EPF10K100ABC600-1
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 406 24576 4992 600-BGA |
|---|---|
| Quantity | 856 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 600-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 600-BGA | Number of I/O | 406 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 158000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K100ABC600-1 – FLEX-10KA® Field Programmable Gate Array (FPGA) IC 406 24576 4992 600-BGA
The EPF10K100ABC600-1 is a FLEX 10KA series field programmable gate array from Intel (Altera). It combines a logic array with embedded memory resources to support System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient on-chip memory and specialized logic functions.
With 4,992 logic elements, 24,576 bits of embedded RAM and up to 406 user I/O pins in a 600-ball BGA package, this commercial-grade device is targeted at board-level designs that require moderate logic density, flexible I/O and in-circuit reconfigurability.
Key Features
- Core Logic — 4,992 logic elements and approximately 158,000 maximum system gates enable implementation of mid-range custom logic and control functions.
- Embedded Memory — 24,576 total RAM bits across embedded array blocks support on-chip data buffering and megafunctions.
- I/O and Interfacing — Up to 406 user I/O pins with MultiVolt™ I/O support; FLEX 10KA devices include 5.0-V tolerant input pins and selectable pull-up clamping diodes for 3.3-V PCI compliance as described for the family.
- Reconfiguration and Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (IEEE 1149.1) is available without consuming device logic.
- Clock and Routing — Dedicated carry and cascade chains for arithmetic and high-fan-in logic, fastTrack® continuous routing structure, and support for multiple global clocks and clears as provided in the FLEX 10K family documentation.
- Package and Mounting — Surface-mount 600-BGA (45 × 45 mm footprint) for high I/O density and board-space efficiency.
- Power and Supply — Operates from 3.0 V to 3.6 V supply range; family-level documentation also describes multi-voltage I/O support.
- Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature.
- Compliance — RoHS compliant.
Typical Applications
- System Integration and SOPC — Implement on-chip megafunctions and combine memory and logic for compact system designs.
- Interface Bridging and Peripheral Logic — Use the device’s ample I/O and MultiVolt support to implement board-level protocol conversion and peripheral controllers.
- Memory-Backed Logic — Deploy embedded RAM for buffering, lookup tables and specialized memory-centric functions.
- Prototyping and Custom Control — Mid-range logic density and reconfigurability make the device suitable for iterative hardware development and custom control applications.
Unique Advantages
- Balanced Integration: 4,992 logic elements combined with 24,576 bits of embedded RAM provide integrated resources for many mid-range designs, reducing external component count.
- High I/O Density: 406 user I/O pins in a 600-BGA package enable complex board-level interfacing and flexible signal routing.
- Reconfigurable In-System: In-circuit reconfigurability via external configuration, intelligent controller, or JTAG supports design updates without board rework.
- Family-Level Support for PCI and Multi-Voltage I/O: FLEX 10KA family features such as 5.0-V tolerant inputs and selectable pull-up clamping diodes simplify integration with mixed-voltage peripherals.
- Testability: Built-in IEEE 1149.1 JTAG boundary-scan test reduces test overhead without consuming logic resources.
Why Choose EPF10K100ABC600-1?
The EPF10K100ABC600-1 positions itself as a flexible, mid-density FPGA choice within the FLEX 10KA family, offering a useful balance of logic capacity, embedded memory and high I/O count in a space-efficient 600-BGA package. Its commercial temperature rating and 3.0–3.6 V supply range make it suitable for a wide range of board-level applications that require in-system reconfiguration and on-chip memory resources.
Engineers designing embedded systems, interface logic, or memory-backed custom functions will find the device’s combination of logic elements, embedded RAM and family-level features like MultiVolt I/O and JTAG helpful for reducing BOM complexity and enabling iterative development.
Request a quote or submit a procurement inquiry to evaluate EPF10K100ABC600-1 for your next design project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018