EPF10K100ABI356-2
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 274 24576 4992 356-LBGA |
|---|---|
| Quantity | 910 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 158000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K100ABI356-2 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC, 4,992 logic elements, 24,576 bits RAM, 274 I/O, 356-LBGA
The EPF10K100ABI356-2 is a FLEX 10KA family embedded programmable logic device from Intel designed for system-level integration of reconfigurable logic and embedded memory. It combines a dedicated logic array and embedded array blocks to implement both general-purpose logic and megafunctions such as efficient on-chip memory.
Targeted at industrial applications, the device delivers high-density programmable logic with a broad I/O complement and on-chip RAM, enabling complex custom logic, memory-intensive functions, and system-on-a-programmable-chip (SOPC) integration.
Key Features
- High-density core – 158,000 gates and 4,992 logic elements provide substantial programmable logic capacity for complex functions and glue logic.
- Embedded memory – Approximately 24,576 bits of on-chip RAM, supported by embedded array blocks for efficient implementation of buffers, FIFOs, and other memory-based megafunctions.
- I/O and interfacing – 274 user I/O pins available for system connectivity; FLEX 10K family features include MultiVolt I/O interface support and family-level PCI compatibility.
- System configurability – In-circuit reconfigurability (ICR) options and built-in JTAG boundary-scan (IEEE 1149.1) permit field configuration and board-level test without consuming device logic.
- Package and mounting – 356-LBGA package (356-BGA, 35×35) in a surface-mount form factor for high pin-count, compact board layouts.
- Power and supply – Operates from a 3.0 V to 3.6 V supply; FLEX 10K family includes low-power features for standby operation.
- Industrial temperature grade – Specified operating temperature range from −40 °C to 85 °C for use in industrial environments.
Typical Applications
- System integration and SOPC – Implement custom system-on-a-programmable-chip functions by combining logic and embedded memory on a single device.
- High-density glue logic – Replace multiple discrete components with programmable logic for protocol translation, bus interfacing, and control logic.
- Memory-backed megafunctions – On-chip RAM and embedded array blocks support FIFOs, buffers, and specialized memory functions within embedded designs.
- Industrial control and instrumentation – Industrial-grade temperature range and extensive I/O make the device suitable for embedded controllers and instrumentation logic.
Unique Advantages
- Substantial programmable capacity: 158,000 gates and 4,992 logic elements allow implementation of complex designs without external logic proliferation.
- Integrated on-chip memory: Approximately 24,576 bits of RAM reduces the need for external memory for many control and buffering tasks, simplifying board design.
- Flexible I/O and system support: 274 I/O pins and family-level MultiVolt/PCI support enable connectivity to a wide range of peripherals and system buses.
- Field configurability and testability: In-circuit reconfiguration and JTAG boundary-scan support ease updates in the field and streamline board-level testing.
- Industrial robustness: Surface-mount 356-LBGA packaging and −40 °C to 85 °C operating range suit industrial deployment scenarios.
- Toolchain and family ecosystem: FLEX 10K family design support and megafunctions simplify development and accelerate time to prototype.
Why Choose EPF10K100ABI356-2?
The EPF10K100ABI356-2 positions itself as a high-density, industrial-grade programmable solution for designers who need a combination of significant logic capacity, embedded memory, and abundant I/O in a compact BGA package. Its family-level features—such as in-circuit reconfigurability, JTAG boundary-scan, and software design support—help shorten development cycles and simplify system integration.
For embedded and system designers building memory-aware logic, protocol bridging, or SOPC-style integrations, this FLEX 10KA device delivers a balanced platform of performance, configurability, and industrial suitability backed by the FLEX 10K tool ecosystem and manufacturer support.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EPF10K100ABI356-2. Our team can assist with volume pricing and delivery options tailored to your project needs.

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