EPF10K100ABI600-2

The EPF10K100ABI600-2 is a FLEX-10KA family field-programmable logic device optimized for mid-range density programmable systems. It combines an embedded array and a general logic array architecture suitable for System-on-a-Programmable-Chip (SOPC) integration and megafunction implementation.

Designed for industrial applications, this device provides a balance of logic capacity, embedded memory, and high I/O count in a compact 600‑BGA package, making it well suited to embedded controllers, protocol bridging, and custom logic functions in space-constrained boards.

Key Features

• Architecture & integration  FLEX‑10KA family device with an embedded array for implementing megafunctions alongside a general logic array for custom logic.
• Logic capacity  4,992 logic elements and 158,000 system gates provide mid-range logic resources for combinational and sequential designs.
• Embedded memory  24,576 bits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• High I/O count  406 user I/O pins support complex interfacing and dense connectivity on multi‑signal designs.
• Dedicated arithmetic and routing  Series-level features include dedicated carry and cascade chains and a continuous FastTrack interconnect structure for predictable routing delays.
• Clock and timing options  Built-in low-skew clock distribution and family support for clock optimization features to manage clock delay and skew.
• Package and mounting  600‑BGA (45 × 45 mm) surface-mount package for compact board-level integration.
• Power and environmental  Nominal supply range 3.0 V to 3.6 V, RoHS compliant, industrial operating temperature range −40 °C to 85 °C.
• Manufacturing and test  Built-in JTAG boundary-scan test circuitry (IEEE Std. 1149.1) for board-level test and in-circuit reconfigurability options at the family level.

Typical Applications

• Embedded systems  SOPC integration and on-chip memory make the device suitable for compact embedded controllers and subsystem integration.
• Industrial automation  Industrial-grade temperature range and robust I/O count enable motor control, sensor interfacing, and machine-control logic.
• Protocol bridging & interface logic  High pin count and flexible routing are useful for protocol translation, bus bridging, and custom interface glue logic.
• Prototyping and custom logic  Mid-range logic density and embedded RAM support rapid prototyping of custom algorithms and functional blocks.

Unique Advantages

• Balanced mid-range capacity: 4,992 logic elements and 158,000 gates provide substantial resources without the footprint of larger devices.
• On-chip memory: 24,576 bits of embedded RAM reduce external memory needs for many control and buffering tasks.
• Dense connectivity: 406 user I/Os enable complex board-level interconnect and multi‑channel interfacing.
• Industrial robustness: Rated for −40 °C to 85 °C and supplied in a compact 600‑BGA package for industrial system designs.
• Design flexibility: Family-level features such as dedicated carry/cascade chains and FastTrack interconnect support efficient implementation of arithmetic and high‑fan‑in logic.
• Testability and reconfigurability: Built‑in JTAG boundary-scan and family support for in-circuit reconfiguration simplify production test and firmware updates.

Why Choose EPF10K100ABI600-2?

The EPF10K100ABI600-2 positions itself as a practical choice for designers who need a mid-density, industrial-grade programmable device that combines a significant logic element count with substantial on-chip RAM and a high I/O pin count. Its 600‑BGA package and industrial temperature rating make it suitable for compact, reliable board-level deployment.

This device is a good fit for teams developing embedded subsystems, interface logic, and industrial control functions who require a balance of integration, I/O capacity, and design flexibility backed by the FLEX‑10KA family architecture and series-level features.

If you would like pricing, availability, or to request a quote for EPF10K100ABI600-2, submit an inquiry or a quote request through your procurement process to get next steps and lead‑time information.