementing megafunctions during system prototyping and programmable integration tasks.

Unique Advantages

• Balanced mid-range capacity: 4,992 logic elements and roughly 158,000 gates provide ample resources for medium-complexity designs without overprovisioning.
• Embedded memory on-chip: 24,576 bits of RAM reduce dependence on external memory for small buffers and state storage, simplifying BOM and PCB routing.
• High I/O count: 274 user I/O pins accommodate extensive peripheral and sensor interfacing on a single device.
• Industrial temperature rating: –40 °C to +85 °C supports deployment in constrained thermal environments common to industrial applications.
• Compact, high-density package: 356-LBGA surface-mount package enables space-efficient board layouts while exposing a large number of I/Os.
• RoHS compliant: Environmentally compliant manufacturing for regulatory and supply-chain alignment.

Why Choose EPF10K100ABI356-2N?

The EPF10K100ABI356-2N positions itself as a practical mid-density FPGA for designs that require a mix of logic elements, embedded RAM, and a substantial I/O footprint in an industrial-temperature, surface-mount package. Its FLEX-10KA family architecture delivers embedded-array capabilities and family-level features that simplify implementation of megafunctions and structured logic.

This device is well suited for engineering teams building embedded controllers, interface bridges and system integration functions where predictable logic resources, on-chip memory and a high pin count improve system integration and reduce external components.

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