EPF10K100ABC356-2

The EPF10K100ABC356-2 is a FLEX-10KA family Field Programmable Gate Array (FPGA) designed for embedded programmable logic and System-on-a-Programmable-Chip (SOPC) integration. This mid-density device combines 4,992 logic elements with approximately 24,576 bits of embedded RAM and 12 embedded array blocks (EABs) to implement memory, specialized logic functions and general-purpose logic on a single chip.

With 274 I/O pins in a 356-LBGA package, support for in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan, the device targets embedded designs that require flexible on-chip resources, multi-voltage I/O options, and compact board-level integration.

Key Features

• Core Capacity: 4,992 logic elements and up to 158,000 system gates provide mid-range programmable logic capability for control, glue-logic and custom datapaths.
• Embedded Memory: Approximately 24,576 bits of on-chip RAM delivered across 12 embedded array blocks (EABs) for efficient implementation of FIFOs, buffers and megafunctions.
• I/O and Packaging: 274 user I/O pins in a 356-LBGA (356-BGA, 35×35) package with surface-mount compatibility for dense board layouts.
• Power and Temperature: Operates from a 3.0 V to 3.6 V supply and specified for commercial operating temperatures from 0 °C to 70 °C.
• Reconfiguration and Test: In-circuit reconfigurability via external configuration devices or JTAG; includes IEEE 1149.1-compliant JTAG boundary-scan test circuitry without consuming device logic.
• Fast Interconnect and Arithmetic Support: FastTrack continuous routing structure, dedicated carry chains and cascade chains to support efficient arithmetic and high-fan-in logic implementations.
• Clocking: Built-in low-skew clock distribution with options such as ClockLock and ClockBoost for reduced clock delay/skew and clock multiplication.
• I/O Flexibility: Individual tri-state output enable control, open-drain option, programmable output slew-rate control and support for MultiVolt™ I/O interfaces; FLEX 10KA devices include 5.0-V tolerant input pins and selectable pull-up clamping diodes for PCI compatibility where applicable.
• Compliance: RoHS compliant and supplied in a compact BGA package to support modern assembly processes.

Typical Applications

• Embedded Systems & SOPC Integration: Consolidate multiple functions and megafunctions (memory and specialized logic) onto a single programmable device for compact system designs.
• Memory and Buffering: Use the on-chip RAM and EABs to implement FIFOs, buffering and small memory blocks that reduce external memory requirements.
• Peripheral Interfacing: Implement custom interfaces and glue logic for peripherals, including support for 3.3 V and PCI-related I/O features present in the FLEX 10KA family.
• Prototyping and Control Logic: Rapidly iterate and deploy control, sequencing and custom logic functions using in-circuit reconfigurability and standard JTAG-based programming.

Unique Advantages

• Balanced Logic and Memory: The combination of 4,992 logic elements and 12 EABs with ~24,576 bits of RAM enables mixed logic-and-memory implementations without sacrificing logic capacity.
• High I/O Count in a Compact Package: 274 user I/Os in a 356-LBGA (35×35) package streamlines board routing while preserving large external connectivity.
• In-System Reconfigurability: Support for in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan simplifies field updates and manufacturing test without consuming usable logic.
• Deterministic Interconnect and Arithmetic Support: FastTrack interconnect and dedicated carry/cascade chains accelerate implementation of arithmetic, counters and high-fan-in logic used in embedded algorithms.
• Industrially Proven Feature Set: Low-skew clock networks, ClockLock/ClockBoost options, programmable I/O features and RoHS compliance provide practical engineering advantages for commercial designs.

Why Choose EPF10K100ABC356-2?

The EPF10K100ABC356-2 positions itself as a versatile, mid-density FLEX-10KA FPGA suitable for embedded applications that require an on-chip blend of logic resources and embedded memory. Its 4,992 logic elements, approximately 24,576 bits of RAM, and 274 I/Os in a 356-LBGA package deliver practical integration benefits for designers balancing routing density, I/O count and on-chip storage.

Backed by Intel as the manufacturer and featuring in-system reconfigurability, JTAG test support and a mature set of interconnect and clocking features, this device is a strong choice for teams building commercial embedded systems, prototype platforms, and custom peripheral or memory-centric logic functions where compact packaging and predictable routing matter.

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